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1. 发明授权

US07660111B2 Removable cooling duct with interlocking dovetail connections for an air tight thermal seal 有权
标题翻译：可拆卸冷却管道，具有互锁的燕尾连接，用于气密热封
公开(公告)号：US07660111B2
公开(公告)日：2010-02-09
申请号：US11947299
申请日：2007-11-29
申请人： Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
发明人： Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20727
摘要： A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.
摘要翻译：提供了一种用于冷却电子设备或组件的方法和组装的组件。组件包括具有固定管道部分和可移除管道部分的热导管。这些部分各自具有互补的互锁部件以将它们彼此固定。还提供了第一附接块。第一附接块具有互补的互锁部分，其具有固定和可移除的管道部分，使得块可以至少部分地固定到固定管道部分和可移除管道部分中的每一个。还提供了第二附接块，其具有与可移除管道部分互补的互锁部分。该第二连接块可以固定到需要冷却的一个或多个电子设备。

2. 发明授权

US06496001B1 System and method for probe mechanism planarization 失效
标题翻译：探针机构平面化的系统和方法
公开(公告)号：US06496001B1
公开(公告)日：2002-12-17
申请号：US09712669
申请日：2000-11-14
申请人： Dennis Barringer , Donald W. Porter , Roger R. Schmidt , Wade H. White
发明人： Dennis Barringer , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： G01R3102
CPC分类号： G01R3/00 , G01R1/073
摘要： An exemplary embodiment is a method and apparatus for planarization. The planarization tool has a base which provides the support for the planarization tool. The base has a support hinge mounted on it along with dampening posts and rest posts which support a pivot plate hinged to the support hinge. A pressure assembly is mounted to the pivot plate by retention hardware. The pressure assembly loads a device under test board assembly that is mounted to the pressure assembly with the retention hardware.
摘要翻译：示例性实施例是用于平坦化的方法和装置。平坦化工具具有为平面化工具提供支撑的基座。基座具有安装在其上的支撑铰链以及支撑铰链到支撑铰链的枢轴板的阻尼柱和支撑柱。压力组件通过保持硬件安装到枢轴板。压力组件将一个设备安装在带有保持硬件的压力组件的测试板组件下。

3. 发明授权

US06275051B1 Segmented architecture for wafer test and burn-in 有权
标题翻译：用于晶圆测试和老化的分段架构
公开(公告)号：US06275051B1
公开(公告)日：2001-08-14
申请号：US09240121
申请日：1999-01-29
申请人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
发明人： Thomas W. Bachelder , Dennis R. Barringer , Dennis R. Conti , James M. Crafts , David L. Gardell , Paul M. Gaschke , Mark R. Laforce , Charles H. Perry , Roger R. Schmidt , Joseph J. Van Horn , Wade H. White
IPC分类号： G01R1073
CPC分类号： G01R31/2863
摘要： An apparatus for simultaneously testing or burning in a large number of the integrated circuit chips on a product wafer includes probes mounted on a first board and tester chips mounted on a second board, there being electrical connectors connecting the two boards. The tester chips are for distributing power to the product chips or for testing the product chips. The probes and thin film wiring to which they are attached are personalized for the pad footprint of the particular wafer being probed. The base of the first board and the second board both remain the same for all wafers in a product family. The use of two boards provides that the tester chip is kept at a substantially lower temperature than the product chips during burning to extend the lifetime of tester chips. A gap can be used as thermal insulation between the boards, and the gap sealed and evacuated for further thermal insulation. Evacuation also provides atmospheric pressure augmentation of contact for connection between boards and contact to wafer. Probes for parallel testing of chips are arranged in crescent shaped stripes to significantly increase tester throughput as compared with probes arranged in an area array.
摘要翻译：用于在产品晶片上同时测试或燃烧大量集成电路芯片的装置包括安装在第一板上的探针和安装在第二板上的测试器芯片，连接两个板的电连接器。测试器芯片用于向产品芯片分配电力或用于测试产品芯片。其所附接的探针和薄膜布线被个性化以用于被探测的特定晶片的焊盘覆盖区。第一板和第二板的基座对于产品系列中的所有晶片都保持不变。使用两个电路板提供了测试器芯片在燃烧期间保持在比产品芯片基本上更低的温度，以延长测试器芯片的寿命。间隙可以用作板之间的绝热，并将间隙密封并抽真空以进行进一步的隔热。疏散还提供大气压力增加的接触，用于连接板和与晶片的接触。用于平行测试芯片的探针被布置成月牙形条纹，以便与布置在区域阵列中的探针相比显着增加测试仪的吞吐量。

4. 发明申请

US20130265695A1 POSITIVE PRESSURE-APPLYING COMPLIANT LATCH MECHANISM 有权
标题翻译：积极应对压力机构
公开(公告)号：US20130265695A1
公开(公告)日：2013-10-10
申请号：US13442896
申请日：2012-04-10
申请人： Shawn CANFIELD , Michael T. PEETS , Wade H. WHITE
发明人： Shawn CANFIELD , Michael T. PEETS , Wade H. WHITE
IPC分类号： H05K7/00 , F16B21/00
CPC分类号： H05K7/1489 , F16B2/10 , Y10T403/595 , Y10T403/599
摘要： A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.
摘要翻译：提供了一种用于将外壳中的现场可更换单元锁定的闩锁机构。闩锁机构包括在现场可更换单元的第一侧处经由枢轴联接到现场可更换单元的可旋转闩锁以及设置成作用在枢轴上的柔性弹簧构件。柔性弹簧构件作用在枢轴上并且在将现场可更换单元锁定在外壳内时，将闩锁从打开位置旋转到锁定位置。该压缩有助于在现场可更换单元上或两侧提供朝向与该第一侧相对的现场可更换单元的第二侧的正压力。当现场可更换单元被锁定在外壳内时，该正压力有助于将现场可更换单元的第二侧处的第一连接器固定连接到与外壳相关联的第二连接器。

5. 发明授权

US06511574B2 Fixture for securing hard stops to a substrate 失效
公开(公告)号：US06511574B2
公开(公告)日：2003-01-28
申请号：US09764592
申请日：2001-01-18
申请人： Dennis Barringer , Mark A. Marnell , Steven J. Mazzuca , Donald W. Porter , Roger R. Schmidt , Wade H. White
发明人： Dennis Barringer , Mark A. Marnell , Steven J. Mazzuca , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： B32B3500
CPC分类号： G01R1/0408 , G01R31/2887 , Y10S269/903 , Y10T156/17 , Y10T156/1744
摘要： An exemplary embodiment is a fixture for securing hard stops to a substrate. The fixture has a base which provides support to the fixture. The base has a cavity configured for nestably supporting a substrate. A top plate is mounted on the base, the top plate is configured for mounting the substrate. An alignment plate is disposed on the top plate separate from the base. An adjusting plunger assembly is coupled to the base. The adjusting plunger assembly is configured for use with attaching a hard stop to the substrate. A plunger is coupled to the base substantially perpendicular to the adjusting plunger assembly. The plunger is configured for use with supporting the substrate. A method of using a fixture is disclosed comprising disposing a substrate in a base of the fixture and mounting a hard stop to the substrate. An adhesive is disposed between the hard stop and the substrate. The substrate is mounted between a plunger and a top plate. The hard stop on the substrate is aligned with an alignment plate. An adjusting plunger assembly is adjusted to mount the hard stop to the substrate.

6. 发明授权

US1463059A Box 失效
公开(公告)号：US1463059A
公开(公告)日：1923-07-24
申请号：US55901422
申请日：1922-05-06
申请人： WADE H WHITE
发明人： MATTHEWS JAMES F
IPC分类号： B65D25/10
CPC分类号： B65D25/101

7. 发明授权

US5622520A High-density board connector attachment 失效
标题翻译：高密度板连接器附件
公开(公告)号：US5622520A
公开(公告)日：1997-04-22
申请号：US657921
申请日：1996-05-31
申请人： Peter L. Dutka , Jeffrey J. Hare , Norton J. Tomassetti , William J. Tkazyik , Wade H. White
发明人： Peter L. Dutka , Jeffrey J. Hare , Norton J. Tomassetti , William J. Tkazyik , Wade H. White
IPC分类号： H01R13/73
CPC分类号： H01R12/7047
摘要： A printed circuit board includes a rectangular array of substantially equally spaced rows and columns of surface mount connectors which are fixedly held to the board by means of cross-shaped connector holders which are disposed at the intersections of the rows and columns. In this fashion, there is achieved a substantial reduction in the number of holes which must be provided in the printed circuit board for connector attachment. This greatly facilitates wiring placement on printed circuit boards, particularly multi-layer boards.
摘要翻译：印刷电路板包括基本相等间隔的行和表面安装连接器列的矩形阵列，其通过设置在行和列的交叉点处的十字形连接器保持器固定地保持在板上。以这种方式，实现了用于连接器连接的印刷电路板中必须设置的孔的数量的显着减少。这极大地方便了印刷电路板，特别是多层板上的布线布置。

8. 发明授权

US08953332B2 Positive pressure-applying compliant latch mechanism 有权
标题翻译：正压施加的闩锁机构
公开(公告)号：US08953332B2
公开(公告)日：2015-02-10
申请号：US13442896
申请日：2012-04-10
申请人： Shawn Canfield , Michael T. Peets , Wade H. White
发明人： Shawn Canfield , Michael T. Peets , Wade H. White
IPC分类号： H05K7/14
CPC分类号： H05K7/1489 , F16B2/10 , Y10T403/595 , Y10T403/599
摘要： A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.
摘要翻译：提供了一种用于将外壳中的现场可更换单元锁定的闩锁机构。闩锁机构包括在现场可更换单元的第一侧处经由枢轴联接到现场可更换单元的可旋转闩锁以及设置成作用在枢轴上的柔性弹簧构件。柔性弹簧构件作用在枢轴上并且在将现场可更换单元锁定在外壳内时，将闩锁从打开位置旋转到锁定位置。该压缩有助于在现场可更换单元上或两侧提供朝向与该第一侧相对的现场可更换单元的第二侧的正压力。当现场可更换单元被锁定在外壳内时，该正压力有助于将现场可更换单元的第二侧处的第一连接器固定连接到与外壳相关联的第二连接器。

9. 发明申请

US20130027885A1 HEAT SPREADER FOR MULTI-CHIP MODULES 审中-公开
标题翻译：多芯片模块的散热器
公开(公告)号：US20130027885A1
公开(公告)日：2013-01-31
申请号：US13189855
申请日：2011-07-25
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.
摘要翻译：多芯片电子模块包括具有第一端部，第二端部，第一表面部分和相对的第二表面部分的电路板。多个电子部件被安装到电路板的第一表面部分。散热构件被支撑在电路板的第一表面部分处。散热器包括具有第一端，第二端，第一表面和第二表面的主体。第一端部部分和第一端部限定流体入口，并且第二端部部分和第二端部限定流体出口。第二表面与多个电子部件热接触。散热构件和电路板限定具有多个基本上平行的流动路径的封闭流体管道。

10. 发明申请

US20090141442A1 Removable Cooling Duct With Interlocking Dovetail Connections For An Air Tight Thermal Seal 有权
标题翻译：具有联锁燕尾连接的可拆卸冷却管道用于气密密封
公开(公告)号：US20090141442A1
公开(公告)日：2009-06-04
申请号：US11947299
申请日：2007-11-29
申请人： Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
发明人： Dennis R. Barringer , Robert R. Genest , John J. Loparco , Wade H. White
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
CPC分类号： H05K7/20727
摘要： A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed portion and a removable portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the first and second thermal duct portions such that the block can be secured at least partially to either/or thermal duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.
摘要翻译：提供了一种用于冷却电子设备或组件的方法和组装的组件。组件包括具有固定部分和可移除部分的热导管。这些部分各自具有互补的互锁部件以将它们彼此固定。还提供了第一附接块。第一附接块具有与第一和第二导热管部分互补的互锁部分，使得该块可以至少部分地固定到/或热导管部分。还提供了第二附接块，其具有与可移除管道部分互补的互锁部分。该第二连接块可以固定到需要冷却的一个或多个电子设备。

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