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    • 5. 发明授权
    • Extended drift heterostructure photodiode having enhanced electron response
    • 具有增强的电子响应的扩展漂移异质结构光电二极管
    • US06740908B1
    • 2004-05-25
    • US10391948
    • 2003-03-18
    • Kirk S. Giboney
    • Kirk S. Giboney
    • H01L29732
    • H01L31/022408H01L31/0304H01L31/105Y02E10/544
    • An enhanced extended drift heterostructure (EEDH) photodiode and method of making provide enhanced electron response. The EEDH photodiode includes adjacent first and second light absorption layers, an ohmic anode contact interfaced to the first layer and a cathode contact interfaced to the second layer. The cathode contact includes either a Schottky cathode contact or an ohmic cathode contact and a contact layer. The EEDH photodiode optionally further includes one or more of a carrier block layer interfaced to the first layer, a graded characteristic in the first layer, and a collector layer interfaced to the second layer. The first layer has a doping concentration that is greater than doping concentrations of the second layer and the optional collector layer. The first and second layers have band gap energies that facilitate light absorption. The optional layers have band gap energies that are relatively nonconducive to light absorption.
    • 增强的扩展漂移异质结构(EEDH)光电二极管及其制造方法提供增强的电子响应。 EEDH光电二极管包括相邻的第一和第二光吸收层,与第一层接口的欧姆阳极触点和与第二层接口的阴极触点。 阴极接触包括肖特基阴极接触或欧姆阴极接触和接触层。 EEDH光电二极管可选地进一步包括与第一层接口的载流子阻挡层,第一层中的渐变特性以及与第二层接口的集电极层中的一个或多个。 第一层具有大于第二层和任选的集电极层的掺杂浓度的掺杂浓度。 第一层和第二层具有促进光吸收的带隙能量。 可选层具有相对不利于光吸收的带隙能量。
    • 6. 发明授权
    • Chip-mounted enclosure
    • 芯片安装外壳
    • US06351027B1
    • 2002-02-26
    • US09515931
    • 2000-02-29
    • Kirk S. GiboneyJonathan Simon
    • Kirk S. GiboneyJonathan Simon
    • H01L27142
    • H01L21/50H01L33/483H01L2924/0002H01L2924/00
    • A chip mounted enclosure (“CME”) comprises a base formed by an integrated circuit chip, a transducer element disposed on the integrated circuit chip, a side piece surrounding the transducer element that is coupled to the base, and a top piece coupled to the side piece. A method of making a CME comprises mounting a transducer element to a planar surface of an integrated circuit chip, where the planar surface forms a base of the CME. A side piece is fabricated to surround the transducer element. A top piece of the CME is placed on the side piece. Individual CMEs can be fabricated from a wafer assembly, where transducer elements, each respectively mounted to an integrated circuit wafer having corresponding integrated circuit chips, are individually surrounded by a side piece structure that is bonded to the integrated circuit wafer. Individual CMEs are formed by singulating the wafer assembly.
    • 芯片安装的外壳(“CME”)包括由集成电路芯片形成的基座,设置在集成电路芯片上的换能器元件,围绕耦合到基座的换能器元件的侧部件,以及耦合到该基座的顶部件 侧面 制造CME的方法包括将换能器元件安装到集成电路芯片的平面表面,其中平坦表面形成CME的基底。 制造一个侧件围绕换能器元件。 CME的顶部放在侧面件上。 单独的CME可以由晶片组件制造,其中每个分别安装到具有对应的集成电路芯片的集成电路晶片的换能器元件由结合到集成电路晶片的侧片结构单独包围。 单独的CME通过单晶晶片组件形成。
    • 7. 发明授权
    • Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers
    • 用于光纤通信设备的集成封装系统,提供与光纤的自动对准
    • US07380994B2
    • 2008-06-03
    • US10932539
    • 2004-09-01
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • Kirk S. GiboneyPaul K. RosenbergAlbert T. Yuen
    • G02B6/36
    • G02B6/4249G02B6/4201G02B6/4228G02B6/4269G02B6/428G02B6/4281G02B6/4283G02B6/4292
    • An integrated packaging system that comprises an integral mechanical support, a printed circuit board and the optical communications device. The mechanical support includes a first support element and a second support element. The first support element extends at a non-zero angle from the second support element. The printed circuit board includes a first portion and a second portion in contact with the first support element and the second support element, respectively. The optical communications device is mechanically coupled to the first support element of the mechanical support and is electrically connected to the first portion of the printed circuit board. The integrated packaging system preferably provides automatic alignment between the optical communications device and one or both of an optical element and an optical fiber. In this case, the first support element includes a device alignment feature. The device alignment feature and the optical communications device have a defined positional relationship with respect to one another. Alternatively, the system may additionally comprise a cover assembly including a cover comprising a device alignment feature. The cover is mechanically coupled to the first support element in a position at which the device alignment feature and the optical communications device have a predetermined positional relationship with respect to one another.
    • 一种集成的包装系统,包括一体的机械支撑件,印刷电路板和光通信装置。 机械支撑件包括第一支撑元件和第二支撑元件。 第一支撑元件与第二支撑元件成非零角度延伸。 印刷电路板包括分别与第一支撑元件和第二支撑元件接触的第一部分和第二部分。 光通信设备机械耦合到机械支撑件的第一支撑元件并且电连接到印刷电路板的第一部分。 综合包装系统优选地在光通信设备与光学元件和光纤之一或两者之间自动对准。 在这种情况下,第一支撑元件包括装置对准特征。 设备对准特征和光通信设备相对于彼此具有限定的位置关系。 或者,系统可以另外包括盖组件,其包括包括装置对准特征的盖。 所述盖在第一支撑元件处机械联接到装置对准特征和光通信装置相对于彼此具有预定位置关系的位置。