专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06824343B2 Substrate support 有权
标题翻译：基材支持
公开(公告)号：US06824343B2
公开(公告)日：2004-11-30
申请号：US10084762
申请日：2002-02-22
申请人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
发明人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
IPC分类号： B65G4724
CPC分类号： H01L21/68 , H01L21/68728 , H01L21/68778 , H01L21/68792 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
摘要翻译：通常提供用于支撑衬底的方法和装置。在一个方面，一种用于支撑衬底的装置包括具有靠近其设置的第一主体的支撑板。第一推动构件径向耦合到第一主体并且适于在第一主体旋转时沿平行于支撑板的第一方向推动基板。在另一方面，具有支撑其上放置的基板的基板支撑件的装载锁定室包括移动以致动至少一个对准机构的冷却板。对准机构包括推动构件，其沿朝向支撑件的中心的第一方向推动基板。推动构件可以另外围绕垂直于第一方向的轴旋转。

2. 发明申请

US20050220604A1 Substrate support bushing 有权
标题翻译：基板支撑衬套
公开(公告)号：US20050220604A1
公开(公告)日：2005-10-06
申请号：US11044245
申请日：2005-01-27
申请人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
发明人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
IPC分类号： H01L21/68 , B65G49/06 , C03C17/00 , C23C16/458 , F16C29/00 , F16C29/04 , H01L21/00 , H01L21/205 , H01L21/683 , G01V8/00
CPC分类号： F16C29/046 , B65G49/061 , B65G2249/02 , C03C17/002 , C23C16/4584 , F16C29/045 , H01L21/00
摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.
摘要翻译：提供了一种用于在处理室内支撑衬底的装置。在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。

3. 发明授权

US08216422B2 Substrate support bushing 有权
标题翻译：基板支撑衬套
公开(公告)号：US08216422B2
公开(公告)日：2012-07-10
申请号：US11044245
申请日：2005-01-27
申请人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
发明人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
IPC分类号： C23C16/00 , C23C16/458 , H01L21/3065 , G01V8/00
CPC分类号： F16C29/046 , B65G49/061 , B65G2249/02 , C03C17/002 , C23C16/4584 , F16C29/045 , H01L21/00
摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.
摘要翻译：提供了一种用于在处理室内支撑衬底的装置。在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。

4. 发明申请

US20050180737A1 Substrate support bushing 有权
公开(公告)号：US20050180737A1
公开(公告)日：2005-08-18
申请号：US10779130
申请日：2004-02-12
申请人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
发明人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
IPC分类号： H01L21/68 , B65G49/06 , C03C17/00 , C23C16/458 , F16C29/00 , F16C29/04 , H01L21/00 , H01L21/205 , H01L21/683 , F26B3/30
CPC分类号： F16C29/046 , B65G49/061 , B65G2249/02 , C03C17/002 , C23C16/4584 , F16C29/045 , H01L21/00
摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.

5. 发明授权

US08033245B2 Substrate support bushing 有权
标题翻译：基板支撑衬套
公开(公告)号：US08033245B2
公开(公告)日：2011-10-11
申请号：US10779130
申请日：2004-02-12
申请人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
发明人： Shinichi Kurita , Suhail Anwar , Toshio Kiyotake
IPC分类号： C23C16/50 , C23C16/503 , C23C16/505 , C23C16/458 , C23F1/00 , H01L21/306 , C23C16/06 , C23C16/22 , F16C29/02 , F16C19/00 , F16C19/50 , F16C43/06 , F16C33/38
CPC分类号： F16C29/046 , B65G49/061 , B65G2249/02 , C03C17/002 , C23C16/4584 , F16C29/045 , H01L21/00
摘要： An apparatus for supporting a substrate within a processing chamber is provided. In one aspect, a substrate support member is provided comprising a housing having a bore formed therethrough, a support pin at least partially disposed within the bore, and a plurality of bearing elements disposed about the housing. In one aspect, the bearing elements comprise a roller having a central bore formed therethrough, a contoured outer surface, and a shaft at least partially disposed through the central bore. In another aspect, the bearing elements comprise a ball assembly comprising a larger spherical member and four smaller spherical members arranged about the larger spherical member.
摘要翻译：提供了一种用于在处理室内支撑衬底的装置。在一个方面，提供了一种基板支撑构件，其包括具有穿过其中形成的孔的壳体，至少部分地设置在孔内的支撑销和围绕壳体设置的多个轴承元件。在一个方面，轴承元件包括具有穿过其形成的中心孔的辊，外形轮廓和至少部分地设置穿过中心孔的轴。在另一方面，轴承元件包括球组件，该球组件包括较大球形构件和围绕较大球形构件布置的四个较小球形构件。

6. 发明授权

US07735710B2 Substrate support 失效
标题翻译：基材支持
公开(公告)号：US07735710B2
公开(公告)日：2010-06-15
申请号：US10990094
申请日：2004-11-16
申请人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
发明人： Shinichi Kurita , Wendell T. Blonigan , Suhail Anwar , Toshio Kiyotake , Hung T. Nguyen
IPC分类号： H01L21/68
CPC分类号： H01L21/68 , H01L21/68728 , H01L21/68778 , H01L21/68792 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
摘要翻译：通常提供用于支撑衬底的方法和装置。在一个方面，一种用于支撑衬底的装置包括具有靠近其设置的第一主体的支撑板。第一推动构件径向耦合到第一主体并且适于在第一主体旋转时沿平行于支撑板的第一方向推动基板。在另一方面，具有支撑其上放置的基板的基板支撑件的装载锁定室包括移动以致动至少一个对准机构的冷却板。对准机构包括推动构件，其沿朝向支撑件的中心的第一方向推动基板。推动构件可以另外围绕垂直于第一方向的轴旋转。

7. 发明申请

US20050063800A1 Substrate support 失效
标题翻译：基材支持
公开(公告)号：US20050063800A1
公开(公告)日：2005-03-24
申请号：US10990094
申请日：2004-11-16
申请人： Shinichi Kurita , Wendell Blonigan , Suhail Anwar , Toshio Kiyotake , Hung Nguyen
发明人： Shinichi Kurita , Wendell Blonigan , Suhail Anwar , Toshio Kiyotake , Hung Nguyen
IPC分类号： B65G49/07 , H01L21/205 , H01L21/68 , H01L21/687 , H05K1/14 , B65G1/00
CPC分类号： H01L21/68 , H01L21/68728 , H01L21/68778 , H01L21/68792 , Y10S414/136 , Y10S414/139 , Y10S414/141
摘要： A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
摘要翻译：通常提供用于支撑衬底的方法和装置。在一个方面，一种用于支撑衬底的装置包括具有靠近其设置的第一主体的支撑板。第一推动构件径向耦合到第一主体并且适于在第一主体旋转时沿平行于支撑板的第一方向推动基板。在另一方面，具有支撑其上放置的基板的基板支撑件的装载锁定室包括移动以致动至少一个对准机构的冷却板。对准机构包括推动构件，其沿朝向支撑件的中心的第一方向推动基板。推动构件可以另外围绕垂直于第一方向的轴旋转。

8. 发明授权

US09922854B2 Vertical inline CVD system 有权
公开(公告)号：US09922854B2
公开(公告)日：2018-03-20
申请号：US13098253
申请日：2011-04-29
申请人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
发明人： Shinichi Kurita , Jozef Kudela , Suhail Anwar , John M. White , Dong-Kil Yim , Hans Georg Wolf , Dennis Zvalo , Makoto Inagawa , Ikuo Mori
IPC分类号： C23C16/458 , C23C16/46 , C23C16/511 , C23C16/54 , H01J37/32 , H01L21/67 , H01L21/677
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

9. 发明授权

US09382621B2 Ground return for plasma processes 有权
标题翻译：等离子体工艺的接地回路
公开(公告)号：US09382621B2
公开(公告)日：2016-07-05
申请号：US12700484
申请日：2010-02-04
申请人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
发明人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
IPC分类号： C23C16/509 , C23C16/458 , H01J37/32 , H01L21/67
CPC分类号： C23C16/5096 , C23C16/4585 , H01J37/32091 , H01J37/32174 , H01J37/32568 , H01L21/67069
摘要： A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.
摘要翻译：描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF器件中的一个或两个的位移电极实现接地返回路径，耦合到腔室的底部的RF器件和电极或其组合。

10. 发明授权

US08070408B2 Load lock chamber for large area substrate processing system 有权
标题翻译：负载锁定室用于大面积基板处理系统
公开(公告)号：US08070408B2
公开(公告)日：2011-12-06
申请号：US12199341
申请日：2008-08-27
申请人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
发明人： Mehran Behdjat , Shinichi Kurita , Makoto Inagawa , Suhail Anwar
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。负载锁定室可以具有一个或多个单独的环境隔离环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的拐角处。当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。因此，可能降低衬底污染。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式