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1. 发明授权

US08357443B2 Laminate including water soluble release layer for producing circuit board and method of producing circuit board 有权
标题翻译：包括用于生产电路板的水溶性释放层和生产电路板的方法的层压板
公开(公告)号：US08357443B2
公开(公告)日：2013-01-22
申请号：US12551802
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B9/00 , B32B33/00 , B32B17/10 , B32B27/08 , G11B11/105 , G11B5/64 , C09J7/02 , H05K1/00 , H05K1/03 , B29C53/82
CPC分类号： H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
摘要翻译：通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性。

2. 发明申请

US20100230382A1 METAL-CLAD LAMINATE 有权
标题翻译：金属层压板
公开(公告)号：US20100230382A1
公开(公告)日：2010-09-16
申请号：US12723165
申请日：2010-03-12
申请人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B44C1/22 , B32B38/10 , C23C14/34 , B32B38/04
CPC分类号： H05K3/381 , H05K3/025 , H05K2203/072 , H05K2203/0786 , H05K2203/1152 , Y10T29/49155
摘要： Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
摘要翻译：在绝缘层的光滑表面上形成具有优良剥离强度的导体层的覆金属层压体可以通过以下方法获得：（A）通过提供一层或多层片材来制备覆金属层压板前体的步骤在支撑层上具有金属膜层的两片薄膜之间的预浸料坯，并且在减压下加热和加压它们;（B）去除支撑层的步骤，（C）去除金属膜层的步骤和（ D）通过化学镀在绝缘层的表面上形成金属膜层的步骤。

3. 发明授权

US08584352B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08584352B2
公开(公告)日：2013-11-19
申请号：US12869926
申请日：2010-08-27
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K3/02
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/0038 , H05K3/025 , H05K3/181 , H05K3/381 , H05K2203/1152
摘要： Multilayer printed wiring boards superior in formation of an ultrafine wiring, which can form a conductive layer superior in peel strength on a flat insulating layer surface, can be prepared by a method including the following steps (A)-(E): (A) a step of laminating a film with a metal film, wherein a metal film layer is formed on a support layer, on an internal-layer circuit substrate via a curable resin composition layer, or laminating an adhesive film with a metal film, wherein a curable resin composition layer is formed on a metal film layer of the film with a metal film, on an internal-layer circuit substrate; (B) a step of curing a curable resin composition layer to form an insulating layer; (C) a step of removing a support layer; (D) a step of removing a metal film layer; and (E) a step of forming a metal film layer on an insulating layer surface by electroless plating.
摘要翻译：可以通过包括以下步骤（A） - （E）的方法制备能形成在平坦绝缘层表面上的剥离强度优异的导电层的超细布线形成的多层印刷电路板：（A）通过固化性树脂组合物层在内层电路基板上形成金属膜的金属膜，其中在支撑层上形成金属膜层，或者用金属膜层压粘合膜的步骤，其中可固化在金属膜的金属膜层上在内层电路基板上形成树脂组合物层; （B）固化树脂组合物层以固化以形成绝缘层的步骤; （C）去除支撑层的步骤; （D）除去金属膜层的工序; 和（E）通过化学镀在绝缘层表面上形成金属膜层的步骤。

4. 发明授权

US08382996B2 Metal-clad laminate 有权
标题翻译：覆金属层压板
公开(公告)号：US08382996B2
公开(公告)日：2013-02-26
申请号：US12723165
申请日：2010-03-12
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H01B13/00
CPC分类号： H05K3/381 , H05K3/025 , H05K2203/072 , H05K2203/0786 , H05K2203/1152 , Y10T29/49155
摘要： Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
摘要翻译：在绝缘层的光滑表面上形成具有优良剥离强度的导体层的覆金属层压体可以通过以下方法获得：（A）通过提供一层或多层片材来制备覆金属层压板前体的步骤在支撑层上具有金属膜层的两片薄膜之间的预浸料坯，并且在减压下加热和加压它们;（B）去除支撑层的步骤，（C）去除金属膜层的步骤和（ D）通过化学镀在绝缘层的表面上形成金属膜层的步骤。

5. 发明申请

US20100044078A1 PROCESS FOR PRODUCING CIRCUIT BOARD 有权
标题翻译：生产电路板的工艺
公开(公告)号：US20100044078A1
公开(公告)日：2010-02-25
申请号：US12551802
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K1/00 , B32B37/00 , B32B33/00
CPC分类号： H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.
摘要翻译：通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性。通过这种方法，可以在表面上形成具有高粘合性和高性能均匀性的金属膜层，而不需要用氧化剂如碱式高锰酸钾溶液等来粗糙化绝缘层的表面。因此，可以在更温和的条件下进行电路形成蚀刻，这又对诸如多层印刷线路板，柔性印刷线路板等的电路板上的微接线提供了优异的效果。

6. 发明申请

US20100040874A1 FILM FOR METAL FILM TRANSFER, METHOD FOR TRANSFERRING METAL FILM AND METHOD FOR MANUFACTURING CIRCUIT BOARD 审中-公开
标题翻译：用于金属膜转移的膜，用于转移金属膜的方法和用于制造电路板的方法
公开(公告)号：US20100040874A1
公开(公告)日：2010-02-18
申请号：US12551776
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B15/09 , B32B15/04 , B32B15/082 , B32B15/20 , B32B38/10
CPC分类号： H05K3/025 , H05K2203/0769 , H05K2203/0786 , Y10T428/265 , Y10T428/266 , Y10T428/31692 , Y10T428/31703
摘要： Films for metal film transfer, which contain (a) a support layer, (b) a release layer formed on the support layer, which is comprised of one or more kinds of water-soluble polymers selected from a water-soluble cellulose resin, a water-soluble polyester resin, and a water-soluble acrylic resin, and (c) a metal film layer formed on the release layer, show superior transferability of the metal film layer. Such films are useful for efficiently producing circuit boards by laminating the film for metal film transfer on a curable resin composition layer on a substrate such that the metal film layer is in contact with a surface of the curable resin composition layer, curing the curable resin composition layer, detaching the support layer, and removing the release layer on the metal film layer by dissolving the release layer in an aqueous solution.
摘要翻译：用于金属膜转移的膜，其包含（a）支撑层，（b）形成在载体层上的剥离层，其由一种或多种选自水溶性纤维素树脂的水溶性聚合物，水溶性聚酯树脂和水溶性丙烯酸树脂，（c）形成在剥离层上的金属膜层，显示出优异的金属膜层的转印性。通过将金属膜转印用膜层叠在基板上的固化性树脂组合物层上，使得金属膜层与固化性树脂组合物层的表面接触，使固化性树脂组合物固化，可以有效地制造电路板通过将剥离层溶解在水溶液中，分离支撑层，以及除去金属膜层上的剥离层。

7. 发明授权

US08992713B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08992713B2
公开(公告)日：2015-03-31
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10 , H05K3/46 , B32B37/00 , B32B38/00
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

8. 发明授权

US06739040B1 Method of manufacturing multilayered printed wiring board using adhesive film 有权
标题翻译：使用粘合膜制造多层印刷线路板的方法
公开(公告)号：US06739040B1
公开(公告)日：2004-05-25
申请号：US09696179
申请日：2000-10-26
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K636
CPC分类号： H05K3/4069 , H05K3/0035 , H05K3/0094 , H05K3/246 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959 , H05K2203/0191 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1383 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled up. This method also involves using an adhesive film to facilitate manufacturing the multilayered printed wiring board having excellent surface smoothness at satisfactory yields.
摘要翻译：本发明涉及一种通过积层系统制造多层印刷线路板的方法，其中导电电路层和绝缘层交替堆叠。该方法还涉及使用粘合膜以便于以令人满意的产率制造具有优异表面平滑度的多层印刷线路板。

9. 发明授权

US08337655B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08337655B2
公开(公告)日：2012-12-25
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

10. 发明授权

US07208062B2 Method of producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US07208062B2
公开(公告)日：2007-04-24
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C09J163/00 , B32B37/14
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting resin composition that has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface which after roughening, allows forming a conductor layer by plating, and is solid at ambient temperature, layer B is a layer of a thermosetting resin composition that has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature, layer A is laminated adjacent to the support base film, and layer B layer has a fluidity that allows the filling of a resin into a through hole and/or a via hole.
摘要翻译：可用于制备层压电路板的粘合膜可以通过将由A层和B层制成的树脂组合物层压在支撑基底膜上来制备，其中层A是具有无机填料的热固性树脂组合物层含量为0〜40重量％以下，具有经粗糙化后的固化表面，可以通过电镀形成导体层，在环境温度下为固体，B层为具有无机填料的热固性树脂组合物层含量为40重量％以上，并且在环境温度下为固体，层A邻近支撑基膜层压，并且层B层具有允许将树脂填充到通孔和/或通孔中的流动性孔。

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