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    • 4. 发明授权
    • Process for producing multilayer printed wiring board
    • 多层印刷线路板的制造方法
    • US08584352B2
    • 2013-11-19
    • US12869926
    • 2010-08-27
    • Hirohisa NarahashiShigeo NakamuraTadahiko Yokota
    • Hirohisa NarahashiShigeo NakamuraTadahiko Yokota
    • H05K3/02
    • H05K3/4661H05K3/0035H05K3/0038H05K3/025H05K3/181H05K3/381H05K2203/1152
    • Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.
    • 可以通过包括以下步骤(A) - (E)的方法制备能形成在平坦绝缘层表面上的剥离强度优异的导电层的超细布线形成的多层印刷电路板:(A) 通过固化性树脂组合物层在内层电路基板上形成金属膜的金属膜,其中在支撑层上形成金属膜层,或者用金属膜层压粘合膜的步骤,其中可固化 在金属膜的金属膜层上在内层电路基板上形成树脂组合物层; (B)固化树脂组合物层以固化以形成绝缘层的步骤; (C)去除支撑层的步骤; (D)除去金属膜层的工序; 和(E)通过化学镀在绝缘层表面上形成金属膜层的步骤。
    • 7. 发明授权
    • Lever switch device
    • 杠杆开关装置
    • US08269122B2
    • 2012-09-18
    • US12326480
    • 2008-12-02
    • Yusuke KimuraKenpo KurachiShigeo Nakamura
    • Yusuke KimuraKenpo KurachiShigeo Nakamura
    • H01H3/16H01H9/00
    • B60Q1/1469B60Q1/1476
    • A lever switch device, includes a lever main body rotatably supported by a body around a predetermined rotation center axis, a first remote shaft rotatably incorporated in the lever main body, and comprising a first operating knob at one end and a first operation portion at another end for operating an operational object by a rotational operation of the first operating knob, a second remote shaft rotatably arranged in the lever main body with a coaxial structure with the first remote shaft, and includes a second operating knob at one end and a second operation portion at another end for operating an operational object by a rotational operation of the second operating knob. Rotation centers of the first and second operation portions are provided on the rotation center axis of the lever main body.
    • 一种杠杆开关装置,包括:杠杆主体,其主体围绕预定的旋转中心轴线可旋转地支撑,第一远程轴可旋转地结合在杠杆主体中,并且包括一端的第一操作旋钮和另一端的第一操作部 用于通过第一操作旋钮的旋转操作来操作操作对象;第二远程轴,其可旋转地布置在杆主体中,与第一远程轴具有同轴结构,并且在一端包括第二操作旋钮和第二操作 另一端的部分通过第二操作旋钮的旋转操作来操作操作对象。 第一操作部和第二操作部的旋转中心设置在杆主体的旋转中心轴上。
    • 8. 发明申请
    • PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
    • 生产多层印刷线路板的工艺
    • US20100206471A1
    • 2010-08-19
    • US12721891
    • 2010-03-11
    • Shigeo NakamuraSeiichiro OhashiEiichi HayashiTadahiko Yokota
    • Shigeo NakamuraSeiichiro OhashiEiichi HayashiTadahiko Yokota
    • B32B38/10
    • H05K3/4673B32B37/025B32B38/0004B32B2038/0076B32B2305/076B32B2309/02B32B2309/105B32B2309/12B32B2309/68B32B2311/00B32B2457/08H05K3/4644H05K2203/0228H05K2203/066H05K2203/085Y10T29/49155Y10T156/1052Y10T156/1054
    • A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
    • 一种包含以下步骤(1) - (5)的多层印刷线路板的制造方法:(1)临时配合准备步骤,包括从粘合片辊输送粘合片,其中,将具有预浸渍体的粘合片形成在 将支撑膜缠绕在卷筒中并放置粘合片,使得预浸料表面接触电路板的一个或两个表面,(2)临时安装步骤,用于将粘合片临时装配到电路板,包括部分 通过从支撑膜侧加热和压制粘合片的一部分,将粘合片粘合到电路板上,并用切割机根据电路板的尺寸切割粘合片,(3)层压步骤,包括加热和 在减压下按压临时贴合的粘合片以将粘合片层合在电路板上,(4)热固化步骤,包括通过热固化该制备形成绝缘层 (5)包括在热固化步骤之后分离支撑膜的分离步骤,能够连续制备具有预浸料的多层印刷线路板的绝缘层,而不使用单个晶片。