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1. 发明授权

US06588647B2 Liquid cooled circuit device and a manufacturing method thereof 失效
公开(公告)号：US06588647B2
公开(公告)日：2003-07-08
申请号：US10228295
申请日：2002-08-27
申请人： Kazuji Yamada , Akihiro Tamba , Takayoshi Nakamura , Ryuichi Saito , Toshio Ogawa , Hisanori Okamura
发明人： Kazuji Yamada , Akihiro Tamba , Takayoshi Nakamura , Ryuichi Saito , Toshio Ogawa , Hisanori Okamura
IPC分类号： B23K2012
CPC分类号： H05K7/20872 , H01L2924/0002 , H05K7/20927 , Y10T29/49126 , Y10T29/4913 , Y10T29/4935 , H01L2924/00
摘要： A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.

2. 发明授权

US5097318A Semiconductor package and computer using it 失效
标题翻译：半导体封装和使用它的计算机
公开(公告)号：US5097318A
公开(公告)日：1992-03-17
申请号：US331802
申请日：1989-04-03
申请人： Akira Tanaka , Kazuji Yamada , Hirokazu Inoue , Hideo Arakawa , Masahide Okamoto
发明人： Akira Tanaka , Kazuji Yamada , Hirokazu Inoue , Hideo Arakawa , Masahide Okamoto
IPC分类号： H01L23/538 , H01L23/04 , H01L23/057 , H01L23/12 , H01L23/467 , H01L23/498 , H01L23/50
CPC分类号： H01L23/49822 , H01L23/057 , H01L23/467 , H01L23/49838 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107
摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on its inner surface. The electrodes on the insulating base substrate and those on the insulating cap substrate are connected with each other by using conductive material such as bumps.
摘要翻译：一种用于半导体器件的降空型封装，包括其上安装有半导体器件（1）的绝缘基底（6）和在其外表面上具有多个外连接端子（5）的另一绝缘帽衬底（8）其中电极（11）设置在导电层（4）上，用于在其内表面上导电。绝缘基底基板上的电极和绝缘帽基板（8）上的电极通过诸如凸块的导电材料相互连接。

3. 发明授权

US5095359A Semiconductor package and computer using the package 失效
标题翻译：使用封装的半导体封装和计算机
公开(公告)号：US5095359A
公开(公告)日：1992-03-10
申请号：US413622
申请日：1989-09-28
申请人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
发明人： Akira Tanaka , Hirokazu Inoue , Kazuji Yamada , Kunio Miyazaki , Osamu Miura , Hideo Arakawa , Hiroshi Yokoyama , Yoshio Naganuma , Atsushi Morihara , Katsunori Ouchi
IPC分类号： G06F1/18 , H01L21/60 , H01L23/057 , H01L23/467 , H01L23/498 , H01L23/50 , H01L25/065
CPC分类号： H01L23/467 , H01L23/057 , H01L23/49822 , H01L23/50 , H01L24/32 , H01L25/0655 , H01L2224/16225 , H01L2224/32188 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/73253 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/30107
摘要： A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

4. 发明授权

US4670969A Method of making silicon diaphragm pressure sensor 失效
标题翻译：制造硅膜压力传感器的方法
公开(公告)号：US4670969A
公开(公告)日：1987-06-09
申请号：US694990
申请日：1985-01-25
申请人： Kazuji Yamada , Yutaka Kobayashi , Kanji Kawakami , Satoshi Shimada , Masanori Tanabe , Shigeyuki Kobori
发明人： Kazuji Yamada , Yutaka Kobayashi , Kanji Kawakami , Satoshi Shimada , Masanori Tanabe , Shigeyuki Kobori
IPC分类号： H01L29/84 , G01L9/00 , G01P15/08 , H01L21/428
CPC分类号： G01L9/0042 , G01P15/0802 , G01P2015/084 , Y10S148/012 , Y10S148/159 , Y10S148/168 , Y10T29/42 , Y10T29/49103
摘要： A method of making a silicon diaphragm pressure sensor includes forming an oxide film on one surface of a monocrystalline silicon substrate. A polycrystalline silicon layer is formed on the oxide film. The oxide film may be partly removed before the formation of the polycrystalline silicon layer. The polycrystalline silicon layer is heated and melt to recrystallize the same, thereby converting the polycrystalline silicon layer into a monocrystalline silicon layer. On the monocrystalline silicon layer may be epitaxially grown an additional monocrystalline silicon layer. By using the oxide film as an etching stopper, a predetermined portion of the substrate is etched over a range from the other surface of the substrate to the oxide film, thereby providing a diaphragm of the pressure sensor.
摘要翻译：制造硅膜压力传感器的方法包括在单晶硅衬底的一个表面上形成氧化膜。在氧化物膜上形成多晶硅层。在形成多晶硅层之前可以部分地去除氧化膜。将多晶硅层加热熔化，使其重结晶，从而将多晶硅层转化为单晶硅层。在单晶硅层上可以外延生长另外的单晶硅层。通过使用氧化膜作为蚀刻停止层，在从衬底的另一个表面到氧化膜的范围内蚀刻衬底的预定部分，从而提供压力传感器的隔膜。

5. 发明授权

US4527428A Semiconductor pressure transducer 失效
标题翻译：半导体压力传感器
公开(公告)号：US4527428A
公开(公告)日：1985-07-09
申请号：US442665
申请日：1982-12-30
申请人： Satoshi Shimada , Kazuji Yamada , Seikou Suzuki , Shigeyuki Kobori , Motohisa Nishihara
发明人： Satoshi Shimada , Kazuji Yamada , Seikou Suzuki , Shigeyuki Kobori , Motohisa Nishihara
IPC分类号： G01L9/00 , G01L13/02 , G01L9/06
CPC分类号： G01L19/147 , G01L13/025 , G01L19/0038 , G01L19/0645 , G01L9/0054
摘要： A semiconductor pressure transducer including a measuring diaphragm of semiconductor material for sensing pressure supported by a support member of the same material. An oxide layer and a thin glass layer are interposed between the measuring diaphragm and the support member.
摘要翻译：一种半导体压力传感器，包括用于感测由相同材料的支撑构件支撑的压力的半导体材料的测量膜。氧化层和薄玻璃层介于测量膜片和支撑件之间。

6. 发明授权

US4065971A Semiconductor pressure transducer 失效
标题翻译：半导体压力传感器
公开(公告)号：US4065971A
公开(公告)日：1978-01-03
申请号：US701531
申请日：1976-07-01
申请人： Michitaka Shimazoe , Kousuke Nakamura , Yasuo Matsushita , Satoshi Shimada , Kazuji Yamada , Yukio Takahashi
发明人： Michitaka Shimazoe , Kousuke Nakamura , Yasuo Matsushita , Satoshi Shimada , Kazuji Yamada , Yukio Takahashi
IPC分类号： H01L29/84 , G01L9/00 , G01L9/06
CPC分类号： G01L9/0054
摘要： A semiconductor pressure transducer includes a monocrystalline semiconductor diaphragm, the outer edges of which are fixed. When subjected to pressure, the transducer produces radial strains of opposite polarity in a central portion thereof and a portion surrounding the central portion close to the edge of the strain inducing region. The diaphragm contains a plurality of elongated resistances formed of semiconductor material of the same conductivity type which are electrically isolated from the diaphragm, per se. Resistances of an individual set which lie in proximity to one another are combined in the form of a bridge. The longitudinal direction of resistances forming one set of opposing arms of the bridge extend along axes of the same crystal system as the longitudinal direction of the elongated resistances forming the other set of opposing arms of the bridge. However, the longitudinal directions of the separate sets of resistances forming the opposing arms of the bridge lie in directions so that they do not orthogonally intersect each other.
摘要翻译：半导体压力传感器包括其外边缘固定的单晶半导体膜片。当经受压力时，换能器在其中心部分产生相反极性的径向应变，并且围绕中心部分的部分靠近应变诱导区域的边缘产生。隔膜包含由与膜片电气隔离的相同导电类型的半导体材料形成的多个细长电阻。位于彼此靠近的单个组的电阻以桥的形式组合。形成桥的一组相对臂的电阻的纵向方向沿与构成桥的另一组相对臂的细长电阻的纵向相同的晶体系的轴线延伸。然而，形成桥的相对臂的单独的电阻组的纵向方向在方向上，使得它们不会彼此正交相交。

7. 发明授权

US06353258B1 Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US06353258B1
公开(公告)日：2002-03-05
申请号：US09603966
申请日：2000-06-26
申请人： Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
发明人： Hirokazu Inoue , Ryuichi Saito , Mutsuhiro Mori , Yasutoshi Kurihara , Jin Onuki , Shin Kimura , Satoshi Shimada , Kazuhiro Suzuki , Yukio Kamita , Isao Kobayashi , Kazuji Yamada , Naohiro Momma
IPC分类号： H01L2334
CPC分类号： H01L23/5386 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48699 , H01L2224/48747 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/16151 , H01L2924/16315 , H01L2924/181 , H01L2924/2076 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.
摘要翻译：半导体模块具有安装在基板上的多个功率半导体器件，并且用于布线的金属箔安装在基板上，从而形成半导体器件的不对称单元布置。在该装置中，所有单元在基板上沿相同的方向排列，并且所有单元与电极端子脚电连接，并且电极端子脚与联动端子脚电连接。电极端子脚以一定间隔设置。

8. 发明授权

US06313598B1 Power semiconductor module and motor drive system 有权
标题翻译：功率半导体模块和电机驱动系统
公开(公告)号：US06313598B1
公开(公告)日：2001-11-06
申请号：US09463591
申请日：2000-01-28
申请人： Akihiro Tamba , Toshio Ogawa , Kazuji Yamada
发明人： Akihiro Tamba , Toshio Ogawa , Kazuji Yamada
IPC分类号： H01L2504
CPC分类号： H01L25/04 , H01L23/3107 , H01L23/4334 , H01L23/49575 , H01L25/165 , H01L2224/45124 , H01L2224/45144 , H01L2224/48137 , H01L2924/10253 , H01L2924/13055 , H01L2924/181 , H01L2924/19041 , H05K1/144 , H05K3/202 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A power semiconductor module comprising a power semiconductor element included in a power circuit portion and mounted on a metal base, a first resin molded to the power semiconductor element, a control circuit element disposed on the first resin and included at least in a portion of the control circuit, and a control terminal connected to the power circuit portion and having an exposed portion thereof in the surface of the first resin, in which a portion of the control circuit is connected with the power circuit portion at the exposed portion of the control terminal. Accordingly, a resin mold type power semiconductor module capable of realizing a high performance of the control circuit portion at low cost can be realized.
摘要翻译：一种功率半导体模块，包括功率电路部分中的功率半导体元件，其安装在金属基底上，模制到功率半导体元件的第一树脂，设置在第一树脂上的控制电路元件，至少包括控制电路和连接到电源电路部分的控制端子，并且在第一树脂的表面中具有暴露部分，其中控制电路的一部分与控制端子的暴露部分处的电源电路部分连接。因此，可以实现能够以低成本实现控制电路部分的高性能的树脂模具型功率半导体模块。

9. 发明授权

US5956231A Semiconductor device having power semiconductor elements 失效
标题翻译：具有功率半导体元件的半导体器件
公开(公告)号：US5956231A
公开(公告)日：1999-09-21
申请号：US539075
申请日：1995-10-04
申请人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
发明人： Kazuji Yamada , Akira Tanaka , Ryuichi Saito , Yasutoshi Kurihara , Tadao Kushima , Takashi Haramaki , Yoshihiko Koike , Takashi Hosokawa , Mamoru Sawahata , Masahiro Koizumi , Jin Onuki , Kazuhiro Suzuki , Isao Kobayashi , Hideo Shimizu , Yutaka Higashimura , Shigeki Sekine , Nobuya Koike , Hideya Kokubun
IPC分类号： H01L23/049 , H01L23/495 , H01L25/065 , H02M7/00 , H05K7/02 , H05K7/04
CPC分类号： H01L23/49562 , H01L23/049 , H01L24/49 , H01L25/0655 , H01L25/072 , H01L25/18 , H02M7/003 , H01L2224/32225 , H01L2224/45015 , H01L2224/451 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49171 , H01L2224/4943 , H01L2224/49431 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2924/2076 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351
摘要： A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.
摘要翻译：一种半导体器件，其中多个半导体元件被结合到绝缘体衬底上的至少一个电极图案上，所述绝缘体衬底在主表面上形成多个电极图案，所述半导体元件的每个电极电连接到所述电极图案，绝缘体基板的另一表面被结合到散热基底上，散热基座的上表面覆盖有用于从外部环境切断半导体元件的构件，将绝缘体基板上的电极与电极电连接的端子设置在切断部件外侧，散热基体的材料的线膨胀系数大于半导体元件的线膨胀系数，小于半导体元件的线膨胀系数的3倍，导热系数大于100 W / mK，半音电感元件布置在至少一个电极表面上，并且在至少两个区域中被绝缘体基底上的另一个电极表面分隔。

10. 发明授权

US5920119A Power semiconductor module employing metal based molded case and screw fastening type terminals for high reliability 失效
标题翻译：功率半导体模块采用金属模制外壳和螺丝紧固型端子，以实现高可靠性
公开(公告)号：US5920119A
公开(公告)日：1999-07-06
申请号：US802988
申请日：1997-02-21
申请人： Akihiro Tamba , Kazuji Yamada , Ruichi Saito , Tatsuya Shigemura , Yukio Sonobe , Masataka Sasaki , Kazuhiro Suzuki
发明人： Akihiro Tamba , Kazuji Yamada , Ruichi Saito , Tatsuya Shigemura , Yukio Sonobe , Masataka Sasaki , Kazuhiro Suzuki
IPC分类号： H01L25/07 , H01L25/18 , H01L23/12 , H01L23/08 , H01L23/48
CPC分类号： H01L25/18 , H01L25/072 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L24/45 , H01L2924/01004 , H01L2924/01013 , H01L2924/01014 , H01L2924/0105 , H01L2924/01057 , H01L2924/01322 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/30107
摘要： A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.
摘要翻译：一种功率半导体模块，具有电源电路单元; 用于密封模块底部的金属底座; 用于将金属基底与电力电路单元电绝缘的绝缘基板; 连接到电源电路单元的外部输入和输出端子; 其中通过一体成型插入外部输入和输出端子的树脂壳体; 树脂密封剂材料的可靠性大大提高，通过设置与树脂壳体一体模制的螺母，用螺钉固定外部输入和输出端子; 通过一体成型插入树脂壳体中的金属基座; 以及凹部，用于接收位于螺母正下方的螺钉的端部，所述凹部延伸而不穿透树脂壳体，并且金属基部延伸到凹部下方的区域。

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