会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • High-power sputtering source
    • 大功率溅射源
    • US09376745B2
    • 2016-06-28
    • US14112618
    • 2012-03-30
    • Siegfried KrassnitzerKurt Ruhm
    • Siegfried KrassnitzerKurt Ruhm
    • C23C14/34C23C14/35H01J37/34
    • C23C14/35C23C14/352H01J37/3405H01J37/3444H01J37/3464H01J37/3467H01J37/3497
    • The invention relates to a magnetron sputtering process that allows material to be sputtered from a target surface in such a way that a high percentage of the sputtered material is provided in the form of ions. According to the invention, said aim is achieved using a simple generator, the power of which is fed to multiple magnetron sputtering sources spread out over several time intervals, i.e. the maximum power is supplied to one sputtering source during one time interval, and the maximum power is supplied to the following sputtering source in the subsequent time interval, such that discharge current densities of more than 0.2 A/cm2 are obtained. The sputtering target can cool down during the off time, thus preventing the temperature limit from being exceeded.
    • 本发明涉及一种磁控溅射工艺,其允许材料以目标表面溅射,使得高比例的溅射材料以离子的形式提供。 根据本发明,使用简单的发生器实现所述目的,其功率被馈送到在多个时间间隔内分布的多个磁控溅射源,即在一个时间间隔期间将最大功率提供给一个溅射源,并且最大值 在随后的时间间隔内向下一个溅射源供电,从而获得大于0.2A / cm 2的放电电流密度。 溅射靶可以在关闭时间内冷却,从而防止超出温度限制。
    • 4. 发明申请
    • HIGH-POWER SPUTTERING SOURCE
    • 大功率溅射源
    • US20140061030A1
    • 2014-03-06
    • US14112618
    • 2012-03-30
    • Siegfried KrassnitzerKurt Ruhm
    • Siegfried KrassnitzerKurt Ruhm
    • C23C14/35
    • C23C14/35C23C14/352H01J37/3405H01J37/3444H01J37/3464H01J37/3467H01J37/3497
    • The invention relates to a magnetron sputtering process that allows material to be sputtered from a target surface in such a way that a high percentage of the sputtered material is provided in the form of ions. According to the invention, said aim is achieved using a simple generator, the power of which is fed to multiple magnetron sputtering sources spread out over several time intervals, i.e. the maximum power is supplied to one sputtering source during one time interval, and the maximum power is supplied to the following sputtering source in the subsequent time interval, such that discharge current densities of more than 0.2 A/cm2 are obtained. The sputtering target can cool down during the off time, thus preventing the temperature limit from being exceeded.
    • 本发明涉及一种磁控溅射工艺,其允许材料以目标表面溅射,使得高比例的溅射材料以离子的形式提供。 根据本发明,使用简单的发生器实现所述目的,其功率被馈送到在多个时间间隔内分布的多个磁控溅射源,即在一个时间间隔期间将最大功率提供给一个溅射源,并且最大值 在随后的时间间隔内向下一个溅射源供电,从而获得大于0.2A / cm 2的放电电流密度。 溅射靶可以在关闭时间内冷却,从而防止超出温度限制。