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1. 发明授权

US08533942B2 Production method of multilayer printed wiring board and multilayer printed wiring board 有权
标题翻译：多层印刷线路板和多层印刷线路板的生产方法
公开(公告)号：US08533942B2
公开(公告)日：2013-09-17
申请号：US12275481
申请日：2008-11-21
申请人： Seiichiro Ohashi , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
发明人： Seiichiro Ohashi , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
IPC分类号： H05K3/02 , H05K3/10 , H01K3/10
CPC分类号： H05K3/02 , H05K1/02 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/0055 , H05K3/42 , H05K2203/0796 , Y10T29/49155 , Y10T29/49165
摘要： Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.
摘要翻译：多层印刷线路板可以通过在由浸渍有热固性树脂组合物的玻璃布组成的预浸料形成的绝缘层中通过激光照射形成通孔来制备，并且通过玻璃蚀刻溶液进行玻璃蚀刻处理然后用氧化剂溶液进行去污处理。通过这样的处理，可以充分地抑制玻璃布从通孔的壁面的回蚀现象和过度的突出，并且可以形成高度可靠的通孔。特别地，可以在顶部直径为75μm以下的小通孔中形成高度可靠的通孔。

2. 发明授权

US08992713B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08992713B2
公开(公告)日：2015-03-31
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10 , H05K3/46 , B32B37/00 , B32B38/00
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

3. 发明授权

US08337655B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08337655B2
公开(公告)日：2012-12-25
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

4. 发明申请

US20090133910A1 PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：多层印刷线路板和多层印刷线路板的生产方法
公开(公告)号：US20090133910A1
公开(公告)日：2009-05-28
申请号：US12275481
申请日：2008-11-21
申请人： Seiichiro OHASHI , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
发明人： Seiichiro OHASHI , Eiichi Hayashi , Shigeo Nakamura , Takaaki Yazawa , Junichi Nakamura
IPC分类号： H05K1/00 , B44C1/22 , C25D5/54
CPC分类号： H05K3/02 , H05K1/02 , H05K1/0366 , H05K3/0032 , H05K3/0035 , H05K3/0055 , H05K3/42 , H05K2203/0796 , Y10T29/49155 , Y10T29/49165
摘要： Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below.
摘要翻译：多层印刷线路板可以通过在由浸渍有热固性树脂组合物的玻璃布组成的预浸料形成的绝缘层中通过激光照射形成通孔来制备，并且通过玻璃蚀刻溶液进行玻璃蚀刻处理然后用氧化剂溶液进行去污处理。通过这样的处理，可以充分地抑制玻璃布从通孔的壁面的回蚀现象和过度的突出，并且可以形成高度可靠的通孔。特别地，可以在顶部直径为75μm以下的小通孔中形成高度可靠的通孔。

5. 发明申请

US20130067742A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 审中-公开
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US20130067742A1
公开(公告)日：2013-03-21
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo NAKAMURA , Seiichiro OHASHI , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo NAKAMURA , Seiichiro OHASHI , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： H05K3/10 , B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

6. 发明申请

US20100206471A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US20100206471A1
公开(公告)日：2010-08-19
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

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