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1. 发明申请

US20050199485A1 Method for manufacturing sputter-coated substrates, magnetron source and sputtering chamber with such source 有权
标题翻译：用于制造溅射涂覆的基板，具有这种源的磁控管源和溅射室的方法
公开(公告)号：US20050199485A1
公开(公告)日：2005-09-15
申请号：US10798331
申请日：2004-03-12
申请人： Stanislav Kadlec , Eduard Kugler , Walter Haag
发明人： Stanislav Kadlec , Eduard Kugler , Walter Haag
IPC分类号： H01J37/34 , C23C14/35
CPC分类号： H01J37/3408
摘要： A magnetron source, a magnetron treatment chamber, and a method of manufacturing substrates with a vacuum plasma treated surface, generate and exploit on asymmetrically unbalanced long-range magnetron magnetic field pattern which is swept along the substrate surface for improving the ion density at a substrate surface being vacuum plasma treated. The long-range field reaches the substrate surface with a component of the magnetic field parallel to the substrate surface of at least 0.1, and preferably between 1 and 20, Gauss. The plasma treating can be sputter-coating, or etching, for example.
摘要翻译：磁控管源，磁控管处理室和利用真空等离子体处理表面制造衬底的方法，产生并利用沿着衬底表面扫过的非对称不平衡长程磁控管磁场图案，以改善衬底处的离子密度表面为真空等离子体处理。长距离场到达衬底表面，其中平均于衬底表面的磁场的分量至少为0.1，优选为1至20，高斯。等离子体处理可以是例如溅射涂覆或蚀刻。

2. 发明授权

US06860977B2 Method for manufacturing a workpiece using a magnetron sputter source 有权
标题翻译：使用磁控溅射源制造工件的方法
公开(公告)号：US06860977B2
公开(公告)日：2005-03-01
申请号：US10703217
申请日：2003-11-06
申请人： Bernd Heinz , Martin Dubs , Thomas Eisenhammer , Pius Grunenfelder , Walter Haag , Stanislav Kadlec , Siegfried Krassnitzer
发明人： Bernd Heinz , Martin Dubs , Thomas Eisenhammer , Pius Grunenfelder , Walter Haag , Stanislav Kadlec , Siegfried Krassnitzer
IPC分类号： C23C14/35 , G11B7/26 , H01J37/34
CPC分类号： H01J37/3408
摘要： A workpiece is manufactured using a magnetron source that has an optimized yield of sputtered-off material as well as service life of the target. Good distribution values of the layer on the workpiece are obtained that are stable over the entire target service life, and a concave sputter face in a configuration with small target-to-workpiece distance is combined with a magnet system to form the magnetron electron trap in which the outer pole of the magnetron electron trap is stationary and an eccentrically disposed inner pole with a second outer pole part is rotatable about the central source axis.
摘要翻译：使用具有优化的溅射材料产量以及靶的使用寿命的磁控管源来制造工件。获得在整个目标使用寿命上稳定的工件上的良好的分布值，并且具有小的目标到工件距离的构造中的凹形溅射面与磁体系统组合以形成磁控管电子阱其中磁控管电子阱的外极是静止的，并且具有第二外极部分的偏心设置的内极可以围绕中心源轴线旋转。

3. 发明授权

US6093293A Magnetron sputtering source 失效
标题翻译：磁控溅射源
公开(公告)号：US6093293A
公开(公告)日：2000-07-25
申请号：US26446
申请日：1998-02-19
申请人： Walter Haag , Pius Grunenfelder , Urs Schwendener , Markus Schlegel , Siegfried Krassnitzer
发明人： Walter Haag , Pius Grunenfelder , Urs Schwendener , Markus Schlegel , Siegfried Krassnitzer
IPC分类号： H05H1/24 , C23C14/08 , C23C14/34 , C23C14/35 , H01J37/34 , H01L21/285
CPC分类号： H01J37/3408 , C23C14/35 , H01J37/3452 , H01J2237/3325
摘要： A sputter source has at least two electrically mutually isolated stationary bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each target arrangement may be operated electrically independently from the other target arrangement. Each target arrangement also has a controlled magnet arrangement for generating a time-varying magnetron field upon the respective target arrangement. The magnet arrangements may be controlled independently from each other. The source further has an anode arrangement with anodes alongside and between the target arrangements and/or along smaller sides of the target arrangements.
摘要翻译：溅射源具有至少两个电相互隔离的固定的棒状靶布置，其一个并排安装并且由相应的狭缝分开。每个目标装置包括相应的电垫，使得每个目标装置可以独立于另一个目标装置电动操作。每个目标布置还具有受控的磁体布置，用于在各自的目标布置上产生时变磁控管场。磁体布置可以彼此独立地控制。该源还具有阳极布置，阳极与目标布置之间和目标布置之间和/或沿着目标布置的较小侧面。

4. 发明授权

US5753089A Sputter coating station 失效
标题翻译：溅射涂布站
公开(公告)号：US5753089A
公开(公告)日：1998-05-19
申请号：US673155
申请日：1996-06-25
申请人： Walter Haag
发明人： Walter Haag
IPC分类号： C23C14/34 , C23C14/35 , C23C14/56 , H01J37/34
CPC分类号： H01J37/32779 , H01J37/34 , H01J37/3423
摘要： A sputter coating station has a pair of opposing sputter sources. At least one of the sources encompasses a clear opening through which a workpiece mounting arrangement holding a workpiece can move for positioning the workpiece through the opening. A process for sputter coating workpieces uses the sputter coating station and includes holding the workpiece by a workpiece holder through the opening and into the coating chamber, and coating the workpiece using the sputtering sources.
摘要翻译：溅射涂覆站具有一对相对的溅射源。源中的至少一个包括清洁开口，保持工件的工件安装布置可以移动通过该开口，用于通过开口定位工件。用于溅射涂覆工件的工艺使用溅射涂覆站，并且包括通过工件夹持器将工件保持器穿过开口并进入涂覆室，并使用溅射源涂覆工件。

5. 发明授权

US5490913A Magnetic field enhanced sputtering arrangement with vacuum treatment apparatus 失效
标题翻译：磁场增强溅射装置与真空处理装置
公开(公告)号：US5490913A
公开(公告)日：1996-02-13
申请号：US236535
申请日：1994-05-02
申请人： Roman Schertler , Walter Haag , Peter Kohler
发明人： Roman Schertler , Walter Haag , Peter Kohler
IPC分类号： C23C14/35 , H01J37/34
CPC分类号： H01J37/3455 , H01J37/3405
摘要： A magnetic field enhanced sputtering arrangement and vacuum treatment apparatus includes an arrangement housing, on whose front face is mountable a target arrangement. A magnet carrier arrangement is rotatably supported about an axis in the arrangement housing. Magnetic flux of the magnet carrier penetrates through a region of the mounted target arrangement and the region is shifted through a relative rotational motion. An electric motor drive with a drive housing is connected to the arrangement housing so as to be torsion-tight therewith, and a rotor is rotatably supported in the drive housing, which, in turn, acts upon the magnet carrier arrangement. The drive housing forms the arrangement housing and the rotor is connected to the magnet carrier arrangement so as to be non-rotatable therewith, for a compact construction.
摘要翻译：磁场强化溅射装置和真空处理装置包括一个布置壳体，其前面可安装有目标装置。磁体托架布置围绕布置壳体中的轴线可旋转地支撑。磁体载体的磁通量穿过安装的目标装置的区域，并且该区域通过相对旋转运动而移动。具有驱动器壳体的电动机驱动器与布置壳体连接以便与其扭转紧固，并且转子被可旋转地支撑在驱动壳体中，而转子又作用在磁体载体装置上。驱动器壳体形成布置壳体，并且转子连接到磁体托架布置，从而与其不可旋转，用于紧凑的结构。

6. 发明申请

US20050233089A1 Sputter method or device for the production of natural voltage optimized coatings 审中-公开
标题翻译：用于生产自然电压优化涂层的溅射方法或装置
公开(公告)号：US20050233089A1
公开(公告)日：2005-10-20
申请号：US10515792
申请日：2003-04-30
申请人： Walter Haag
发明人： Walter Haag
IPC分类号： C23C14/34 , H01J37/34 , B05D1/04
CPC分类号： C23C14/34 , H01J37/34
摘要： The invention relates to a method or a device for the production of especially natural voltage optimized coatings, especially low tensile stress coatings, by means of sputter processes, wherein a bipolar voltage shape is produced on the target (cathode). The positive voltage pulse is adjusted on the target in such a way that a bias voltage on the substrate is thus replaced.
摘要翻译：本发明涉及通过溅射工艺生产特别是自然电压优化的涂层，特别是低拉伸应力涂层的方法或装置，其中在目标（阴极）上产生双极电压形状。在目标上调整正电压脉冲，使得由此更换衬底上的偏置电压。

7. 发明授权

US06878248B2 Method of manufacturing an object in a vacuum recipient 失效
标题翻译：在真空接收器中制造物体的方法
公开(公告)号：US06878248B2
公开(公告)日：2005-04-12
申请号：US10388542
申请日：2003-03-17
申请人： Hans Signer , Eduard Kügler , Klaus Wellerdieck , Helmut Rudigier , Walter Haag
发明人： Hans Signer , Eduard Kügler , Klaus Wellerdieck , Helmut Rudigier , Walter Haag
IPC分类号： C23C14/32 , C23C14/54 , C23C16/50 , C23C16/52 , C23F4/00 , H01J37/32 , C23C14/34
CPC分类号： H01J37/32431 , C23C14/32 , C23C14/54 , H01J2237/0206
摘要： A method of manufacturing an object in a vacuum treatment apparatus having a vacuum recipient for containing an atmosphere, includes the steps of supporting a substrate on a work piece carrier arrangement in the recipient and treating the substrate to manufacture the object in the vacuum recipient. The treating process includes generating electrical charge carriers in the atmosphere and in the recipient which are of the type that form electrically insulating material and providing at least two electroconductive surfaces in the recipient. Power, such as a DC signal, is supplied to at least one of the electroconductive surfaces so that at least one of the electroconductive surfaces receives the electrically insulating material for covering at least part of that electroconductive surface. This causes electrical isolation of that electroconductive surface which leads to arcing and damage to the object. A control signal is applied to the electroconductive surfaces during repeating and alternating first time spans and second time spans, for prevent arcing at the part of the electroconductive surfaces which is, or is becoming electrically isolated from the atmosphere by being covered by the electrical charge carriers.
摘要翻译：在具有用于容纳大气的真空接收器的真空处理装置中制造物体的方法包括以下步骤：将基板支撑在接收器中的工件载体装置上，并处理基板以在真空接收器中制造物体。处理方法包括在大气中和接收体中产生形成电绝缘材料并在接受体中提供至少两个导电表面的类型的电荷载体。诸如DC信号的功率被提供给至少一个导电表面，使得至少一个导电表面接收用于覆盖该导电表面的至少一部分的电绝缘材料。这导致该导电表面的电隔离，这导致对物体的电弧和损坏。在重复和交替的第一时间跨度和第二时间跨度期间，控制信号被施加到导电表面，以防止电导体表面的部分电弧通过被电荷载体覆盖或正在与大气电隔离。

8. 发明授权

US06176979B1 Method of manufacturing an object in a vacuum recipient 有权
标题翻译：在真空接收器中制造物体的方法
公开(公告)号：US06176979B1
公开(公告)日：2001-01-23
申请号：US09314333
申请日：1999-05-19
申请人： Hans Signer , Eduard K{umlaut over (u)}gler , Klaus Wellerdieck , Helmut Rudigier , Walter Haag
发明人： Hans Signer , Eduard K{umlaut over (u)}gler , Klaus Wellerdieck , Helmut Rudigier , Walter Haag
IPC分类号： C23C1434
CPC分类号： H01J37/32431 , C23C14/32 , C23C14/54 , H01J2237/0206
摘要： A method of manufacturing an object in a vacuum treatment apparatus having a vacuum recipient for containing an atmosphere, includes the steps of supporting a substrate on a work piece carrier arrangement in the recipient and treating the substrate to manufacture the object in the vacuum recipient. The treating process includes generating electrical charge carriers in the atmosphere and in the recipient which are of the type that form electrically insulating material and providing at least two electroconductive surfaces in the recipient. Power, such as a DC signal, is supplied to at least one of the electroconductive surfaces so that at least one of the electroconductive surfaces receives the electrically insulating material for covering at least part of that electroconductive surface. This causes electrical isolation of that electroconductive surface which leads to arcing and damage to the object. A control signal is applied to the electroconductive surfaces during repeating and alternating first time spans and second time spans, for prevent arcing at the part of the electroconductive surfaces which is, or is becoming electrically isolated from the atmosphere by being covered by the electrical charge carriers.
摘要翻译：在具有用于容纳大气的真空接收器的真空处理装置中制造物体的方法包括以下步骤：将基板支撑在接收器中的工件载体装置上，并处理基板以在真空接收器中制造物体。处理方法包括在大气中和接收体中产生形成电绝缘材料并在接受体中提供至少两个导电表面的类型的电荷载体。诸如DC信号的功率被提供给至少一个导电表面，使得至少一个导电表面接收用于覆盖该导电表面的至少一部分的电绝缘材料。这导致该导电表面的电隔离，这导致对物体的电弧和损坏。在重复和交替的第一时间跨度和第二时间跨度期间，控制信号被施加到导电表面，以防止电导体表面的部分电弧通过被电荷载体覆盖或正在与大气电隔离。

9. 发明授权

US6068742A Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source 失效
标题翻译：具有圆板的目标布置，用于安装目标布置的磁控管，以及通过所述磁控管源涂覆一系列圆形圆形工件的工艺
公开(公告)号：US6068742A
公开(公告)日：2000-05-30
申请号：US701861
申请日：1996-08-23
申请人： Helmut Daxinger , Walter Haag , Eduard Kugler
发明人： Helmut Daxinger , Walter Haag , Eduard Kugler
IPC分类号： C23C14/34 , H01J37/34
CPC分类号： H01J37/3423 , C23C14/3407 , H01J37/3408
摘要： A target arrangement for a sputtering apparatus has a circular plate target with either a circumferential protrusion or recess which is symmetrical about a central plane through the target, the plane being perpendicular to the central axis of the target and located halfway between the top and bottom surfaces of the target. Each surface of the target is composed primarily of sputtering material. A magnetron for use with the target arrangement for easy changing of the target to sputter using the opposite surface of the target is disclosed. A process for using the target arrangement and magnetron assembly to sputter a work piece is also disclosed.
摘要翻译：用于溅射装置的目标装置具有圆形板目标，其具有圆周突起或凹部，所述圆周突起或凹部围绕穿过靶的中心平面对称，该平面垂直于目标的中心轴并且位于顶部和底部表面之间的中间的目标。靶的每个表面主要由溅射材料组成。公开了一种与目标装置一起使用的磁控管，用于使用目标的相对表面容易地改变靶溅射。还公开了使用目标装置和磁控管组件来溅射工件的方法。

10. 发明授权

US4619748A Method and apparatus for the reactive vapor deposition of layers of oxides, nitrides, oxynitrides and carbides on a substrate 失效
标题翻译：氧化物，氮化物，氧氮化物和碳化物层在基底上的反应蒸气沉积的方法和装置
公开(公告)号：US4619748A
公开(公告)日：1986-10-28
申请号：US834757
申请日：1986-02-28
申请人： Eberhard Moll , Hans K. Pulker , Walter Haag
发明人： Eberhard Moll , Hans K. Pulker , Walter Haag
IPC分类号： C23C14/06 , C23C14/32 , C23C15/00
CPC分类号： C23C14/325
摘要： For the vapor deposition of layers of oxides, nitrides, oxynitrides and carbides by ion plating, the surface to be coated is electrically insulated or mounted under insulation and during the coating an electric plasma is maintained in front of the surface to be coated, in such a way that the ion incidence density on the substrate is 0.5 to 2 mA per cm.sup.2 and the surface charges to a potential of -5 to -60 volts. Thereby especially hard and firmly adhering layers are obtained.
摘要翻译：为了通过离子镀将氧化物，氮化物，氮氧化物和碳化物层蒸镀沉积，待涂覆的表面电绝缘或安装在绝缘下，并且在涂覆期间，电等离子体保持在待涂覆表面的前面衬底上的离子入射密度为每平方厘米0.5至2mA并且表面电荷至-5至-60伏电位的方式。从而获得特别坚硬且牢固粘合的层。

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