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1. 发明授权

US06969436B2 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 失效
标题翻译：制造印刷电路板元件Z轴互连组件的方法和结构
公开(公告)号：US06969436B2
公开(公告)日：2005-11-29
申请号：US10640484
申请日：2003-08-13
申请人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
发明人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
IPC分类号： B32B3/24 , H01L21/48 , H01L23/02 , H01L23/498 , H05K3/40 , H05K3/46 , H01B13/00 , B31B1/60
CPC分类号： B32B3/266 , H01L21/4857 , H01L23/49833 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K3/4652 , H05K2201/0394 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T428/24917 , Y10T428/2804
摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
摘要翻译：一种形成用于接合的构件以形成复合布线板的方法。该构件包括电介质基片。将胶带施加到所述基底的至少一个面上。至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。在每个开口中分配导电材料并部分固化。去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

2. 发明授权

US06818972B2 Reduction of chip carrier flexing during thermal cycling 失效
标题翻译：在热循环期间减少芯片载体弯曲
公开(公告)号：US06818972B2
公开(公告)日：2004-11-16
申请号：US10262023
申请日：2002-09-30
申请人： Lisa J. Jimarez , Miguel A. Jimarez
发明人： Lisa J. Jimarez , Miguel A. Jimarez
IPC分类号： H01L23495
CPC分类号： H01L23/49822 , B32B15/08 , H01L23/142 , H01L2224/16225 , H01L2924/01322 , H05K1/0271 , H05K3/4602 , H05K2201/0949 , H05K2201/09781 , H05K2201/10674 , H05K2201/10734 , Y10T428/125 , Y10T428/12528 , Y10T428/24917 , H01L2924/00
摘要： A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ring on a periphery of the chip carrier. Without the stiffener ring, the chip carrier is able to undergo natural flexing (in contrast with constrained flexing) in response to a temperature change that induces thermal strains due to a mismatch in coefficient of thermal expansion between the chip and the chip carrier. If the temperature at the chip carrier changes from room temperature to a temperature of about −40° C., a maximum thermally induced displacement of a surface of the chip carrier is at least about 25% less if the stiffener ring is absent than if the stiffener ring is present. Since a propensity for cracking of the stiff chip carrier increases as the thermally induced displacement increases, the present invention, which avoids use of the stiffener ring, improves a structural integrity of the chip carrier.
摘要翻译：用于减少热循环期间芯片载体弯曲的方法和结构。半导体芯片耦合到刚性芯片载体（即具有至少约3×10 5 psi的弹性模量的芯片载体），并且在芯片载体的外围没有加强环。没有加强环，芯片载体响应于由于芯片和芯片载体之间的热膨胀系数不匹配而引起热应变的温度变化，能够经受自然弯曲（与受限制的弯曲相反）。如果芯片载体上的温度从室温变化到约-40℃的温度，如果加强环不存在，则芯片载体的表面的最大热诱导位移比如下存在加强环。由于热引起的位移增加，刚性芯片载体的开裂倾向增加，所以避免使用加强环的本发明改善了芯片载体的结构完整性。

3. 发明授权

US06805280B2 Z interconnect structure and method 失效
标题翻译： Z互连结构和方法
公开(公告)号：US06805280B2
公开(公告)日：2004-10-19
申请号：US10041261
申请日：2002-01-08
申请人： Lisa J. Jimarez , Mark V. Pierson
发明人： Lisa J. Jimarez , Mark V. Pierson
IPC分类号： B23K120
CPC分类号： H05K3/462 , H05K3/321 , H05K3/3463 , H05K3/3484 , H05K3/4623 , H05K2201/096
摘要： The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
摘要翻译：本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

4. 发明授权

US07718902B2 Z interconnect structure and method 有权
标题翻译： Z互连结构和方法
公开(公告)号：US07718902B2
公开(公告)日：2010-05-18
申请号：US10937654
申请日：2004-09-09
申请人： Lisa J. Jimarez , Mark V. Pierson
发明人： Lisa J. Jimarez , Mark V. Pierson
IPC分类号： H05K1/03
CPC分类号： H05K3/462 , H05K3/321 , H05K3/3463 , H05K3/3484 , H05K3/4623 , H05K2201/096
摘要： The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
摘要翻译：本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。

5. 发明授权

US07303639B2 Method for producing Z-axis interconnection assembly of printed wiring board elements 失效
标题翻译：印制电路板元件Z轴互连组件的制造方法
公开(公告)号：US07303639B2
公开(公告)日：2007-12-04
申请号：US11208982
申请日：2005-08-22
申请人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
发明人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
IPC分类号： H01B13/00 , B32B3/00
CPC分类号： B32B3/266 , H01L21/4857 , H01L23/49833 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K3/4652 , H05K2201/0394 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T428/24917 , Y10T428/2804
摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
摘要翻译：一种形成用于接合的构件以形成复合布线板的方法。该构件包括电介质基片。将胶带施加到所述基底的至少一个面上。至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。将导电材料分配到每个开口中并部分固化。去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

6. 发明授权

US06836015B2 Optical assemblies for transmitting and manipulating optical beams 失效
标题翻译：用于传输和操纵光束的光学组件
公开(公告)号：US06836015B2
公开(公告)日：2004-12-28
申请号：US10428960
申请日：2003-05-02
申请人： Monty M. Denneau , Dinesh Gupta , Lisa J. Jimarez , Steven Ostrander , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
发明人： Monty M. Denneau , Dinesh Gupta , Lisa J. Jimarez , Steven Ostrander , Brenda L. Peterson , Mark V. Pierson , Eugen Schenfeld , Subhash L. Shinde
IPC分类号： H01L2334
CPC分类号： G02B6/3522 , G02B6/2817 , G02B6/3544 , G02B6/3574 , G02B6/3598 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4249 , G02B6/4259 , G02B6/4269 , G02B6/4281 , G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.
摘要翻译：提供用于引导光束的光学立方体和光学立方体组件。光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。光学立方体可以包括用于引导光束的双向或多方向光束引导元件。光学立方体组件可以包括附接到光学立方体的柔性芯片组件。芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

7. 发明授权

US06638607B1 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements 有权
标题翻译：制造印刷电路板元件Z轴互连组件的方法和结构
公开(公告)号：US06638607B1
公开(公告)日：2003-10-28
申请号：US10285162
申请日：2002-10-30
申请人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
发明人： Brian E. Curcio , Donald S. Farquhar , Lisa J. Jimarez , Keith P. Brodock
IPC分类号： B32B300
CPC分类号： B32B3/266 , H01L21/4857 , H01L23/49833 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K3/4652 , H05K2201/0394 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T156/10 , Y10T156/1052 , Y10T156/1062 , Y10T428/24917 , Y10T428/2804
摘要： A method of forming a member for joining to form a composite wiring board. The member includes a dielectric substrate. Adhesive tape is applied to at least one face of said substrate. At least one opening is formed through the substrate extending from one face to the other and through each adhesive tape. An electrically conductive material is dispensed in each of the openings and partially cured. The adhesive tape is removed to allow a nub of the conductive material to extend above the substrate face to form a wiring structure with other elements.
摘要翻译：一种形成用于接合的构件以形成复合布线板的方法。该构件包括电介质基片。将胶带施加到所述基底的至少一个面上。至少一个开口通过基板形成，从一个面延伸到另一个面并通过每个胶带。在每个开口中分配导电材料并部分固化。去除粘合带以允许导体材料的一个部分在衬底表面上方延伸以形成具有其它元件的布线结构。

8. 发明授权

US06961995B2 Method of making an electronic package 失效
公开(公告)号：US06961995B2
公开(公告)日：2005-11-08
申请号：US10251072
申请日：2002-09-19
申请人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
发明人： Lisa J. Jimarez , Miguel A. Jimarez , Voya R. Markovich , Cynthia S. Milkovich , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L21/44 , H01L21/48 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/34 , H05K3/40 , H05K3/46 , H01K3/10 , B44C1/22 , C03C15/00 , H05K7/12 , C23E1/00
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/15 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , H05K1/113 , H05K3/3436 , H05K3/3457 , H05K3/4053 , H05K3/4069 , H05K3/4605 , H05K3/4644 , H05K3/4688 , H05K2201/0133 , H05K2201/015 , H05K2201/09436 , H05K2201/09509 , H05K2201/10734 , H05K2203/061 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , H01L2924/00
摘要： An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

9. 发明授权

US06757967B2 Method of forming a chip assembly 失效
标题翻译：形成芯片组件的方法
公开(公告)号：US06757967B2
公开(公告)日：2004-07-06
申请号：US10119134
申请日：2002-04-09
申请人： Lisa J. Jimarez , Miguel A. Jimarez
发明人： Lisa J. Jimarez , Miguel A. Jimarez
IPC分类号： H05K330
CPC分类号： H01L23/16 , H01L23/36 , H01L23/50 , H01L25/0655 , H01L2224/16 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , Y10S269/90 , Y10T29/49128 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T29/49169 , Y10T29/49993 , Y10T29/53265
摘要： A chip mounting assembly is provided which includes a dielectric substrate having at least one integrated circuit (I/C) chip mounted thereon. An electrically conductive cover plate is in contact with all the chips with an electrically non-conducting thermally conducting adhesive. A stiffener member is provided which is mounted ante substrate and laterally spaced from the integrated circuit chip. At least one electrically conductive ground pad is formed an the substrate. The stiffener member has at least one through opening therein and electrically conductive adhesive extending through each opening and contacting the cover plate and each ground pad. The invention also provides a method of forming such an I/C chip assembly.
摘要翻译：提供了一种芯片安装组件，其包括具有安装在其上的至少一个集成电路（I / C）芯片的电介质基板。导电盖板与具有不导电导热粘合剂的所有芯片接触。提供了一种加强构件，其被安装在前底座上并与集成电路芯片横向隔开。至少一个导电接地焊盘形成为衬底。加强件在其中具有至少一个通孔，并且导电粘合剂延伸穿过每个开口并接触盖板和每个接地垫。本发明还提供了一种形成这种I / C芯片组件的方法。

10. 发明授权

US06734368B1 Metal backed printed circuit board assemblies 失效
标题翻译：金属背衬印刷电路板组件
公开(公告)号：US06734368B1
公开(公告)日：2004-05-11
申请号：US08890582
申请日：1997-07-09
申请人： Lisa J. Jimarez , David N. Light
发明人： Lisa J. Jimarez , David N. Light
IPC分类号： H05K103
CPC分类号： H05K3/0061 , H05K3/321 , Y10T29/49124
摘要： A method for conductively bonding a printed circuit board to a metal back plate is provided. The method includes the steps of providing a dielectric substrate that is metallized on its two faces; providing a metallic back plate; and bonding the metallic back plate to one of the metallized faces of the substrate using an electrically conductive adhesive that includes an adhesive polymer and at least one conductive metal having an electromagnetic force (EMF) that is equal to or less than one volt. The present invention also relates to a printed circuit board assembly which includes printed circuit board which includes a dielectric substrate having a first circuitized metallic layer disposed on one opposing face of the substrate and a second metallic layer disposed on the other opposing face of said substrate; a metal back plate; and an electrically conductive bonding layer disposed between the plate and the second metallic layer of the printed circuit board. The electrically conductive bonding layer contains an adhesive polymer and a conductive metal having an EMF that is less than one volt. The electrically conductive bonding layer is substantially free of silver.
摘要翻译：提供一种用于将印刷电路板导电地接合到金属背板的方法。该方法包括以下步骤：提供在其两个表面上金属化的电介质基板; 提供金属背板; 以及使用包括粘合剂聚合物和至少一种具有等于或小于1伏的电磁力（EMF）的导电金属的导电粘合剂将所述金属背板接合到所述基板的金属化表面之一。本发明还涉及一种印刷电路板组件，其包括印刷电路板，该印刷电路板包括具有设置在基板的一个相对面上的第一电路化金属层的电介质基板和设置在所述基板的另一相对面上的第二金属层; 金属背板以及设置在印刷电路板的板和第二金属层之间的导电接合层。导电接合层包含粘合剂聚合物和具有小于1伏特的EMF的导电金属。导电接合层基本上不含银。

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