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1. 发明授权

US5541005A Large ceramic article and method of manufacturing 失效
标题翻译：大型陶瓷制品及其制造方法
公开(公告)号：US5541005A
公开(公告)日：1996-07-30
申请号：US438825
申请日：1995-05-11
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/105
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译：一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

2. 发明授权

US5439636A Large ceramic articles and method of manufacturing 失效
标题翻译：大型陶瓷制品及其制造方法
公开(公告)号：US5439636A
公开(公告)日：1995-08-08
申请号：US836675
申请日：1992-02-18
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/00
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译：一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

3. 发明授权

US5787578A Method of selectively depositing a metallic layer on a ceramic substrate 失效
标题翻译：在金属层上选择性地沉积金属层的方法
公开(公告)号：US5787578A
公开(公告)日：1998-08-04
申请号：US677257
申请日：1996-07-09
申请人： Shaji Farooq , Suryanarayana Kaja , John U. Knickerbocker , Brenda Peterson , Srinivasan N. Reddy , Rao V. Vallabhaneni , Donald R. Wall
发明人： Shaji Farooq , Suryanarayana Kaja , John U. Knickerbocker , Brenda Peterson , Srinivasan N. Reddy , Rao V. Vallabhaneni , Donald R. Wall
IPC分类号： H01L21/48 , H01L23/498 , H05K3/24 , H01R9/00
CPC分类号： H05K3/248 , H01L21/4846 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K2203/0285 , H05K3/04 , Y10T29/49149 , Y10T29/49163
摘要： Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.
摘要翻译：公开了一种在陶瓷基板上的金属特征上选择性地沉积金属层的方法。金属层优选可以是元素镍颗粒，元素铜颗粒，铜和镍颗粒的混合物，或铜/镍合金颗粒。金属层以包含金属颗粒和粘合剂材料的糊状混合物沉积。通过随后的加热步骤，金属层紧密地结合到金属特征，但是仅松散地结合到陶瓷基底。此后，施加超声波处理以去除陶瓷基板上的松散粘附的金属层。通过超声波处理，金属层上的紧密结合的金属层不被除去。

4. 发明授权

US5302562A Method of controlling the densification behavior of a metallic feature in a ceramic material 失效
标题翻译：控制陶瓷材料中金属特征的致密化行为的方法
公开(公告)号：US5302562A
公开(公告)日：1994-04-12
申请号：US967596
申请日：1992-10-28
申请人： Raschid J. Bezama , Donald R. Wall
发明人： Raschid J. Bezama , Donald R. Wall
IPC分类号： C04B35/622 , C04B35/74 , C04B38/06 , H05K3/40 , H05K3/46 , B22F7/04
CPC分类号： C04B35/74 , C04B38/068
摘要： Disclosed is a method of controlling the densification behavior of a metallic feature in a ceramic material, the method including the steps of:obtaining an unsintered ceramic material having at least one metallic feature therein;providing at least the metallic feature with a predetermined amount of carbonaceous material;heating the ceramic material and metallic feature to a predetermined temperature sufficient to cause sintering of the ceramic material, the metallic feature being at least partially inhibited from densifying at the predetermined temperature by the presence of the carbonaceous material.key aspect of the invention is subsequently removing with an oxidizing ambient some or, all of the carbonaceous residue at a predetermined temperature for the optimization of the physical characterization of the fired metallic component in ceramic material without adversely affecting distortion and alignment of the metallic feature.
摘要翻译：公开了一种控制陶瓷材料中的金属特征的致密化行为的方法，所述方法包括以下步骤：获得其中具有至少一种金属特征的未烧结陶瓷材料; 至少提供具有预定量的碳质材料的金属特征; 将陶瓷材料和金属特征加热到足以引起陶瓷材料烧结的预定温度，金属特征至少部分地被预防温度下的碳质材料的抑制致密化。本发明的关键方面随后用氧化环境中的一些或全部碳质残余物在预定温度下去除，以优化陶瓷材料中烧制的金属组分的物理表征，而不会不利地影响金属特征的变形和对准。

5. 发明授权

US08107800B2 Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing 有权
标题翻译：控制快速热处理过程中半导体晶片热梯度的方法和结构
公开(公告)号：US08107800B2
公开(公告)日：2012-01-31
申请号：US11970693
申请日：2008-01-08
申请人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
发明人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
IPC分类号： F26B19/00
CPC分类号： H01L21/6875 , H01L21/67103
摘要： An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
摘要翻译：物品在热处理过程中支撑工件。至少三个细长的支撑构件，例如支撑销，从诸如用于支撑工件的支撑臂的元件向上延伸。每个支撑构件包括与工件相邻的第一部分。第二部分从第一部分向下延伸。第一部分可以具有比工件的热响应更快的热响应，并且第二部分可以具有较慢的热响应。可移动元件可以安装到支撑构件上，以调节支撑构件的热响应。使用可移除元件，可以调节支撑构件，使得不会向工件或从工件传出热量的净传递。

6. 发明申请

US20090175606A1 METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR WAFERS DURING RAPID THERMAL PROCESSING 有权
标题翻译：在快速热处理过程中控制半导体波形热梯度的方法和结构
公开(公告)号：US20090175606A1
公开(公告)日：2009-07-09
申请号：US11970693
申请日：2008-01-08
申请人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
发明人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
IPC分类号： H01L21/67
CPC分类号： H01L21/6875 , H01L21/67103
摘要： An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
摘要翻译：物品在热处理过程中支撑工件。至少三个细长的支撑构件，例如支撑销，从诸如用于支撑工件的支撑臂的元件向上延伸。每个支撑构件包括与工件相邻的第一部分。第二部分从第一部分向下延伸。第一部分可以具有比工件的热响应更快的热响应，并且第二部分可以具有较慢的热响应。可移动元件可以安装到支撑构件上，以调节支撑构件的热响应。使用可移除元件，可以调节支撑构件，使得不会向工件或从工件传出热量的净传递。

7. 发明授权

US5260519A Multilayer ceramic substrate with graded vias 失效
标题翻译：具有分级通孔的多层陶瓷基板
公开(公告)号：US5260519A
公开(公告)日：1993-11-09
申请号：US949595
申请日：1992-09-23
申请人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
发明人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
IPC分类号： H01L23/12 , H01L21/48 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K3/4061 , H01L21/486 , H01L23/49827 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/0269 , H05K2201/096 , H05K3/4611 , H05K3/4629
摘要： Disclosed is a multilayer ceramic substrate for electronic applications including:(a) at least one internal layer having vias filled with a metallic material;(b) at least one sealing layer having vias filled with a composite material that is a mixture of ceramic and metallic materials; and(c) at least one transition layer located between the internal and sealing layers having vias filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias.Also disclosed is a method of forming the multilayer ceramic substrate.

8. 发明授权

US5869134A CVD of metals capable of receiving nickel or alloys thereof using iodide 失效
标题翻译：能够使用碘化物接受镍的金属或其合金的CVD
公开(公告)号：US5869134A
公开(公告)日：1999-02-09
申请号：US668295
申请日：1996-06-21
申请人： Srinivasa S. N. Reddy , John U. Knickerbocker , Donald R. Wall
发明人： Srinivasa S. N. Reddy , John U. Knickerbocker , Donald R. Wall
IPC分类号： C23C16/08 , C23C16/44 , H01L21/28 , H01L21/285 , H05K3/24 , C23C16/06
CPC分类号： C23C16/08 , C23C16/44 , H05K3/244 , Y10T428/12944 , Y10T428/12965
摘要： The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving nickel or alloys thereof, using an Iodide source, preferably an Iodide salt, such as, Copper Iodide.
摘要翻译：本发明公开了一种CVD（化学气相沉积）方法，其中镍或其合金，例如Ni / Cu，Ni / Co沉积在能够使用碘化物源，能够接收镍或其合金的金属表面上，优选地碘盐，如碘化铜。

9. 发明授权

US5293504A Multilayer ceramic substrate with capped vias 失效
标题翻译：多层陶瓷基板带有通孔
公开(公告)号：US5293504A
公开(公告)日：1994-03-08
申请号：US949598
申请日：1992-09-23
申请人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
发明人： John U. Knickerbocker , Charles H. Perry , Donald R. Wall
IPC分类号： H01L23/12 , H01L23/498 , H01L23/538 , H05K1/03 , H05K1/11 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K3/4061 , H01L23/49866 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/0269 , H05K2201/0352 , H05K2201/096 , H05K3/4611 , H05K3/4629
摘要： Disclosed is a multilayer ceramic substrate for electronic applications including:(a) at least one internal layer having vias at least partially filled with a metallic material;(b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer; and(c) a cap of material interposed between the aligned vias.Also disclosed is a method of forming the multilayer ceramic substrate.
摘要翻译：公开了一种用于电子应用的多层陶瓷基板，包括：（a）至少一个内部层，其具有至少部分地填充有金属材料的通孔; （b）至少一个密封层，其具有至少部分填充有陶瓷和金属材料的混合物的复合材料的通孔，其中来自内层的至少一个通孔与来自密封层的至少一个通孔对准; 和（c）插入在对齐的通孔之间的材料盖。还公开了形成多层陶瓷基板的方法。

10. 发明授权

US07294909B2 Electronic package repair process 有权
标题翻译：电子封装修复过程
公开(公告)号：US07294909B2
公开(公告)日：2007-11-13
申请号：US11099161
申请日：2005-04-05
申请人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
发明人： Jon A. Casey , James G. Balz , Michael Berger , Jerome Cohen , Charles Hendricks , Richard Indyk , Mark LaPlante , David C. Long , Lori A. Maiorino , Arthur G. Merryman , Glenn A. Pomerantz , Robert A. Rita , Krystyna W. Semkow , Patrick E. Spencer , Brian R. Sundlof , Richard P. Surprenant , Donald R. Wall , Thomas A. Wassick , Kathleen M. Wiley
IPC分类号： H01L27/148 , H01L29/768
CPC分类号： H05K3/225 , H01L21/4846 , H01L23/49811 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/0029 , H05K3/4629 , H05K2203/173 , Y10T29/49124 , Y10T29/49135 , H01L2924/00
摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.
摘要翻译：一种多层陶瓷修复工艺，提供了一个新的电气修复路径，以连接顶面通孔。修复路径是建立在有缺陷的网和包含在多层陶瓷基板内的冗余修复网之间。有缺陷的网和修复网各自终止在基板的表面通孔处。使用激光器在基板上和基板上形成点火电路。之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。

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