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    • 5. 发明授权
    • Semiconductor absolute pressure transducer assembly and method
    • 半导体绝对压力传感器组件及方法
    • US4291293A
    • 1981-09-22
    • US76813
    • 1979-09-19
    • Kazuji YamadaSeiko SuzukiMotohisa NishiharaKanji KawakamiHideo SatoShigeyuki KoboriRyosaku KanzawaMinoru TakahashiHitoshi Minorikawa
    • Kazuji YamadaSeiko SuzukiMotohisa NishiharaKanji KawakamiHideo SatoShigeyuki KoboriRyosaku KanzawaMinoru TakahashiHitoshi Minorikawa
    • G01L9/04G01L9/00H01L23/08H01L29/84G01L1/22
    • G01L9/0042G01L9/0054
    • A semiconductor pressure transducer assembly comprising a silicon diaphragm assembly and a glass covering member. The silicon diaphragm assembly has a circular diaphragm portion of thin silicon which is formed using etching, and a thick supporting portion therearound. Piezoresistive elements of a piezoresistive bridge circuit and conducting paths for electrically connection thereof are formed on the silicon diaphragm assembly. On a surface of the silicon diaphragm assembly, a passivating layer of silicon dioxide are formed in uniform thickness, and further on a surface of the passivating layer is formed a layer of polysilicon on the supporting portion of the silicon diaphragm assembly. In the passivating layer, a contacting window is formed, through which the polysilicon layer is electrically connected to the silicon diaphragm assembly. The covering member of borosilicate glass having a circular well is mounted and bonded onto the silicon diaphragm assembly in contact with the polysilicon layer using Anodic Bonding method. And the processed silicon diaphragm assembly has a flat surface thereof, on which the piezoresistive elements and the conducting paths are constructed using Ion Implantation method, or reforming a silicon dioxide layer thereon after removing another silicon dioxide layer used as mask in diffusing process.
    • 一种半导体压力传感器组件,包括硅膜组件和玻璃覆盖件。 硅膜组件具有通过蚀刻形成的薄硅的圆形隔膜部分和其周围的厚的支撑部分。 在硅膜组件上形成压阻电桥电路的压阻元件和用于电连接的导电路径。 在硅膜组件的表面上形成均匀厚度的二氧化硅钝化层,并且在钝化层的表面上进一步在硅膜组件的支撑部分上形成多晶硅层。 在钝化层中,形成接触窗,多晶硅层通过该接触窗电连接到硅膜组件。 使用阳极接合方法将具有圆形孔的硼硅酸盐玻璃的覆盖部件安装并接合到与硅多晶硅层接触的硅膜组件上。 并且经处理的硅膜组件具有平坦的表面,在其上使用离子注入方法构建压阻元件和导电路径,或者在去除扩散过程中用作掩模的另一二氧化硅层之后重新形成二氧化硅层。
    • 6. 发明授权
    • Two-wire communication system
    • 双线通信系统
    • US4737787A
    • 1988-04-12
    • US919764
    • 1986-10-16
    • Yukio ItoKazuji YamadaYasushi ShimizuShigeyuki Kobori
    • Yukio ItoKazuji YamadaYasushi ShimizuShigeyuki Kobori
    • H04J99/00G08C19/02H04B3/50H04B3/54H04L5/16G08C19/16
    • G08C19/02H04B3/548H04L5/16H04B2203/5408H04B2203/5458H04B2203/547
    • A two-wire communication system comprising a transmitting unit having constant current characteristics for controlling an output current thereof on the basis of a signal supplied from a sensor, a receiving unit for receiving a control signal to control the sensor, a load resistor and power supply connected in series with the transmitting unit via a two-wire transmission path, and a communication unit so connected in parallel to the load resistor as to convey the output current of the transmitting unit to the process side and control a current from the power supply transmitted onto the transmission path on the basis of information supplied from the process side. With this configuration, a communication system is provided which makes possible replacing process variable transmitters in a conventional analog control system or installing process variable transmitters in a new analog control system, which makes possible remotely setting and adjusting the transmitter function by the communication unit in the above described system, which makes it possible for the control computer to control as far as terminals, and which facilitates digitization of the system.
    • 一种双线通信系统,包括具有恒定电流特性的发送单元,用于基于从传感器提供的信号来控制其输出电流;接收单元,用于接收控制信号以控制传感器;负载电阻器和电源 通过双线传输路径与发射单元串联连接,以及与负载电阻并联连接的通信单元,以将发送单元的输出电流传送到处理侧,并控制来自发送的电源的电流 基于从处理侧提供的信息到传输路径上。 利用这种配置,提供了一种通信系统,其使得可以在常规模拟控制系统中替换过程变量发射机或在新的模拟控制系统中安装过程变量发射机,这使得可以通过通信单元远程设置和调整发射机功能 上述系统,这使得控制计算机可以控制到终端,并且有助于系统的数字化。
    • 9. 发明授权
    • Semiconductor strain gauge
    • 半导体应变计
    • US4404539A
    • 1983-09-13
    • US236934
    • 1981-02-23
    • Kazuji YamadaMotohisa NishiharaHideo SatoSeiko SuzukiRyoichi Kobayashi
    • Kazuji YamadaMotohisa NishiharaHideo SatoSeiko SuzukiRyoichi Kobayashi
    • G01L9/04G01L9/00G01L9/06H01L29/84G01L1/22
    • G01L9/0054G01L9/065
    • A semiconductor strain gauge is arranged as a bridge having four piezoresistive elements which each include a low impurity concentration diffused portion and a heavily-doped diffused portion. The resistance values of the two low impurity concentration diffused portions opposite each other in the bridge are greater than the resistance values of the other two lower impurity concentration portions. The resistances of the heavily-doped diffused portion are selected so that the resistance of the piezoresistive elements are equal. However, by virtue of the fact that the resistance temperature coefficient of the low impurity portions are greater than the resistance temperature coefficients of the high impurity portions, the overall resistance temperature coefficients of the bridge arms will be different. This permits the zero-point voltage of the bridge to always increase with an increase in temperature.
    • 半导体应变仪布置为具有四个压阻元件的桥,每个压阻元件包括低杂质浓度扩散部分和重掺杂扩散部分。 在桥中彼此相对的两个低杂质浓度扩散部分的电阻值大于其它两个较低杂质浓度部分的电阻值。 选择重掺杂扩散部分的电阻,使得压阻元件的电阻相等。 然而,由于低杂质部分的电阻温度系数大于高杂质部分的电阻温度系数,所以桥臂的整体电阻温度系数将不同。 这允许桥接器的零点电压总是随着温度的升高而增加。
    • 10. 发明授权
    • Constant current source device having a ratio metricity between supply
voltage and output current
    • 恒流源装置具有电源电压和输出电流之间的比率
    • US4591780A
    • 1986-05-27
    • US559467
    • 1983-12-08
    • Kazuji YamadaRyoichi KobayashiYasuo NagaiIsao ShimizuKanji Kawakami
    • Kazuji YamadaRyoichi KobayashiYasuo NagaiIsao ShimizuKanji Kawakami
    • H03F3/343G05F3/26G05F3/30H03F3/34H03F3/347G05F3/20
    • G05F3/30G05F3/265
    • A current source device controls a rate of change of current flowing through a load so that the change rate of the current is equal to a change rate of a fluctuating supply voltage. A first transistor is fed with the supply voltage via a first resistor connected to its collector and a second resistor connected to its emitter. A second transistor has a base connected to a base of the first transistor, an emitter connected to a third resistor and a collector connected to a load. A current to the load is fed from the supply voltage via the load, the collector and emitter of the second transistor and the third resistor. The collector and base of the first transistor are respectively connected to a base and an emitter of a third transistor having a collector fed with the supply voltage. The ratio between a voltage drop caused across the second resistor by a reference current flowing through the first resistor, the collector and emitter of the first transistor and the second resistor, and a voltage drop caused across the third resistor by an emitter current of the second transistor, which is substantially equal to a collector current of the second transistor flowing through the load, is set to a predetermined value. The emitter area of the second transistor is enlarged beyond that of the first transistor to obtain a sufficiently large output current.
    • 电流源装置控制流过负载的电流的变化率,使得电流的变化率等于电源电压波动的变化率。 第一晶体管经由连接到其集电极的第一电阻器和连接到其发射极的第二电阻器馈送电源电压。 第二晶体管具有连接到第一晶体管的基极的基极,连接到第三电阻器的发射极和连接到负载的集电极。 通过负载,第二晶体管的集电极和发射极以及第三电阻从供电电压馈送到负载的电流。 第一晶体管的集电极和基极分别连接到具有馈送有电源电压的集电极的第三晶体管的基极和发射极。 通过流过第一电阻器的参考电流,第一晶体管的集电极和发射极以及第二电阻器在第二电阻器之间引起的电压降之间的比率以及由第二电阻器的发射极电流引起的第三电阻器的电压降 基本上等于流过负载的第二晶体管的集电极电流的晶体管被​​设定为预定值。 第二晶体管的发射极面积比第一晶体管的发射极面积增大,以获得足够大的输出电流。