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    • 6. 发明授权
    • Electroless metal adhesion to organic dielectric material with phase
separated morphology
    • 无机金属与相分离形态的有机介电材料粘合
    • US5310580A
    • 1994-05-10
    • US874665
    • 1992-04-27
    • Eugene J. O'SullivanTerrence R. O'TooleJudith M. RoldanLubomyr T. RomankiwCarlos J. SambucettiRavi Saraf
    • Eugene J. O'SullivanTerrence R. O'TooleJudith M. RoldanLubomyr T. RomankiwCarlos J. SambucettiRavi Saraf
    • B05D1/34C23C18/20H05K3/18H05K3/38B05D2/06
    • H05K3/387B05D1/34C23C18/20C23C18/2033C23C18/208C23C18/24C23C18/30H05K2201/0154H05K2201/0212H05K2203/0759H05K2203/0773H05K2203/0793H05K3/181H05K3/381
    • Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
    • 沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。 在一个实施方案中,可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。 在暴露于碱性溶液时,以比另一相更快的速率蚀刻一相。 在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。 在第二个实施方案中,将极性溶剂,接种剂,可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中,并加热形成三相。 固化前体由于相分离而导致表面粗糙化。 暴露在碱性溶液中时,以更快的速率蚀刻聚合物相之一并同时打开接种胶体。 粗糙表面用光致抗蚀剂涂覆,曝光和显影。 随后的无电金属沉积导致金属与电介质层粘附性的改善。 该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。