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    • 7. 发明申请
    • METHOD FOR THE BONDING OF DISK-SHAPED SUBSTRATES AND APPARATUS FOR CARRYING OUT THE METHOD
    • 用于结合盘形基板的方法和实现该方法的装置
    • US20080053620A1
    • 2008-03-06
    • US11934187
    • 2007-11-02
    • Thomas EisenhammerJeff Ou-Yang
    • Thomas EisenhammerJeff Ou-Yang
    • B32B37/00
    • B29C65/7847B29C65/48B29C65/4815B29C65/4845B29C65/485B29C66/001B29C66/1122B29C66/342B29C66/452B29C66/71B29C66/72321B29C66/8322B29C2035/0827B29K2069/00B29L2017/005B32B37/003B32B37/12B32B38/1866B32B2309/06B32B2309/68B32B2429/02G11B7/24038G11B7/26
    • A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facing second bonding surface (12b) to a cover (3) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin (9) is extended through central openings (14a, 14b) of the substrates (11a, 11b) and then retracted with the second substrate (11b) released from the cover (3) and carried by radially extended balls (10). The support pin (9) is lowered to a position where the balls (10), acting against the first bonding surface (12a), deform the first substrate (11a). The first bonding surface (12a) being therefore slightly concave, the first and second bonding surfaces (12a, 12b) only touch close to their circumferences. Retraction of the balls (10) causes a spreading of the contact area radially inwards to cover the first and second bonding surfaces (12a, 12b) without entrapment of non-bonded areas. The substrates (11a, 11b) are then lifted by the support pin (9) with again extended balls (10) and pressed against the cover (3) and the vacuum chamber is aired.
    • 第一衬底(11a)被定位在真空室中的支撑表面(7)上,具有用粘合剂旋涂的朝上的第一接合表面(12a),而第二衬底(11b) 通过抽吸将第二粘合表面(12b)面向盖(3)。 当真空室被抽真空至0.1毫巴和2毫巴之间的压力时,支撑销(9)延伸穿过基板(11a,11b)的中心开口(14a,14b),然后用 所述第二基板(11b)从所述盖(3)释​​放并由径向延伸的滚珠(10)承载。 支撑销(9)下降到使第一接合表面(12a)作用的滚珠(10)使第一基板(11a)变形的位置。 因此,第一接合表面(12a)略微凹入,第一和第二接合表面(12a,12b)仅接近其周长接触。 球(10)的缩回导致接触区域径向向内扩展以覆盖第一和第二接合表面(12a,12b)而不夹带非接合区域。 然后,基板(11a,11b)被支撑销(9)用再次延伸的滚珠(10)提升,并被压靠盖(3)并且真空室被播出。
    • 9. 发明授权
    • Method for the bonding of disk-shaped substrates and apparatus for carrying out the method
    • 用于接合盘状基板的方法和用于实施该方法的装置
    • US07311795B2
    • 2007-12-25
    • US10803400
    • 2004-03-18
    • Thomas EisenhammerJeff Ou-Yang
    • Thomas EisenhammerJeff Ou-Yang
    • B32B37/10
    • B29C65/7847B29C65/48B29C65/4815B29C65/4845B29C65/485B29C66/001B29C66/1122B29C66/342B29C66/452B29C66/71B29C66/72321B29C66/8322B29C2035/0827B29K2069/00B29L2017/005B32B37/003B32B37/12B32B38/1866B32B2309/06B32B2309/68B32B2429/02G11B7/24038G11B7/26
    • A first substrate (11a) is positioned on a support surface (7) in a vacuum chamber with an upward-facing first bonding surface (12a) spin-coated with adhesive while a second substrate (11b) is held with downward-facing second bonding surface (12b) to a cover (3) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin (9) is extended through central openings (14a, 14b) of the substrates (11a, 11b) and then retracted with the second substrate (11b) released from the cover (3) and carried by radially extended balls (10). The support pin (9) is lowered to a position where the balls (10), acting against the first bonding surface (12a), deform the first substrate (11a). The first bonding surface (12a) being therefore slightly concave, the first and second bonding surfaces (12a, 12b) only touch close to their circumferences. Retraction of the balls (10) causes a spreading of the contact area radially inwards to cover the first and second bonding surfaces (12a, 12b) without entrapment of non-bonded areas. The substrates (11a, 11b) are then lifted by the support pin (9) with again extended balls (10) and pressed against the cover (3) and the vacuum chamber is aired.
    • 第一衬底(11a)被定位在真空室中的支撑表面(7)上,具有用粘合剂旋涂的朝上的第一接合表面(12a),而第二衬底(11b) 通过抽吸将第二粘合表面(12b)面向盖(3)。 当真空室被抽真空至0.1毫巴和2毫巴之间的压力时,支撑销(9)延伸穿过基板(11a,11b)的中心开口(14a,14b),然后用 所述第二基板(11b)从所述盖(3)释​​放并由径向延伸的滚珠(10)承载。 支撑销(9)下降到使第一接合表面(12a)作用的滚珠(10)使第一基板(11a)变形的位置。 因此,第一接合表面(12a)略微凹入,第一和第二接合表面(12a,12b)仅接近其周长接触。 球(10)的缩回导致接触区域径向向内扩展以覆盖第一和第二接合表面(12a,12b)而不夹带非接合区域。 然后,基板(11a,11b)被支撑销(9)用再次延伸的滚珠(10)提升,并被压靠盖(3)并且真空室被播出。