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    • 4. 发明授权
    • Laser scan microscope
    • 激光扫描显微镜
    • US6034815A
    • 2000-03-07
    • US267044
    • 1999-03-12
    • Masakazu Shimada
    • Masakazu Shimada
    • G02B21/18G02B6/28G02B21/00G02B21/06G02B6/00G02B21/08
    • G02B21/002G02B6/2804
    • A laser scan microscope comprises a laser scanning observation optical system for irradiating a sample with a laser beam while scanning the beam over the sample, and detecting the beam transmitted through the sample by means of a detector after the beam passes through a condenser lens, an ordinary observation optical system for irradiating the sample through the condenser lens by means of an illumination lamp, so that a transmitted image of the sample is allowed to be observed, and an optical transmission fiber array having a two-pronged structure having a first optical path extending from a condenser lens-side to the detector and a second optical path extending from the condenser lens-side to the illumination lump. The optical transmission fiber array receives a laser beam from the condenser lens-side and introduces the received beam to the detector by use of the first optical path, and the optical transmission fiber array receives light emitted from the illumination lump and introduces the light to the condenser lens by use of the second optical path.
    • 激光扫描显微镜包括激光扫描观察光学系统,用于在扫描样品上的光束的同时照射样品,并在光束通过聚光透镜后通过检测器检测透射通过样品的光束, 普通观察光学系统,用于通过照明灯照射样品通过聚光透镜,使得允许观察样品的透射图像;以及具有双管结构的具有第一光路的光传输光纤阵列 从聚光透镜侧延伸到检测器,以及从聚光透镜侧延伸到照明块的第二光路。 光传输光纤阵列接收来自聚光透镜侧的激光束,并且通过使用第一光路将接收光束引入检测器,并且光传输光纤阵列接收从照明块发射的光并将光引入到 聚光透镜。
    • 9. 发明申请
    • SUBSTRATE PROCESSING APPARATUS, HEATING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • 基板加工装置,加热装置和半导体装置制造方法
    • US20100032425A1
    • 2010-02-11
    • US12429462
    • 2009-04-24
    • Masakazu Shimada
    • Masakazu Shimada
    • F27D11/00
    • H01L21/67109
    • Provided are a substrate processing apparatus, a heating device, and a semiconductor device manufacturing method. The substrate processing apparatus comprises a process chamber configured to process a substrate. A heating element is installed at a peripheral side of the process chamber. An annular inner wall is installed at a peripheral side of the heating element. An annular outer wall is installed at a peripheral side of the inner wall with a space being formed therebetween. An annular cooling member is installed at the space for cooling. An actuating mechanism moves the cooling member between a contact position where the cooling member makes contact with at least one of the inner wall and the outer wall and a non-contact position where the cooling member does not make contact with any one of the inner wall and the outer wall. A control unit controls at least the actuating mechanism.
    • 提供了一种基板处理装置,加热装置和半导体装置的制造方法。 基板处理装置包括被配置为处理基板的处理室。 加热元件安装在处理室的周边。 环形内壁安装在加热元件的周边。 环形外壁安装在内壁的周边,其间形成有空间。 环形冷却件安装在冷却空间。 致动机构使冷却部件在冷却部件与内壁和外壁之中的至少一个接触的接触位置和非接触位置之间移动,其中冷却部件不与内壁 和外墙。 控制单元至少控制致动机构。