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    • 1. 发明授权
    • Positive pressure-applying compliant latch mechanism
    • 正压施加的闩锁机构
    • US08953332B2
    • 2015-02-10
    • US13442896
    • 2012-04-10
    • Shawn CanfieldMichael T. PeetsWade H. White
    • Shawn CanfieldMichael T. PeetsWade H. White
    • H05K7/14
    • H05K7/1489F16B2/10Y10T403/595Y10T403/599
    • A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.
    • 提供了一种用于将外壳中的现场可更换单元锁定的闩锁机构。 闩锁机构包括在现场可更换单元的第一侧处经由枢轴联接到现场可更换单元的可旋转闩锁以及设置成作用在枢轴上的柔性弹簧构件。 柔性弹簧构件作用在枢轴上并且在将现场可更换单元锁定在外壳内时,将闩锁从打开位置旋转到锁定位置。 该压缩有助于在现场可更换单元上或两侧提供朝向与该第一侧相对的现场可更换单元的第二侧的正压力。 当现场可更换单元被锁定在外壳内时,该正压力有助于将现场可更换单元的第二侧处的第一连接器固定连接到与外壳相关联的第二连接器。
    • 7. 发明授权
    • Segmented architecture for wafer test and burn-in
    • 用于晶圆测试和老化的分段架构
    • US06275051B1
    • 2001-08-14
    • US09240121
    • 1999-01-29
    • Thomas W. BachelderDennis R. BarringerDennis R. ContiJames M. CraftsDavid L. GardellPaul M. GaschkeMark R. LaforceCharles H. PerryRoger R. SchmidtJoseph J. Van HornWade H. White
    • Thomas W. BachelderDennis R. BarringerDennis R. ContiJames M. CraftsDavid L. GardellPaul M. GaschkeMark R. LaforceCharles H. PerryRoger R. SchmidtJoseph J. Van HornWade H. White
    • G01R1073
    • G01R31/2863
    • An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
    • 用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片,连接两个板的电连接器。 测试器芯片用于向产品芯片分配电力或用于测试产品芯片。 其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。 第一板和第二板的基座对于产品系列中的所有晶片都保持不变。 使用两个电路板提供了测试器芯片在燃烧期间保持在比产品芯片基本上更低的温度,以延长测试器芯片的寿命。 间隙可以用作板之间的绝热,并将间隙密封并抽真空以进行进一步的隔热。 疏散还提供大气压力增加的接触,用于连接板和与晶片的接触。 用于平行测试芯片的探针被布置成月牙形条纹,以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。
    • 9. 发明授权
    • System and method for a self aligning multiple card enclosure with hot plug capability
    • 用于自对准具有热插拔能力的多卡外壳的系统和方法
    • US06421252B1
    • 2002-07-16
    • US09711059
    • 2000-11-10
    • Wade H. WhiteMichael J. Fisher
    • Wade H. WhiteMichael J. Fisher
    • H05K714
    • H05K7/1429H05K7/1461
    • An exemplary embodiment is a method and apparatus for a multiple card enclosure. The multiple card enclosure is arranged for mounting a mother card enclosure and a daughter card enclosure and at least another daughter card enclosure. The mother card enclosure has a first and second daughter card enclosure removably inserted into the mother card enclosure for connecting the first and second daughter card with the mother card. The first daughter card enclosure and the second daughter card enclosure are independently removable to facilitate interchanging the first daughter card and the second daughter card. The daughter card enclosures connected to the mother card enclosure are enclosed in the multiple card enclosure and a mother card connects to a back plane connector of a logic board.
    • 示例性实施例是用于多卡外壳的方法和装置。 多卡外壳被安排用于安装母卡外壳和子卡外壳以及至少另一个子卡外壳。 母卡外壳具有可拆卸地插入母卡外壳中的第一和第二子卡外壳,用于将第一和第二子卡与母卡连接。 第一子卡外壳和第二子卡外壳可独立地拆卸,以便于交换第一子卡和第二子卡。 连接到母卡外壳的子卡外壳封装在多个卡外壳中,母卡连接到逻辑板的背板连接器。