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1. 发明授权

US06197222B1 Lead free conductive composites for electrical interconnections 失效
标题翻译：无铅导电复合材料用于电气互连
公开(公告)号：US06197222B1
公开(公告)日：2001-03-06
申请号：US09119569
申请日：1998-07-20
申请人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
发明人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
IPC分类号： H01B104
CPC分类号： H01L24/81 , H01B1/22 , H01L23/49883 , H01L2224/13009 , H01L2224/81801 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K3/321 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2201/0162 , H05K2203/0783
摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料由高温下的糊料形成。该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

2. 发明授权

US5866044A Lead free conductive composites for electrical interconnections 失效
标题翻译：无铅导电复合材料用于电气互连
公开(公告)号：US5866044A
公开(公告)日：1999-02-02
申请号：US734492
申请日：1996-10-21
申请人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
发明人： Ravi F. Saraf , Judith Marie Roldan , Michael Anthony Gaynes , Richard Benton Booth , Steven Paul Ostrander , Emanuel I. Cooper , Carlos J. Sambucetti
IPC分类号： H01B1/22 , H01L21/60 , H01L23/498 , H05K3/32 , H05K3/46 , H01B1/12
CPC分类号： H01L24/81 , H01B1/22 , H01L23/49883 , H05K3/321 , H01L2224/13009 , H01L2224/81801 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K2201/0129 , H05K2201/0133 , H05K2201/0162 , H05K2203/0783 , H05K3/4614 , H05K3/4632
摘要： An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包括热塑性聚合物，导电金属粉末和有机溶剂系统的导电浆料。本发明还包括一种包含上述热塑性和金属的导电复合材料，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料由高温下的糊料形成。该糊剂用于涉及将糊料转化为复合材料的工艺条件下的电气和电子部件电连接的工艺。

3. 发明授权

US07033648B1 Means of seeding and metallizing polyimide 失效
标题翻译：种植和金属化聚酰亚胺的方法
公开(公告)号：US07033648B1
公开(公告)日：2006-04-25
申请号：US08781926
申请日：1996-12-30
申请人： Fuad E. Doany , Jeffrey R. Marino , Carlos J. Sambucetti , Ravi F. Saraf
发明人： Fuad E. Doany , Jeffrey R. Marino , Carlos J. Sambucetti , Ravi F. Saraf
IPC分类号： H05H1/00 , B05D3/00 , B05D5/12
CPC分类号： C23C18/22 , C23C18/1605 , C23C18/1641 , C23C18/1692 , C23C18/2006 , C23C18/208 , C23C18/30 , C23C18/31 , H05K1/0346 , H05K3/0032 , H05K3/184 , H05K3/381 , H05K2203/0793 , H05K2203/083 , H05K2203/095
摘要： A method to selectively metallize polyimide with an all-electroless process.
摘要翻译：选择性地使全化学镀金属化聚酰亚胺的方法。

4. 发明授权

US5545429A Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess 失效
标题翻译：在聚合物结构中制造双面全金属镀层通孔，无接种或光刻处理
公开(公告)号：US5545429A
公开(公告)日：1996-08-13
申请号：US270086
申请日：1994-07-01
申请人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
发明人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
IPC分类号： H05K3/20 , H05K3/32 , H05K3/42 , B05D5/12 , C25D5/02
CPC分类号： H05K3/423 , H05K2203/0152 , H05K2203/0733 , H05K2203/1509 , H05K3/205 , H05K3/321
摘要： The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
摘要翻译：本发明涉及一种在聚合物结构中贯穿孔的全金属化方法的方法，包括以下步骤：向金属阴极施加成膜量的导电聚合物 - 金属复合浆料; 将图案化的聚合物结构键合到所述糊料; 使所述聚合物结构经受电解电镀浴足够的时间以完全金属化所述图案化的聚合物结构中的通孔表面，并从阴极组件中去除结构。完全金属化的通孔聚合物结构然后可以被清洁和抛光以产生成品。

5. 发明授权

US07468320B2 Reduced electromigration and stressed induced migration of copper wires by surface coating 有权
标题翻译：通过表面涂层减少电迁移和应力诱导的铜线迁移
公开(公告)号：US07468320B2
公开(公告)日：2008-12-23
申请号：US11183773
申请日：2005-07-19
申请人： Chao-Kun Hu , Robert Rosenberg , Judith M. Rubino , Carlos J. Sambucetti , Anthony K. Stamper
发明人： Chao-Kun Hu , Robert Rosenberg , Judith M. Rubino , Carlos J. Sambucetti , Anthony K. Stamper
IPC分类号： H01L21/44
CPC分类号： H01L21/76843 , H01L21/288 , H01L21/76849 , H01L21/76864 , H01L23/53228 , H01L23/53238 , H01L23/5329 , H01L2924/0002 , H01L2924/00
摘要： The idea of the invention is to coat the free surface of patterned Cu conducting lines in on-chip interconnections (BEOL) wiring by a 1-20 nm thick metal layer prior to deposition of the interlevel dielectric. This coating is sufficiently thin so as to obviate the need for additional planarization by polishing, while providing protection against oxidation and surface, or interface, diffusion of Cu which has been identified by the inventors as the leading contributor to metal line failure by electromigration and thermal stress voiding. Also, the metal layer increases the adhesion strength between the Cu and dielectric so as to further increase lifetime and facilitate process yield. The free surface is a direct result of the CMP (chemical mechanical polishing) in a damascene process or in a dry etching process by which Cu wiring is patterned. It is proposed that the metal capping layer be deposited by a selective process onto the Cu to minimize further processing. We have used electroless metal coatings, such as CoWP, CoSnP and Pd, to illustrate significant reliability benefits, although chemical vapor deposition (CVD) of metals or metal forming compounds can be employed.
摘要翻译：本发明的想法是在沉积层间电介质之前，通过1-20nm厚的金属层将芯片上互连（BEOL）布线中的图案化Cu导线的自由表面涂覆。该涂层足够薄，以便消除对通过抛光进行附加平面化的需要，同时提供了防止氧化和表面或Cu的扩散的保护，这已经被本发明人鉴定为导致金属线路故障的主要贡献者通过电迁移和热压力消除。此外，金属层增加了Cu和电介质之间的粘合强度，从而进一步增加寿命并且有助于工艺产量。自由表面是在镶嵌工艺中的CMP（化学机械抛光）或通过图形化Cu布线的干蚀刻工艺的直接结果。提出通过选择性方法将金属覆盖层沉积到Cu上以最小化进一步的加工。尽管可以使用金属或金属形成化合物的化学气相沉积（CVD），但我们已经使用了无电金属涂层，例如CoWP，CoSnP和Pd来说明显着的可靠性优点。

6. 发明授权

US5310580A Electroless metal adhesion to organic dielectric material with phase separated morphology 失效
标题翻译：无机金属与相分离形态的有机介电材料粘合
公开(公告)号：US5310580A
公开(公告)日：1994-05-10
申请号：US874665
申请日：1992-04-27
申请人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
发明人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
IPC分类号： B05D1/34 , C23C18/20 , H05K3/18 , H05K3/38 , B05D2/06
CPC分类号： H05K3/387 , B05D1/34 , C23C18/20 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0154 , H05K2201/0212 , H05K2203/0759 , H05K2203/0773 , H05K2203/0793 , H05K3/181 , H05K3/381
摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
摘要翻译：沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。固化前体由于相分离而导致表面粗糙化。暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。粗糙表面用光致抗蚀剂涂覆，曝光和显影。随后的无电金属沉积导致金属与电介质层粘附性的改善。该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。

7. 发明授权

US5509557A Depositing a conductive metal onto a substrate 失效
标题翻译：将导电金属沉积到基底上
公开(公告)号：US5509557A
公开(公告)日：1996-04-23
申请号：US184930
申请日：1994-01-24
申请人： Lisa J. Jimarez , William H. Lawrence , Voya R. Markovich , Robert J. Owen , Carlos J. Sambucetti
发明人： Lisa J. Jimarez , William H. Lawrence , Voya R. Markovich , Robert J. Owen , Carlos J. Sambucetti
IPC分类号： C23C18/28 , C23C18/22 , C23C18/31 , H05K3/18 , H05K3/38 , B05D3/04 , C23F1/00
CPC分类号： H05K3/38 , C23C18/22 , H05K3/381 , H05K2203/1105 , H05K2203/1152 , H05K3/181
摘要： A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:R.sub.a =0.05-0.08 mil,R.sub.max =0.20-0.55 mil,S.sub.m =1.00-3.00 mil,R.sub.p =0.20-0.35 mil, andsurface area=0.90-1.20 square milswherein R.sub.a is the average roughness and the arithmetic mean of the departures from horizontal mean line profile;R.sub.max is the maximum peak-to-valley height;S.sub.m is the mean spacing between high spots at the mean line;R.sub.p is the maximum profile height from the mean line; andsurface area is the area under the surface profile from each measurement using a Talysurf S-120 profilometer;The sheet is laminated to the dielectric substrate surface by pressing the roughened surface of the metal sheet against the surface of the substrate and then removed from the substrate. The substrate surface is seeded to render it active for electroless plating thereon; and then a metal from an electroless plating bath is plated thereon.In another method, the dielectric substrate is seeded to render it active for electroless plating thereon. A metal is then plated thereon from an electroless plating bath. The plated metal is subjected to temperature of at least about 100 .degree. C. for a time sufficient to increase the adhesion of the metal to the substrate.
摘要翻译：提供了一种在电介质基片上沉积导电金属的方法。该方法包括获得具有以下参数的粗糙表面的金属片：Ra = 0.05-0.08密耳，Rmax = 0.20-0.55密耳，Sm = 1.00-3.00密耳，Rp = 0.20-0.35密耳，表面积= 0.90 -1.20平方米，其中Ra是平均粗糙度和离开水平平均线轮廓的算术平均值; Rmax是最大峰谷高度; Sm是平均线高点之间的平均间距; Rp是距平均线的最大轮廓高度; 表面积是使用Talysurf S-120轮廓仪进行每次测量的表面轮廓下面积; 通过将金属片的粗糙表面压在衬底的表面上，然后从衬底上去除，将片层压到电介质衬底表面上。将基材表面接种以使其活性以在其上进行无电镀; 然后将来自化学镀浴的金属镀在其上。在另一种方法中，将电介质基底接种以使其在其上进行无电镀。然后将金属从化学镀浴镀在其上。将电镀金属经受至少约100℃的温度足以增加金属与基底的粘合力的时间。

8. 发明授权

US5105537A Method for making a detachable electrical contact 失效
标题翻译：制造可拆卸电气接触件的方法
公开(公告)号：US5105537A
公开(公告)日：1992-04-21
申请号：US596432
申请日：1990-10-12
申请人： Madhav Datta , David E. King , Alan D. Knight , Carlos J. Sambucetti
发明人： Madhav Datta , David E. King , Alan D. Knight , Carlos J. Sambucetti
IPC分类号： H01H1/06 , H01L21/60 , H01R12/04 , H01R12/32 , H01R13/03 , H01R13/22 , H01R43/16 , H05K1/11 , H05K3/06 , H05K3/07 , H05K3/24 , H05K3/38 , H05K3/40
CPC分类号： H05K3/07 , H01R13/22 , H05K3/4007 , H01L2924/0002 , H01R13/03 , H01R43/16 , H05K2201/0367 , H05K2201/0373 , H05K2203/0369 , H05K3/064 , H05K3/383 , Y10T29/49222
摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.

9. 发明授权

US4948707A Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon 失效
标题翻译：调节非导电基底，以便随后在其上选择性沉积金属
公开(公告)号：US4948707A
公开(公告)日：1990-08-14
申请号：US156519
申请日：1988-02-16
申请人： Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
发明人： Robert W. Johnson , William H. Lawrence , Gary K. Lemon , Roy H. Magnuson , Voya R. Markovich , Ralph E. Parsons , Carlos J. Sambucetti
IPC分类号： C23C18/18 , C23C18/28 , C23C18/30 , H05K3/00 , H05K3/18 , H05K3/38
CPC分类号： H05K3/181 , H05K3/184 , H05K3/381 , H05K2203/0716 , H05K2203/1152 , H05K2203/122 , H05K2203/1407 , H05K3/0023
摘要： A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

10. 发明授权

US4820643A Process for determining the activity of a palladium-tin catalyst 失效
标题翻译：测定钯 - 锡催化剂活性的方法
公开(公告)号：US4820643A
公开(公告)日：1989-04-11
申请号：US161233
申请日：1988-02-17
申请人： William J. Amelio , Kenneth R. Czarnecki , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Richard S. Zarr
发明人： William J. Amelio , Kenneth R. Czarnecki , Gary K. Lemon , Voya Markovich , Carlos J. Sambucetti , Richard S. Zarr
IPC分类号： G01N27/48 , G01N21/00 , G01N33/20
CPC分类号： G01N27/48
摘要： The effectiveness of a palladium-tin catalyst for subsequent plating thereon is determined by employing cyclic voltammetry.
摘要翻译：通过使用循环伏安法测定钯 - 锡催化剂随后电镀的效果。

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