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    • 6. 发明授权
    • Plasma uniformity control by gas diffuser hole design
    • 通过气体扩散器孔设计的等离子体均匀性控制
    • US08083853B2
    • 2011-12-27
    • US10889683
    • 2004-07-12
    • Soo Young ChoiJohn M. WhiteQunhua WangLi HouKi Woon KimShinichi KuritaTae Kyung WonSuhail AnwarBeom Soo ParkRobin L. Tiner
    • Soo Young ChoiJohn M. WhiteQunhua WangLi HouKi Woon KimShinichi KuritaTae Kyung WonSuhail AnwarBeom Soo ParkRobin L. Tiner
    • C23C16/00C23C16/455H01L21/3065
    • H01J37/3244C23C16/345C23C16/455C23C16/45565C23C16/5096H01J37/32082H01J37/32091H01J37/32541H01J37/32596H01J2237/327H01J2237/3321H01J2237/3323H01J2237/3325Y10T29/49885Y10T29/49996
    • Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.
    • 提供了用于在处理室中分配气体的气体扩散板的实施例。 气体分配板包括具有上游侧和下游侧的扩散板,以及在扩散板的上游侧和下游侧之间通过的多个气体通路。 气体通道包括在下游侧的中空阴极腔,以增强等离子体电离。 延伸到下游端的气体通道的空心阴极腔的深度,直径,表面积和密度可以从扩散板的中心到边缘逐渐增加,以改善衬底上的膜厚度和性能均匀性 。 从扩散板的中心到边缘的直径,深度和表面积的增加可以通过向下游侧弯曲扩散板,然后在凸出的下游侧加工出来。 扩散板的弯曲可以通过热处理或真空工艺来实现。 从扩散板的中心到边缘的直径,深度和表面积的增加也可以用计算机数字控制加工。 具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加,深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。
    • 7. 发明申请
    • Multiple Slot Load Lock Chamber and Method of Operation
    • 多槽负载锁定室和操作方法
    • US20100139889A1
    • 2010-06-10
    • US12709713
    • 2010-02-22
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • H01L21/677F28F13/00
    • H01L21/67201C23C14/566H01L21/67109H01L21/67126H01L21/67167H01L21/67178H01L21/6719H01L21/67742H01L21/67751Y10S414/139
    • Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    • 本发明的实施例包括负载锁定室,具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中,该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中,该方法包括将基底从传递腔转移到形成在腔体中的加热腔,以及加热加热腔中的基底。 在另一个实施例中,负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中,并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
    • 10. 发明申请
    • LOAD LOCK CHAMBER WITH HEATER IN TUBE
    • 带加热器的管路箱
    • US20080118236A1
    • 2008-05-22
    • US11782290
    • 2007-07-24
    • Suhail AnwarJae-Chull LeeShinichi Kurita
    • Suhail AnwarJae-Chull LeeShinichi Kurita
    • H01L21/00H05B3/14H05B31/08
    • H01L21/67115C23C16/54H01L21/67201
    • Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
    • 本发明的实施例包括加热的负载锁定室。 在一个实施例中,加热的负载锁定室包括具有至少部分地设置在其中的多个灯组件的室主体。 每个灯组件包括容纳灯的透射管。 透射管延伸到室主体中并提供将灯隔离到负载锁定室的内部空间的压力屏障。 在另一个实施例中,透射管的开口端延伸穿过腔体的侧壁。 透射管的封闭端被室主体的内部空间包围,并以间隔的关系支撑在腔室主体的顶部下方。 管的开口端被密封到腔体的侧壁,使得管的内部对大气敞开。