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1. 发明授权

US08582297B2 Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics 有权
标题翻译：定制热界面，优化机械负载和导热特性
公开(公告)号：US08582297B2
公开(公告)日：2013-11-12
申请号：US13020102
申请日：2011-02-03
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
IPC分类号： H05K7/20
CPC分类号： F28F13/00 , B23P2700/10 , F28F2013/006 , H01L23/433 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , H01L2924/00
摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要翻译：一种通过冷却板冷却一个或多个设备的方法，系统和装置。示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。

2. 发明授权

US07874862B2 Connector actuation mechanism 失效
标题翻译：连接器致动机构
公开(公告)号：US07874862B2
公开(公告)日：2011-01-25
申请号：US12781033
申请日：2010-05-17
申请人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
发明人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
IPC分类号： H01R13/62
CPC分类号： H05K7/1407
摘要： A mechanism for electrically connecting a first electronic component to a second electronic component includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component.
摘要翻译：用于将第一电子部件电连接到第二电子部件的机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。

3. 发明申请

US20090215303A1 CONNECTOR ACTUATION MECHANISM 失效
标题翻译：连接器启动机构
公开(公告)号：US20090215303A1
公开(公告)日：2009-08-27
申请号：US12035595
申请日：2008-02-22
申请人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
发明人： Dennis R. Barringer , William L. Brodsky , Francesco Chiarella , John J. Loparco , Michael F. Scanlon , John G. Torok
IPC分类号： H01R13/621 , H01R12/00
CPC分类号： H05K7/1407
摘要： A mechanism for electrically connecting a first electronic component to a second electronic component. The mechanism includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component. A method for electrically connecting a first electronic component to a second electronic component includes rotating an actuation screw disposed in the first electronic component and in operable communication with an actuating member disposed in the first electronic component, the actuating member including a first connector half. The actuating member is urged in a direction substantially perpendicular to an axis of the actuation screw by the rotation of the actuation screw and the first connector half is engaged to a second connector half disposed in the second electronic component.
摘要翻译：一种用于将第一电子部件电连接到第二电子部件的机构。该机构包括设置在第一电子部件中的致动部件，其包括第一连接器半部和具有头部和螺纹端部的致动螺钉。致动螺钉位于第一电子部件中，其中致动螺杆的旋转沿着基本上垂直于致动螺钉的轴线的方向推动致动构件，从而将第一连接器半部接合到设置在第二电子部件中的第二连接器半体。用于将第一电子部件电连接到第二电子部件的方法包括旋转设置在第一电子部件中的致动螺钉，并且与设置在第一电子部件中的致动部件可操作地连通，致动部件包括第一连接器半部。致动构件通过致动螺钉的旋转而沿着基本上垂直于致动螺钉的轴线的方向被推动，并且第一连接器半部被接合到设置在第二电子部件中的第二连接器半体上。

4. 发明授权

US07505251B2 Actuation mechanism for mating electronic card interconnect systems 有权
标题翻译：配电电子卡互连系统的启动机制
公开(公告)号：US07505251B2
公开(公告)日：2009-03-17
申请号：US11262047
申请日：2005-10-28
申请人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
发明人： Shawn M. Canfield , John J. Loparco , Emanuele F. Lopergolo , Budy D. Notohardjono , Michael T. Peets , John G. Torok
IPC分类号： G06F1/16
CPC分类号： H05K5/0217
摘要： An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.
摘要翻译：提供了一种用于将电子装配到计算机机架的致动组件和方法，所述计算机机架包括可接合地固定到滑动组件的主壳体。滑动组件能够被固定到计算机机架的一侧并且具有滑动特征，使得当接合时滑动组件和主壳体可以伸缩或返回到关闭位置。主壳体具有用于将所述组件更牢固地固定到所述机架上的垂直楔块，以及用于移动垂直楔块的驱动楔块，使得其可以通过导螺杆用所述滑动机构望远镜进入和离开所述齿条。

5. 发明授权

US07396244B1 Apparatus for extracting and inserting a DIMM 有权
标题翻译：用于提取和插入DIMM的装置
公开(公告)号：US07396244B1
公开(公告)日：2008-07-08
申请号：US11843250
申请日：2007-08-22
申请人： Kyle S. Barna , William L. Brodsky , Amanda E. E. Mikhail , John G. Torok
发明人： Kyle S. Barna , William L. Brodsky , Amanda E. E. Mikhail , John G. Torok
IPC分类号： H01R13/62
CPC分类号： H05K7/1409 , H05K7/1431 , Y10T29/53261
摘要： An apparatus for extracting and inserting a circuit card into a socket, the apparatus includes a tool device releasably mountable to opposing sides defining the circuit card. The tool device includes a pair of frame members having a friction fit feature for attachment to the opposing side edges defining the circuit card; and a sliding plane translatable between the pair of frame members. Upward translation of the sliding plane relative to the fixed pair of frame members acts to release latches on the connector to extract the circuit card from the connector upon upward translation of the pair of frame members, and downward translation of the sliding plane relative to the fixed pair of frame members acts to transfer a force to the circuit card, thereby inserting the circuit card with the connector. The apparatus further includes a tool guide having two members opposing each other, each member including a plurality of slots, each configured to guide a respective edge of the tool device therethrough for alignment with the connector.
摘要翻译：一种用于将电路卡提取并插入插座的装置，该装置包括可释放地安装到限定电路卡的相对侧的工具装置。工具装置包括具有摩擦配合特征的一对框架构件，用于附接到限定电路卡的相对侧边缘; 以及可在所述一对框架构件之间平移的滑动平面。滑动平面相对于固定的一对框架构件的向上平移用于释放连接器上的闩锁，以在一对框架构件向上平移时从连接器提取电路卡，并且滑动平面相对于固定的向下平移一对框架构件用于将力传递到电路卡，从而将电路卡插入连接器。该装置还包括具有彼此相对的两个构件的工具引导件，每个构件包括多个槽，每个槽被构造成引导工具装置的相应边缘通过其与连接器对准。

6. 发明授权

US07083477B1 Providing mechanical support for modular interconnect systems 失效
标题翻译：为模块化互连系统提供机械支持
公开(公告)号：US07083477B1
公开(公告)日：2006-08-01
申请号：US11193822
申请日：2005-07-29
申请人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
发明人： William Louis Brodsky , Michael F. Scanlon , John G. Torok
IPC分类号： H01R9/22
CPC分类号： H01R12/52 , H01R12/727
摘要： A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.
摘要翻译：连接器系统包括电连接到第一印刷线路板上的布线的第一连接器组件和与第二印刷线路板上的布线电连接的第二连接器组件。每个连接器组件包括多个连接器模块，其以诸如行的预定阵列连接在一起。在一个连接器组件中，该行还包括一个或多个致动模块。致动模块或模块通过致动器机构接合以迫使连接器组件配合接合或将它们分开。

7. 发明授权

US06462271B2 Capping structure for electronics package undergoing compressive socket actuation 失效
公开(公告)号：US06462271B2
公开(公告)日：2002-10-08
申请号：US09748829
申请日：2000-12-27
申请人： Jeffrey T. Coffin , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , John G. Torok
发明人： Jeffrey T. Coffin , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , John G. Torok
IPC分类号： H05K720
CPC分类号： H01L24/72 , H01L2023/4087 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K7/1061
摘要： A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

8. 发明授权

US09052880B2 Multi-level interconnect apparatus 有权
标题翻译：多层互连设备
公开(公告)号：US09052880B2
公开(公告)日：2015-06-09
申请号：US13449737
申请日：2012-04-18
申请人： Wiren D. Becker , Alan F. Becker , William L. Brodsky , John G. Torok
发明人： Wiren D. Becker , Alan F. Becker , William L. Brodsky , John G. Torok
IPC分类号： H05K7/00 , G06F1/20 , G06F1/16 , H01L25/065
CPC分类号： G06F1/20 , G06F1/16 , H01L25/0655 , H01L2924/15192 , H01L2924/15313
摘要： A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.
摘要翻译：一种多层互连装置，包括：基板，具有：第一面和与该第一面相对的第二面的基板主体;配置在基板主体的第二面上的处理单元;第一输入输出（I / O）单元设置在所述基板主体的第一侧上并且被配置为沿着所述基板主体的厚度尺寸与所述处理单元电连接;以及第二I / O单元，所述第二I / O单元设置在所述基板主体的所述第二侧上并且被配置为可电连接所述处理单元沿着所述基板主体的平面尺寸。

9. 发明申请

US20130279103A1 MULTI-LEVEL INTERCONNECT APPARATUS 有权
标题翻译：多级互连设备
公开(公告)号：US20130279103A1
公开(公告)日：2013-10-24
申请号：US13449737
申请日：2012-04-18
申请人： Wiren D. Becker , Alan F. Becker , William L. Brodsky , John G. Torok
发明人： Wiren D. Becker , Alan F. Becker , William L. Brodsky , John G. Torok
IPC分类号： G06F1/16
CPC分类号： G06F1/20 , G06F1/16 , H01L25/0655 , H01L2924/15192 , H01L2924/15313
摘要： A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.
摘要翻译：一种多层互连装置，包括：基板，具有：第一面和与该第一面相对的第二面的基板主体;配置在基板主体的第二面上的处理单元;第一输入输出（I / O）单元设置在所述基板主体的第一侧上并且被配置为沿着所述基板主体的厚度尺寸与所述处理单元电连接;以及第二I / O单元，所述第二I / O单元设置在所述基板主体的所述第二侧上并且被配置为可电连接所述处理单元沿着所述基板主体的平面尺寸。

10. 发明申请

US20130027885A1 HEAT SPREADER FOR MULTI-CHIP MODULES 审中-公开
标题翻译：多芯片模块的散热器
公开(公告)号：US20130027885A1
公开(公告)日：2013-01-31
申请号：US13189855
申请日：2011-07-25
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Michael T. Peets , John G. Torok , Wade H. White
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/36 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.
摘要翻译：多芯片电子模块包括具有第一端部，第二端部，第一表面部分和相对的第二表面部分的电路板。多个电子部件被安装到电路板的第一表面部分。散热构件被支撑在电路板的第一表面部分处。散热器包括具有第一端，第二端，第一表面和第二表面的主体。第一端部部分和第一端部限定流体入口，并且第二端部部分和第二端部限定流体出口。第二表面与多个电子部件热接触。散热构件和电路板限定具有多个基本上平行的流动路径的封闭流体管道。

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