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    • 5. 发明授权
    • Vacuum-coated compound body and process for its production
    • 真空镀膜复合体及其生产工艺
    • US5693417A
    • 1997-12-02
    • US445523
    • 1995-05-22
    • Klaus GoedickeGunter HotzschFred FietzkeOlaf ZywitzkiSiegfried SchillerJonathan ReschkeWolfgang Hempel
    • Klaus GoedickeGunter HotzschFred FietzkeOlaf ZywitzkiSiegfried SchillerJonathan ReschkeWolfgang Hempel
    • C23C14/00C23C14/08C23C8/00
    • C23C14/081C23C14/0036Y10T428/24975Y10T428/265
    • Vacuum coated compound body and a process for its production. Such compound bodies, when coated in a known manner, have a carrier of a metal or of an alloy, a layer that is thermally, mechanically and chemically unstable, with their surface showing cracks and being partially porous. These shortcomings are overcome via an improved eco-friendly vacuum deposition process wherein at least one layer of a material having an outer layer is of Al.sub.2 O.sub.3, is applied to the metal or alloy carrier at a maximum of 700.degree. C., with this layer being completely crystalline and comprised of an .alpha.Al.sub.2 O.sub.3 phase and possibly of a .gamma.Al.sub.2 O.sub.3 phase with a (440) texture, having a compressive stress of at least 1 Gpa and a hardness of at least 20 Gpa, with the Al.sub.2 O.sub.3 layer being deposited via reactive magnetron sputtering, wherein the magnetrons are pulse powered, the pulse frequency lies between 20 and 100 Khz, and the deposition rate is at least 1 nm/s, with the compound bodies being utilized for cutting treatments, particularly as drills, milling cutters, reamers, broaches or saw blades.
    • 真空涂层复合体及其生产工艺。 当以已知的方式涂覆时,这种复合体具有金属或合金的载体,即热,机械和化学不稳定的层,其表面显示出裂纹并且是部分多孔的。 通过改进的环保真空沉积工艺克服了这些缺点,其中至少一层具有外层的材料为Al 2 O 3,最多在700℃下施加到金属或合金载体上,该层为 完全结晶并且由αAl 2 O 3相和可能具有(440)织构的γAl 2 O 3相组成,具有至少1Gpa的压缩应力和至少20Gpa的硬度,其中Al 2 O 3层通过反应磁控管沉积 溅射,其中磁控管是脉冲供电的,脉冲频率在20和100KHz之间,并且沉积速率为至少1nm / s,复合体用于切割处理,特别是作为钻头,铣刀,铰刀, 拉刀或锯片。
    • 8. 发明授权
    • Method and device for pre-treatment of substrates
    • 用于预处理底物的方法和装置
    • US6083356A
    • 2000-07-04
    • US91099
    • 1998-09-14
    • Klaus GoedickeFred FietzkeJonathan ReschkeWolfgang HempelBert ScheffelChristoph MetznerSiegfried Schiller
    • Klaus GoedickeFred FietzkeJonathan ReschkeWolfgang HempelBert ScheffelChristoph MetznerSiegfried Schiller
    • C23C14/02H01J37/32B01J19/08
    • H01J37/32018C23C14/022H01J37/34H01J2237/3322
    • Process and apparatus for pre-treatment of a substrate surface in a vacuum by a glow discharge for a subsequent coating process in a vacuum. The process includes maintaining a low pressure glow discharge between the substrate to be pre-treated and a counter-electrode, where the counter-electrode composed of at least a component of the coating to be deposited in the vacuum coating process. The process also includes periodically alternating a polarity of the substrate to act as a cathode or as an anode of the low pressure glow discharge, and individually controlling at least one of pulse length and discharge voltage in both polarities. A frequency of alternation of the polarity is set within a range of between 1 Hz and 1000 kHz. The apparatus includes an evacuatable vacuum chamber, a substrate holder positioned to hold a substrate to be pre-treated, at least one counter-electrode, and an alternating voltage generator coupled to the substrate to be pre-treated and the at least one counter-electrode. The substrate and the counter-electrode are mounted in a potential-free manner.
    • PCT No.PCT / EP96 / 05032 Sec。 371日期:1998年9月14日 102(e)1998年9月14日PCT PCT 1996年11月15日PCT公布。 公开号WO97 / 22988 PCT 日期1997年6月26日用于在真空中通过辉光放电在真空中预处理衬底表面以用于在真空中进行随后的涂覆过程的工艺和设备。 该方法包括保持待预处理的基板和反电极之间的低压辉光放电,其中反电极由真空涂覆工艺中要沉积的涂层的至少一部分组成。 该方法还包括周期性地交替使衬底的极性作为阴极或作为低压辉光放电的阳极,以及分别控制两极性的脉冲长度和放电电压中的至少一个。 极性的交替频率设定在1Hz〜1000kHz的范围内。 该装置包括可抽空的真空室,定位成保持待预处理的基板的基板保持器,至少一个对电极和耦合到待预处理的基板的交流电压发生器, 电极。 基板和对电极以无电势的方式安装。
    • 9. 发明授权
    • Process for ion-supported vacuum coating
    • 离子支持真空镀膜工艺
    • US5846608A
    • 1998-12-08
    • US722024
    • 1996-10-11
    • Manfred NeumannKlaus GoedickeSiegfried SchillerJonathan ReschkeHenry MorgnerFalk MildeFred Fietzke
    • Manfred NeumannKlaus GoedickeSiegfried SchillerJonathan ReschkeHenry MorgnerFalk MildeFred Fietzke
    • H05H1/32C23C14/32C23C14/56H01J37/32H05H1/46C23C14/08
    • H01J37/32422C23C14/32C23C14/562H01J37/32706
    • A process an device for ion-supported vacuum coating. The process and the affiliated device is intended to permit the high-rate ating of large-surfaced, electrically conductive and electrically insulating substrates with electrically insulating and electrically conductive coatings with relatively low expenditure. The substrates are predominantly band-shaped, in particular plastic sheets with widths of over a meter. According to the invention, in an intrinsically known device for vacuum coating, alternating negative and positive voltage pulses are applied to the electrically conductive substrate or in electrically insulating substrates, to an electrode disposed directly behind them, e.g. the cooling roller, relative to the plasma or to an electrode that is disposed almost at plasma potential. The form, the voltage, and the duration of the pulses are adapted to the coating task and the material. The process is used particularly for depositing abrasion protection, corrosion protection, and barrier coatings. The user is the packaging industry, among others.
    • PCT No.PCT / DE95 / 00476 Sec。 371日期:1996年10月11日 102(e)日期1996年10月11日PCT提交1995年4月7日PCT公布。 公开号WO95 / 28508 日期:1995年10月26日一种用于离子支持真空涂层的装置。 该方法和附属装置旨在允许具有相对较低支出的具有电绝缘和导电涂层的大表面,导电和电绝缘基板的高速涂布。 基底主要是带状,特别是宽度超过一米的塑料片。 根据本发明,在本来已知的用于真空涂覆的装置中,将交替的负电压和正电压脉冲施加到导电衬底或电绝缘衬底,直接设置在其后面的电极,例如, 冷却辊相对于等离子体或几乎处于等离子体电位的电极。 脉冲的形式,电压和持续时间适用于涂层任务和材料。 该方法特别用于沉积磨损保护,防腐蚀和阻隔涂层。 用户是包装行业等。
    • 10. 发明授权
    • Process and device for the coating of substrates by means of bipolar pulsed magnetron sputtering and the use thereof
    • 用于通过双极脉冲磁控溅射法涂覆基板的方法和装置及其用途
    • US06620299B1
    • 2003-09-16
    • US09868636
    • 2001-06-27
    • Fred FietzkeKlaus GoedickeSiegfried Schiller
    • Fred FietzkeKlaus GoedickeSiegfried Schiller
    • C23C1434
    • C23C14/352H01J37/3405
    • Process and device for coating substrates utilizing bipolar pulsed magnetron sputtering in the frequency range between 10 and 100 kHz, wherein the device includes at least three magnetron sources. Each of the at least three magnetron sources includes a target. At least two of the targets are connected to a potential-free bipolar power supply device. The at least three targets are arranged relative to the substrates in such a way that the substrates are located at least partially inside a discharge current during a coating of the substrates. A switching device is adapted to connect the targets to the bipolar power supply device. A technological predetermined program is used for controlling the switching device. The switching device connects at least two of the targets at a time to the bipolar power supply device according to the technologically predetermined program.
    • 在10至100kHz的频率范围内使用双极性脉冲磁控溅射涂覆基底的方法和装置,其中该装置包括至少三个磁控管源。 至少三个磁控管源中的每一个包括目标。 至少两个目标连接到无电压双极电源装置。 至少三个目标相对于基板被布置成使得在基板的涂覆期间基板至少部分地位于放电电流的内部。 开关装置适于将目标连接到双极电源装置。 技术预定程序用于控制切换装置。 开关装置根据技术上预定的程序一次将至少两个目标物连接到双极电源装置。