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    • 2. 发明申请
    • Ldmos Transistor
    • Ldmos晶体管
    • US20080237705A1
    • 2008-10-02
    • US11997209
    • 2006-08-02
    • Stephan Jo Cecile Henri TheeuwenFreerk Van RijsPetra C.A. Hammes
    • Stephan Jo Cecile Henri TheeuwenFreerk Van RijsPetra C.A. Hammes
    • H01L29/78
    • H01L29/41758H01L21/76895H01L23/4827H01L23/53219H01L29/402H01L29/41725H01L29/4175H01L29/456H01L29/7835H01L2924/0002H01L2924/00
    • The LDMOS transistor (1) of the invention comprises a substrate (2), a gate electrode (10), a substrate contact region (11), a source region (3), a channel region (4) and a drain region (5), which drain region (5) comprises a drain contact region (6) and drain extension region (7). The drain contact region (6) is electrically connected to a top metal layer (23), which extends over the drain extension region (7), with a distance (723) between the top metal layer (23) and the drain extension region (7) that is larger than 2μm. This way the area of the drain contact region (6) may be reduced and the RF power output efficiency of the LDMOS transistor (1) increased. In another embodiment the source region (3) is electrically connected to the substrate contact region (11) via a suicide layer (32) instead of a first metal layer (21), thereby reducing the capacitive coupling between the source region (3) and the drain region (5) and hence increasing the RF power output efficiency of the LDMOS transistor (1) further.
    • 本发明的LDMOS晶体管(1)包括基板(2),栅极电极(10),基板接触区域(11),源极区域(3),沟道区域(4)和漏极区域 ),该漏极区(5)包括漏极接触区(6)和漏极延伸区(7)。 漏极接触区域(6)电连接到在漏极延伸区域(7)上延伸的顶部金属层(23),顶部金属层(23)和漏极延伸区域(23)之间的距离(723) 7)大于2mum。 这样可以减小漏极接触区域(6)的面积,并且增加LDMOS晶体管(1)的RF功率输出效率。 在另一个实施例中,源极区(3)经由硅化物层(32)而不是第一金属层(21)电连接到衬底接触区(11),从而减小源区(3)和 漏极区域(5),从而进一步提高LDMOS晶体管(1)的RF功率输出效率。
    • 3. 发明授权
    • LDMOS transistor
    • LDMOS晶体管
    • US07989879B2
    • 2011-08-02
    • US11995087
    • 2006-07-10
    • Freerk Van RijsStephan J. C. H. TheeuwenPetra C. A. Hammes
    • Freerk Van RijsStephan J. C. H. TheeuwenPetra C. A. Hammes
    • H01L29/78
    • H01L29/0847H01L29/402H01L29/42368H01L29/66659H01L29/7835
    • The LDMOS transistor (1) of the invention comprises a source region (3), a channel region (4), a drain extension region (7) and a gate electrode (10). The LDMOS transistor (1) further comprises a first gate oxide layer (8) and a second gate oxide layer (9), which is thicker than the first gate oxide layer (8). The first gate oxide layer (8) at least extends over a first portion of the channel region (4), which is adjacent to the source region (3). The second gate oxide layer (9) extends over a region where a local maximum (A, B) of the electric field (E) generates hot carriers thereby reducing the impact of the hot carriers and reducing the Idq-degradation. In another embodiment the second gate oxide layer (9) extends over a second portion of the channel region (4), which mutually connects the drain extension region (7) and the first portion of the channel region (4), thereby improving the linear efficiency of the LDMOS transistor (1).
    • 本发明的LDMOS晶体管(1)包括源极区(3),沟道区(4),漏极延伸区(7)和栅电极(10)。 LDMOS晶体管(1)还包括比第一栅极氧化物层(8)厚的第一栅极氧化物层(8)和第二栅极氧化物层(9)。 第一栅极氧化物层(8)至少延伸在与源极区域(3)相邻的沟道区域(4)的第一部分上。 第二栅极氧化物层(9)在电场(E)的局部最大值(A,B))产生热载流子的区域上延伸,从而减少热载流子的影响并降低Idq降解。 在另一个实施例中,第二栅极氧化物层(9)在沟道区域(4)的第二部分上延伸,沟道区域(4)相互连接漏极延伸区域(7)和沟道区域(4)的第一部分,从而改善线性 LDMOS晶体管(1)的效率。
    • 6. 发明授权
    • Semiconductor elements for semiconductor device
    • 半导体元件半导体元件
    • US06437420B1
    • 2002-08-20
    • US09613227
    • 2000-07-10
    • Freerk Van RijsRonald Dekker
    • Freerk Van RijsRonald Dekker
    • H01L27082
    • H01L23/645H01L2224/02381H01L2224/05001H01L2224/05011H01L2224/05023H01L2224/05085H01L2224/05568H01L2224/16H01L2924/01078H01L2924/01079H01L2924/1305H01L2924/3011H01L2924/00
    • The invention relates to a semiconductor device (100) with a semiconductor body (10) comprising at least one semiconductor element (H) with an active area (A) and a coil (20) coupled to said element (H). The coil (20) and a further coil (21) jointly form a transformer (F). The semiconductor body (10) is secured to a carrier plate (30) which comprises an electrically insulating material and is covered with a conductor track (21). According to the invention, the further coil (21) is positioned on the carrier plate (30) and is formed by the conductor track (21) and electrically separated from the coil (20). In this way, a-device (100) is obtained which is easier to manufacture than the known device. Moreover, the communication between the element (H) and the outside world does not involve an electrical coupling and hence, for example, bonding wires, are not necessary. The invention is particularly advantageous for a (discrete) bipolar transistor, which can suitably be used for surface mounting. The invention further comprises an easy method of manufacturing a device (100) according to the invention.
    • 本发明涉及具有半导体本体(10)的半导体器件(100),该半导体本体(10)包括至少一个具有有源区(A)的半导体元件(H)和耦合到所述元件(H)的线圈(20)。 线圈(20)和另外的线圈(21)共同形成变压器(F)。 半导体本体(10)固定在承载板(30)上,承载板(30)包括电绝缘材料并被导体轨道(21)覆盖。 根据本发明,另外的线圈(21)位于承载板(30)上并且由导体轨道(21)形成并与线圈(20)电隔离。 以这种方式,获得比已知装置更容易制造的装置(100)。 此外,元件(H)和外界之间的连通不涉及电耦合,因此例如不需要接合线。 本发明对于可以适当地用于表面安装的(分立的)双极晶体管是特别有利的。 本发明还包括一种制造根据本发明的装置(100)的简单方法。
    • 8. 发明授权
    • Semiconductor device and method of manufacturing same
    • 半导体装置及其制造方法
    • US06355972B1
    • 2002-03-12
    • US09585826
    • 2000-06-01
    • Freerk Van RijsRonald DekkerDave Michel Henrique Hartskeerl
    • Freerk Van RijsRonald DekkerDave Michel Henrique Hartskeerl
    • H01L2970
    • H01L29/42304H01L23/4824H01L29/41708H01L2924/0002H01L2924/00
    • The invention relates to a semiconductor device comprising a bipolar transistor having a collector (1), a base (2) and an emitter (3) at its active area (A). The semiconductor body (10) of the device is covered with an insulating layer (20). At least a part of a base connection conductor (5) and an emitter connection conductor (6) extend over the insulating layer (20) and lead to a base connection area (8) and an emitter connection area (9), respectively. The known transistor is characterized by poor gain, particularly at high frequencies and at high power. A device according to the invention is characterized in that the emitter connection area (8) and the base connection area (9), viewed in projection, are present on the same side of the active area (A), the emitter connection conductor (6) is divided into two or more sub-conductors (6A, 6B) and the base connection conductor (5) is divided into one or more further sub-conductors (5) which are present between the sub-conductors (6A, 6B) and form a co-planar transmission line (T) therewith. In this way, the inductance of the emitter connection conductor (6) is reduced considerably, resulting in a much higher gain, particularly at high frequencies and high power. Preferably, the semiconductor body (A) is interrupted at the area of the transmission line (T) and is glued to an insulating substrate (40).
    • 本发明涉及一种包括在其有源区(A)上具有集电极(1),基极(2)和发射极(3)的双极晶体管的半导体器件。 该器件的半导体本体(10)被绝缘层(20)覆盖。 基极连接导体(5)和发射极连接导体(6)的至少一部分分别延伸到绝缘层(20)上,并分别导向基极连接区域(8)和发射极连接区域(9)。 已知的晶体管的特征在于增益不良,特别是在高频和高功率下。 根据本发明的装置的特征在于,在投影中观察到的发射极连接区域(8)和基座连接区域(9)存在于有源区域(A)的相同侧,发射极连接导体(6) )分成两个或更多个分导体(6A,6B),并且基极连接导体(5)被分成一个或多个另外的分导体(5),它们分别存在于分导体(6A,6B)和 与其形成共面传输线(T)。 以这种方式,发射极连接导体(6)的电感显着降低,导致高得多的增益,特别是在高频和高功率下。 优选地,半导体本体(A)在传输线(T)的区域处被中断,并且被粘合到绝缘衬底(40)上。
    • 9. 发明申请
    • LDMOS TRANSISTOR
    • LDMOS晶体管
    • US20090218622A1
    • 2009-09-03
    • US11995087
    • 2006-07-10
    • Freerk Van RijsStephan J., C., H. TheeuwenPetra C., A. Hammes
    • Freerk Van RijsStephan J., C., H. TheeuwenPetra C., A. Hammes
    • H01L29/78H01L21/336
    • H01L29/0847H01L29/402H01L29/42368H01L29/66659H01L29/7835
    • The LDMOS transistor (1) of the invention comprises a source region (3), a channel region (4), a drain extension region (7) and a gate electrode (10). The LDMOS transistor (1) further comprises a first gate oxide layer (8) and a second gate oxide layer (9), which is thicker than the first gate oxide layer (8). The first gate oxide layer (8) at least extends over a first portion of the channel region (4), which is adjacent to the source region (3). The second gate oxide layer (9) extends over a region where a local maximum (A, B) of the electric field (E) generates hot carriers thereby reducing the impact of the hot carriers and reducing the Idq-degradation. In another embodiment the second gate oxide layer (9) extends over a second portion of the channel region (4), which mutually connects the drain extension region (7) and the first portion of the channel region (4), thereby improving the linear efficiency of the LDMOS transistor (1).
    • 本发明的LDMOS晶体管(1)包括源极区(3),沟道区(4),漏极延伸区(7)和栅电极(10)。 LDMOS晶体管(1)还包括比第一栅极氧化物层(8)厚的第一栅极氧化物层(8)和第二栅极氧化物层(9)。 第一栅极氧化物层(8)至少延伸在与源极区域(3)相邻的沟道区域(4)的第一部分上。 第二栅极氧化物层(9)在电场(E)的局部最大值(A,B))产生热载流子的区域上延伸,从而减少热载流子的影响并降低Idq降解。 在另一个实施例中,第二栅极氧化物层(9)在沟道区域(4)的第二部分上延伸,沟道区域(4)相互连接漏极延伸区域(7)和沟道区域(4)的第一部分,从而改善线性 LDMOS晶体管(1)的效率。
    • 10. 发明授权
    • Protection diode for improved ruggedness of a radio frequency power transistor and self-defining method to manufacture such protection diode
    • 用于改善射频功率晶体管的耐用性的保护二极管和用于制造这种保护二极管的自定义方法
    • US06917077B2
    • 2005-07-12
    • US09972576
    • 2001-10-05
    • Petrus Hubertus Cornelis MagneeFreerk Van RijsHendrik Gezienus Albert Huizing
    • Petrus Hubertus Cornelis MagneeFreerk Van RijsHendrik Gezienus Albert Huizing
    • H01L21/331H01L21/822H01L21/8222H01L27/02H01L27/04H01L27/06H01L29/08H01L29/10H01L29/732H01L29/861H01L31/119
    • H01L29/66287H01L27/0255H01L29/0804H01L29/0821H01L29/8611Y10S438/91
    • A semiconductor arrangement including: a substrate having a substrate layer (13) with an upper and lower surface, the substrate layer (13) being of a first conductivity type; a first buried layer (12) in the substrate, extending along said lower surface below a first portion of said upper surface of said substrate layer (13), and a second buried layer (12) in the substrate, extending along said lower surface below a second portion of said upper surface of said substrate layer (13); a first diffusion (26) in said first portion of said substrate layer (13), being of a second conductivity type opposite to said first conductivity type and having a first distance to said first buried layer (12) for defining a first breakdown voltage between said first diffusion (26) and said first buried layer (12); a second diffusion (45) in said second portion of said substrate layer (13), being of said second conductivity type and having a second distance to said second buried layer (12) for defining a second breakdown voltage between said second diffusion (45) and said second buried layer (12); said first distance being larger than said second distance such that said first breakdown voltage is larger than said second breakdown voltage.
    • 一种半导体装置,包括:具有上表面和下表面的衬底层(13)的衬底,所述衬底层(13)是第一导电类型; 在衬底中的第一掩埋层(12),沿着所述衬底层(13)的所述上表面的第一部分下方的所述下表面延伸,以及在衬底中的第二掩埋层(12),沿着所述衬底的下表面延伸 所述衬底层(13)的所述上表面的第二部分; 在所述衬底层(13)的所述第一部分中的第一扩散(26),其具有与所述第一导电类型相反的第二导电类型,并且具有到所述第一掩埋层(12)的第一距离, 所述第一扩散层(26)和所述第一掩埋层(12); 在所述衬底层(13)的所述第二部分中的第二扩散(45),具有所述第二导电类型并且具有到所述第二掩埋层(12)的第二距离,用于限定所述第二扩散(45)之间的第二击穿电压, 和所述第二掩埋层(12); 所述第一距离大于所述第二距离,使得所述第一击穿电压大于所述第二击穿电压。