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    • 5. 发明授权
    • Polarization-controlled VCSELs using externally applied uniaxial stress
    • 使用外部施加的单轴应力的极化控制VCSEL
    • US06188711B1
    • 2001-02-13
    • US08993006
    • 1997-12-18
    • Scott W. CorzineMichael R. T. TanAlbert T. YuenDubravko I. Babic
    • Scott W. CorzineMichael R. T. TanAlbert T. YuenDubravko I. Babic
    • H01S512
    • H01S5/18355H01S5/0607
    • A Vertical Cavity Surface-Emitting Laser (VCSEL) assembly in which the polarization is locked to a specified direction that is the same for all VCSELs. A VCSEL according to the present invention includes a VCSEL having a top mirror region, a bottom mirror region, a light generation region between the top and bottom mirror regions, a conducting substrate and a bottom electrode. The bottom mirror region is sandwiched between the conducting substrate and the light generation region, and the conducting substrate is sandwiched between the bottom electrode and the bottom mirror region. The assembly also includes a mounting substrate having top and bottom surfaces, the VCSEL being mechanically coupled to the mounting substrate. The mounting substrate includes a means for defining a first axis. The assembly includes a means for causing the mounting substrate to flex about the first axis thereby inducing a strain in the light generation region which locks the polarization into a mode determined by the first axis. In one embodiment of the present invention, the first axis is defined by a channel in the mounting substrate. The mounting substrate is caused to flex by the application of an adhesive layer applied between the mounting substrate and a mounting surface. The adhesive layer has a thermal coefficient of expansion different from the mounting substrate. In another embodiment, trenches whose direction defines the first axis are located in the top mirror region of the VCSEL.
    • 垂直腔表面发射激光(VCSEL)组件,其中偏振被锁定到对于所有VCSEL相同的指定方向。 根据本发明的VCSEL包括VCSEL,其具有顶部反射镜区域,底部反射镜区域,顶部和底部反射镜区域之间的发光区域,导电基底和底部电极。 底部反射镜区域夹在导电衬底和光产生区域之间,并且导电衬底夹在底部电极和底部镜像区域之间。 组件还包括具有顶表面和底表面的安装衬底,VCSEL机械地联接到安装衬底。 安装基板包括用于限定第一轴线的装置。 该组件包括用于使安装基板围绕第一轴弯曲的装置,从而在将偏振锁定为由第一轴确定的模式的光产生区域中引起应变。 在本发明的一个实施例中,第一轴由安装基板中的通道限定。 通过施加施加在安装基板和安装表面之间的粘合剂层,使安装基板挠曲。 粘合剂层具有与安装基板不同的热膨胀系数。 在另一个实施例中,其方向限定第一轴的沟槽位于VCSEL的顶部反射镜区域中。
    • 7. 发明授权
    • N-drive, p-common light-emitting devices fabricated on an n-type
substrate and method of making same
    • 在n型衬底上制造的N驱动p普通发光器件及其制造方法
    • US5892787A
    • 1999-04-06
    • US635838
    • 1996-04-22
    • Michael R. T. TanAlbert T. YuenShih-Yuan WangGhulam HasnainYu-Min Houng
    • Michael R. T. TanAlbert T. YuenShih-Yuan WangGhulam HasnainYu-Min Houng
    • H01S5/00H01L33/00H01L33/30H01S5/042H01S5/183H01S5/30H01S5/42H01S3/19
    • H01L33/30H01L33/0016H01L33/0062H01S5/18308H01S5/0207H01S5/0421H01S5/18305H01S5/2059H01S5/2063H01S5/3054H01S5/3095H01S5/423
    • A substantially n-type substrate structure having a p-type surface for use in semiconductor devices as a substitute for a p-type semiconductor substrate. The substrate structure comprises a substrate region and a buffer region. The substrate region is a region of n-type compound semiconductor, and includes a degeneratively n-doped portion adjacent its first surface. The buffer region is a region of compound semiconductor doped with a p-type dopant. The buffer region is located on the first surface of the substrate region and includes a surface remote from the substrate region that provides the p-type surface of the substrate structure. The buffer region also includes a degeneratively p-doped portion adjacent the degeneratively n-doped portion of the substrate region. The substrate structure includes a tunnel junction between the degeneratively n-doped portion of the substrate region and the degeneratively p-doped portion of the buffer region. The substrate structure is made by degeneratively doping a substrate region of n-type compound semiconductor material adjacent its first surface with an n-type impurity, and depositing a layer of compound semiconductor material doped with a p-type impurity on the first surface of the substrate region to form a buffer region that includes a surface remote from the substrate region. In the course of depositing the compound semiconductor material to form the buffer region, the compound semiconductor material is degeneratively doped with the p-type impurity at least in a portion adjacent the substrate region to form a tunnel junction between the substrate region and the buffer region.
    • 具有用于半导体器件的p型表面作为p型半导体衬底的替代物的基本为n型衬底结构。 衬底结构包括衬底区域和缓冲区域。 衬底区域是n型化合物半导体的区域,并且包括与其第一表面相邻的退化的n-掺杂部分。 缓冲区是掺杂有p型掺杂剂的化合物半导体的区域。 缓冲区域位于衬底区域的第一表面上并且包括远离衬底区域的表面,该表面提供衬底结构的p型表面。 缓冲区还包括与衬底区域的退化的n掺杂部分相邻的退化的p掺杂部分。 衬底结构包括在衬底区域的退化的n掺杂部分和缓冲区域的退化的p掺杂部分之间的隧道结。 衬底结构是通过用n型杂质将邻近其第一表面的n型化合物半导体材料的衬底区域简单地掺杂制成的,并且在第一表面上沉积掺杂有p型杂质的化合物半导体材料层 衬底区域以形成包括远离衬底区域的表面的缓冲区域。 在沉积化合物半导体材料以形成缓冲区的过程中,化合物半导体材料至少在与衬底区域相邻的部分中被p型杂质退变掺杂以在衬底区域和缓冲区域之间形成隧道结 。
    • 10. 发明授权
    • Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    • 用于光纤通信设备的集成封装系统,提供与光纤的自动对准
    • US06318909B1
    • 2001-11-20
    • US09248877
    • 1999-02-11
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • G02B636
    • G02B6/4249G02B6/4201G02B6/4228G02B6/4269G02B6/428G02B6/4281G02B6/4283G02B6/4292
    • An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.
    • 一种集成的包装系统,包括一体的机械支撑件,印刷电路板和光通信装置。 机械支撑件包括第一支撑元件和第二支撑元件。 第一支撑元件与第二支撑元件成非零角度延伸。 印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。 综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。 在这种情况下,第一支撑元件包括装置对准特征。 设备对准特征和光通信设备相对于彼此具有限定的位置关系。 或者,系统可以另外包括盖组件,其包括包括装置对准特征的盖。 所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。