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1. 发明授权

US5545429A Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess 失效
标题翻译：在聚合物结构中制造双面全金属镀层通孔，无接种或光刻处理
公开(公告)号：US5545429A
公开(公告)日：1996-08-13
申请号：US270086
申请日：1994-07-01
申请人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
发明人： Richard B. Booth , Emanuel I. Cooper , Edward A. Giess , Mark R. Kordus , Sol Krongelb , Steven P. Ostrander , Judith M. Roldan , Carlos J. Sambucetti , Ravi Saraf
IPC分类号： H05K3/20 , H05K3/32 , H05K3/42 , B05D5/12 , C25D5/02
CPC分类号： H05K3/423 , H05K2203/0152 , H05K2203/0733 , H05K2203/1509 , H05K3/205 , H05K3/321
摘要： The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
摘要翻译：本发明涉及一种在聚合物结构中贯穿孔的全金属化方法的方法，包括以下步骤：向金属阴极施加成膜量的导电聚合物 - 金属复合浆料; 将图案化的聚合物结构键合到所述糊料; 使所述聚合物结构经受电解电镀浴足够的时间以完全金属化所述图案化的聚合物结构中的通孔表面，并从阴极组件中去除结构。完全金属化的通孔聚合物结构然后可以被清洁和抛光以产生成品。

2. 发明授权

US5310580A Electroless metal adhesion to organic dielectric material with phase separated morphology 失效
标题翻译：无机金属与相分离形态的有机介电材料粘合
公开(公告)号：US5310580A
公开(公告)日：1994-05-10
申请号：US874665
申请日：1992-04-27
申请人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
发明人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
IPC分类号： B05D1/34 , C23C18/20 , H05K3/18 , H05K3/38 , B05D2/06
CPC分类号： H05K3/387 , B05D1/34 , C23C18/20 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0154 , H05K2201/0212 , H05K2203/0759 , H05K2203/0773 , H05K2203/0793 , H05K3/181 , H05K3/381
摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
摘要翻译：沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。固化前体由于相分离而导致表面粗糙化。暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。粗糙表面用光致抗蚀剂涂覆，曝光和显影。随后的无电金属沉积导致金属与电介质层粘附性的改善。该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。

3. 发明授权

US5747101A Direct chip attachment (DCA) with electrically conductive adhesives 失效
公开(公告)号：US5747101A
公开(公告)日：1998-05-05
申请号：US630033
申请日：1996-04-09
申请人： Richard B. Booth , Michael A. Gaynes , Robert M. Murcko , Viswanadham Puligandla , Judith M. Roldan , Ravi Saraf , Jerzy M. Zalesinski
发明人： Richard B. Booth , Michael A. Gaynes , Robert M. Murcko , Viswanadham Puligandla , Judith M. Roldan , Ravi Saraf , Jerzy M. Zalesinski
IPC分类号： H01L21/56 , H01L21/60 , H01L23/485 , H01R4/04 , B05D5/12
CPC分类号： H01L24/10 , H01L21/563 , H01L24/13 , H01L24/27 , H01L24/28 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/1319 , H01L2224/16 , H01L2224/274 , H01L2224/73104 , H01L2224/73203 , H01L2224/8319 , H01L2224/838 , H01L2224/90 , H01L24/90 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , Y10T29/49204 , Y10T29/49222
摘要： A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

4. 发明授权

US5543585A Direct chip attachment (DCA) with electrically conductive adhesives 失效
标题翻译：直接芯片连接（DCA）与导电粘合剂
公开(公告)号：US5543585A
公开(公告)日：1996-08-06
申请号：US190507
申请日：1994-02-02
申请人： Richard B. Booth , Michael A. Gaynes , Robert M. Murco , Viswanadham Puligandla , Judith M. Roldan , Ravi Saraf , Jerzy M. Zalesinski
发明人： Richard B. Booth , Michael A. Gaynes , Robert M. Murco , Viswanadham Puligandla , Judith M. Roldan , Ravi Saraf , Jerzy M. Zalesinski
IPC分类号： H01L21/56 , H01L21/60 , H01L23/485 , H01R4/04 , H05K1/18
CPC分类号： H01L24/10 , H01L21/563 , H01L24/13 , H01L24/27 , H01L24/28 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/1319 , H01L2224/16 , H01L2224/274 , H01L2224/73104 , H01L2224/73203 , H01L2224/8319 , H01L2224/838 , H01L2224/90 , H01L24/90 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , Y10T29/49204 , Y10T29/49222
摘要： A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
摘要翻译：通过直接芯片附件（DCA）进行卡组装的简单过程使用导电粘合剂。两种方法产生具有一层绝缘热塑性和导电性热塑性凸块的相同的中间晶片产品。在锯切或切割晶片以形成芯片之后，使用热和压力将芯片粘附到具有与导电热塑性凸块相匹配的导电焊盘的芯片载体上。芯片可以很容易地使用热去除和更换。

5. 发明授权

US6100523A Micro goniometer for scanning microscopy 失效
标题翻译：用于扫描显微镜的微测角仪
公开(公告)号：US6100523A
公开(公告)日：2000-08-08
申请号：US960692
申请日：1997-10-29
申请人： Arunava Gupta , Ravi Saraf
发明人： Arunava Gupta , Ravi Saraf
IPC分类号： G01B7/30 , G01Q10/00 , G01Q20/04 , G01Q60/38 , G01Q80/00 , G01Q90/00 , G11B5/00 , G11B9/00 , G01N13/12
CPC分类号： G01Q70/06 , B82Y35/00 , G01B7/30 , G01Q20/04 , B82Y10/00 , G11B2005/0002 , G11B9/14 , G11B9/1409 , G11B9/1418 , Y10S977/852 , Y10S977/872
摘要： A goniometer for performing scanning probe microscopy on a substrate surface is disclosed. The goniometer has a cantilever, having a cantilevered end and a supported end and a tip disposed at the cantilevered end of the cantilever. The goniometer also has a block disposed at the supported end of the cantilever. The block has at least one pair of piezoelectric layers, a pair of electrodes disposed about each individual piezoelectric layer such that varying a potential difference applied between the individual electrodes of a pair of electrodes causes the corresponding piezoelectric layer to deform, and a first insulating material disposed between the individual electrodes for insulating the individual electrodes from each other. The individual piezoelectric layers are deformed at different rates resulting in a deformity of the block and tilting of the cantilever and tip connected therewith. Also disclosed are methods of using the goniometer of the present invention to measure the interactive forces between two molecular structures using a scanning probe microscope equipped with a goniometer of the present invention.
摘要翻译：公开了一种用于在衬底表面上执行扫描探针显微镜的测角器。测角器具有悬臂，具有悬臂端和支撑端，以及设置在悬臂悬臂端的尖端。测角器还具有设置在悬臂的支撑端处的块。该块具有至少一对压电层，围绕每个单独的压电层设置的一对电极，使得改变施加在一对电极的各个电极之间的电势差导致相应的压电层变形，并且第一绝缘材料设置在各个电极之间，用于使各个电极彼此绝缘。单个压电层以不同的速率变形，导致块的变形和与其连接的悬臂和尖端的倾斜。还公开了使用本发明的测角器的方法，使用配备有本发明的测角器的扫描探针显微镜来测量两个分子结构之间的相互作用力。

6. 发明授权

US5314709A Unzippable polymer mask for screening operations 失效
标题翻译：不可剥离的聚合物掩模进行筛选操作
公开(公告)号：US5314709A
公开(公告)日：1994-05-24
申请号：US672248
申请日：1991-03-20
申请人： Fuad E. Doany , Gary W. Grube , Ravi Saraf
发明人： Fuad E. Doany , Gary W. Grube , Ravi Saraf
IPC分类号： B41N1/24 , B41C1/055 , B41M1/12 , G03F1/00 , G03F7/12 , H01L21/308 , H01L21/48 , H01L23/12 , H05K1/09 , H05K3/00 , H05K3/02 , H05K3/12 , H01L21/00
CPC分类号： H05K3/1258 , G03F7/12 , G03F7/202 , H01L21/3086 , H01L21/4867 , H05K1/092 , H05K2203/0568 , H05K3/0032 , Y10S438/945
摘要： The present invention relates to a dry process for forming patterns on a substrate. More particularly, the process contemplates coating an unzippable polymer film with a small amount of desirable UV if required on a substrate; laser ablating said film into a desired pattern or mask; screening a conductive or resistive paste onto the substrate through the ablated features of said mask; heating said substrate and mask to the unzipping temperature of said mask; and, vaporizing said mask and UV absorbing dye if present leaving behind the solid of said conductive or resistive past adhered to the substrate in the desired pattern.
摘要翻译：本发明涉及一种在基板上形成图案的干法。更具体地，该方法考虑如果需要在基材上涂覆少量所需UV的不可折叠聚合物膜; 将所述膜激光烧蚀成所需的图案或掩模; 通过所述掩模的烧蚀特征将导电或电阻浆料屏蔽到衬底上; 将所述衬底和掩模加热到所述掩模的解压温度; 并且如果存在的话，蒸发所述掩模和UV吸收染料，使所述导电或电阻性过滤体的固体留在所需图案中附着到基底上。

7. 发明授权

US5288842A Morphological composite materials formed from different precursors 失效
标题翻译：形态复合材料由不同的前体形成
公开(公告)号：US5288842A
公开(公告)日：1994-02-22
申请号：US647957
申请日：1991-01-30
申请人： Claudius Feger , Rodney T. Hodgson , David A. Lewis , Ravi Saraf
发明人： Claudius Feger , Rodney T. Hodgson , David A. Lewis , Ravi Saraf
IPC分类号： C08G59/18 , B01D71/64 , B32B27/00 , C08G8/00 , C08G8/06 , C08G18/70 , C08G18/80 , C08G85/00 , C08J5/00 , C08J5/18 , C08L75/00 , C08L75/04 , C08L79/08 , C08L101/00 , D01F6/94 , C08G69/26
CPC分类号： C08G18/701 , C08G18/8074 , C08J5/00 , C08L101/00 , C08L79/08 , C08G2250/00 , Y10T428/31511 , Y10T428/31551 , Y10T428/31612 , Y10T428/31721 , Y10T428/31855
摘要： A method of producing a multiphase polymer is disclosed whereby the phases have the same chemical structure but have different morphological states and thus different properties. This is achieved by forming a mixture of precursors of the polymer, at least one of the precursors having a reaction rate higher than the other precursor or precursors in the mixture. The precursor having the highest reaction rate is then converted to obtain a composite of a polymer and the precursors that are not polymerized. This mixture might also be formed by mixing a soluble polymer with its precursor. The polymer/precursor composite is processed to obtain the structure having different morphological states by either choosing the reaction conditions to convert the unconverted different morphological states by either choosing the reaction conditions to convert the unconverted precursors such that the obtained polymer differs in it morphology/ properties from the first obtained polymer or by applying stress to the composite and then converting the still unreacted precursor or precursors in the composite such that different morphological states are obtained.
摘要翻译：公开了制备多相聚合物的方法，其中相具有相同的化学结构，但具有不同的形态和因此具有不同的性质。这通过形成聚合物的前体的混合物来实现，至少一种前体的反应速率高于混合物中的其它前体或前体。然后将具有最高反应速率的前体转化成聚合物和未聚合的前体的复合物。该混合物也可以通过将可溶性聚合物与其前体混合而形成。通过选择反应条件以转化未转化的前体使得所得聚合物的形态/性质不同，通过选择反应条件以转化未转化的不同形态状态，处理聚合物/前体复合物以获得具有不同形态的结构从第一获得的聚合物或通过对复合材料施加应力，然后转化复合材料中的未反应的前体或前体，使得获得不同的形态。

8. 发明申请

US20090316157A1 DIRECT DETECTION OF LOCALIZED MODULATION OF ION CONCENTRATION ON AN ELECTRODE-ELECTROLYTE INTERFACE 有权
标题翻译：直接检测离子浓度在电极电解质界面上的局部化调节
公开(公告)号：US20090316157A1
公开(公告)日：2009-12-24
申请号：US12131647
申请日：2008-06-02
申请人： Ravi Saraf , Gaurav Singh
发明人： Ravi Saraf , Gaurav Singh
IPC分类号： G01B9/02 , C25B9/00
CPC分类号： G01N21/45 , C25D21/12 , G01N21/21
摘要： The present invention directly measures localized electrochemical processes on a planar electrode using differential interferometry. The ionic charge accumulation at the electrode-electrolyte interface may be directly measured by using differential interferometry as a function of magnitude and frequency (for example, 2-50 kHz) of an external potential applied on an electrode. Methods in accordance with the present invention probe the ion dynamics confined to the electrical double layer. An electric field is applied using a pure AC potential and a superposition of AC and DC-ramp potential to measure ion concentration and detect redox processes.
摘要翻译：本发明使用差分干涉法直接测量平面电极上的局部电化学过程。可以通过使用差分干涉测量作为施加在电极上的外部电位的幅度和频率（例如2-50kHz）的函数来直接测量电极 - 电解质界面处的离子电荷累积。根据本发明的方法探测限于电双层的离子动力学。使用纯AC电位和AC和DC-ramp电位的叠加来施加电场以测量离子浓度并检测氧化还原过程。

9. 发明授权

US07585431B1 Electrically conductive polymeric materials and use thereof 失效
标题翻译：导电聚合材料及其用途
公开(公告)号：US07585431B1
公开(公告)日：2009-09-08
申请号：US08118475
申请日：1993-09-07
申请人： Ali Afzali-Ardakani , Marie Angelopoulos , Vincent Albert Bourgault , Liam David Comerford , Michael Wayne Mirre , Steven Earle Molis , Ravi Saraf , Jane Margaret Shaw , Peter Joseph Spellane , Niranjan Mohanlal Patel
发明人： Ali Afzali-Ardakani , Marie Angelopoulos , Vincent Albert Bourgault , Liam David Comerford , Michael Wayne Mirre , Steven Earle Molis , Ravi Saraf , Jane Margaret Shaw , Peter Joseph Spellane , Niranjan Mohanlal Patel
IPC分类号： H01B1/24
CPC分类号： H01B1/128 , C08G61/02 , C08G61/123 , C08G75/0209 , C08G75/0295 , C08L53/02 , C08L65/00 , C08L69/00 , C08L79/02 , C08L79/04 , C08L81/02 , C08L81/04 , C08L101/12 , H01B1/00 , H01B1/124 , C08L2666/04 , C08L2666/02 , C08L2666/14
摘要： This invention is concerned with an electrically conductive polymer blend composition which is a liquid compatible blend, comprising a doped product formed form blending a first solution comprising a Lewis base electrically conductive polymer in undoped form in a first organic solvent with a second solution comprising a Lewis acid polymer dopant in a second organic solvent, wherein said Lewis acid polymer dopant dopes said Lewis base electrically conductive polymer in undoped form to obtain said electrically conductive polymer blend, the resulting doped conductive product being soluble in the combination of said first and said second organic solvents and mixable at the molecular level.
摘要翻译：本发明涉及一种导电聚合物共混组合物，其是液体相容的共混物，其包含形成的掺杂产物，其形成为在第一有机溶剂中将包含未掺杂形式的路易斯碱导电聚合物的第一溶液与包含路易斯酸性聚合物掺杂剂，其中所述路易斯酸聚合物掺杂剂以未掺杂形式掺杂所述路易斯碱导电聚合物以获得所述导电聚合物共混物，所得掺杂导电产物可溶于所述第一和所述第二有机溶剂的组合溶剂和分子水平混合。

10. 发明授权

US06552339B1 Micro goniometer for scanning probe microscopy 失效
标题翻译：用于扫描探针显微镜的微测角仪
公开(公告)号：US06552339B1
公开(公告)日：2003-04-22
申请号：US09572209
申请日：2000-05-17
申请人： Arunava Gupta , Ravi Saraf
发明人： Arunava Gupta , Ravi Saraf
IPC分类号： G01N2300
CPC分类号： G01Q70/06 , G01B7/30 , G01Q20/04 , G11B9/14 , G11B9/1409 , G11B9/1418 , G11B2005/0002 , Y10S977/852 , Y10S977/872
摘要： A goniometer for performing scanning probe microscopy on a substrate surface is disclosed. The goniometer has a cantilever, having a cantilevered end and a supported end and a tip disposed at the cantilevered end of the cantilever. The goniometer also has a block disposed at the supported end of the cantilever. The block has at least one pair of piezoelectric layers, a pair of electrodes disposed about each individual piezoelectric layer such that varying a potential difference applied between the individual electrodes of a pair of electrodes causes the corresponding piezoelectric layer to deform, and a first insulating material disposed between the individual electrodes for insulating the individual electrodes from each other. The individual piezoelectric layers are deformed at different rates resulting in a deformity of the block and tilting of the cantilever and tip connected therewith. Also disclosed are methods of using the goniometer of the present invention to measure the interactive forces between two molecular structures using a scanning probe microscope equipped with a goniometer of the present invention.
摘要翻译：公开了一种用于在衬底表面上执行扫描探针显微镜的测角器。测角器具有悬臂，具有悬臂端和支撑端，以及设置在悬臂悬臂端的尖端。测角器还具有设置在悬臂的支撑端处的块。该块具有至少一对压电层，围绕每个单独的压电层设置的一对电极，使得改变施加在一对电极的各个电极之间的电势差导致相应的压电层变形，并且第一绝缘材料设置在各个电极之间，用于使各个电极彼此绝缘。单个压电层以不同的速率变形，导致块的变形和与其连接的悬臂和尖端的倾斜。还公开了使用本发明的测角器的方法，使用配备有本发明的测角器的扫描探针显微镜来测量两个分子结构之间的相互作用力。

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