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1. 发明授权

US5541005A Large ceramic article and method of manufacturing 失效
标题翻译：大型陶瓷制品及其制造方法
公开(公告)号：US5541005A
公开(公告)日：1996-07-30
申请号：US438825
申请日：1995-05-11
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katherine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sarah H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/105
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译：一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

2. 发明授权

US5302562A Method of controlling the densification behavior of a metallic feature in a ceramic material 失效
标题翻译：控制陶瓷材料中金属特征的致密化行为的方法
公开(公告)号：US5302562A
公开(公告)日：1994-04-12
申请号：US967596
申请日：1992-10-28
申请人： Raschid J. Bezama , Donald R. Wall
发明人： Raschid J. Bezama , Donald R. Wall
IPC分类号： C04B35/622 , C04B35/74 , C04B38/06 , H05K3/40 , H05K3/46 , B22F7/04
CPC分类号： C04B35/74 , C04B38/068
摘要： Disclosed is a method of controlling the densification behavior of a metallic feature in a ceramic material, the method including the steps of:obtaining an unsintered ceramic material having at least one metallic feature therein;providing at least the metallic feature with a predetermined amount of carbonaceous material;heating the ceramic material and metallic feature to a predetermined temperature sufficient to cause sintering of the ceramic material, the metallic feature being at least partially inhibited from densifying at the predetermined temperature by the presence of the carbonaceous material.key aspect of the invention is subsequently removing with an oxidizing ambient some or, all of the carbonaceous residue at a predetermined temperature for the optimization of the physical characterization of the fired metallic component in ceramic material without adversely affecting distortion and alignment of the metallic feature.
摘要翻译：公开了一种控制陶瓷材料中的金属特征的致密化行为的方法，所述方法包括以下步骤：获得其中具有至少一种金属特征的未烧结陶瓷材料; 至少提供具有预定量的碳质材料的金属特征; 将陶瓷材料和金属特征加热到足以引起陶瓷材料烧结的预定温度，金属特征至少部分地被预防温度下的碳质材料的抑制致密化。本发明的关键方面随后用氧化环境中的一些或全部碳质残余物在预定温度下去除，以优化陶瓷材料中烧制的金属组分的物理表征，而不会不利地影响金属特征的变形和对准。

3. 发明申请

US20090175606A1 METHOD AND STRUCTURE TO CONTROL THERMAL GRADIENTS IN SEMICONDUCTOR WAFERS DURING RAPID THERMAL PROCESSING 有权
标题翻译：在快速热处理过程中控制半导体波形热梯度的方法和结构
公开(公告)号：US20090175606A1
公开(公告)日：2009-07-09
申请号：US11970693
申请日：2008-01-08
申请人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
发明人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
IPC分类号： H01L21/67
CPC分类号： H01L21/6875 , H01L21/67103
摘要： An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
摘要翻译：物品在热处理过程中支撑工件。至少三个细长的支撑构件，例如支撑销，从诸如用于支撑工件的支撑臂的元件向上延伸。每个支撑构件包括与工件相邻的第一部分。第二部分从第一部分向下延伸。第一部分可以具有比工件的热响应更快的热响应，并且第二部分可以具有较慢的热响应。可移动元件可以安装到支撑构件上，以调节支撑构件的热响应。使用可移除元件，可以调节支撑构件，使得不会向工件或从工件传出热量的净传递。

4. 发明授权

US08107800B2 Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing 有权
标题翻译：控制快速热处理过程中半导体晶片热梯度的方法和结构
公开(公告)号：US08107800B2
公开(公告)日：2012-01-31
申请号：US11970693
申请日：2008-01-08
申请人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
发明人： Raschid J. Bezama , Lewis S. Goldmann , Donald R. Wall
IPC分类号： F26B19/00
CPC分类号： H01L21/6875 , H01L21/67103
摘要： An article supports a workpiece during thermal processing. At least three elongated support members, e.g., support pins, extend upwardly from an element such as support arms for supporting the workpiece. Each of the support members includes a first portion adjacent to the workpiece. A second portion extends downwardly from the first portion. The first portion can have a thermal response faster than the thermal response of the workpiece and the second portion can have a slower thermal response. A removable element may be mounted to the support member for adjusting the thermal response of the support member. With removable elements, the support members can be adjusted to cause no net transfer of heat to or from the workpiece.
摘要翻译：物品在热处理过程中支撑工件。至少三个细长的支撑构件，例如支撑销，从诸如用于支撑工件的支撑臂的元件向上延伸。每个支撑构件包括与工件相邻的第一部分。第二部分从第一部分向下延伸。第一部分可以具有比工件的热响应更快的热响应，并且第二部分可以具有较慢的热响应。可移动元件可以安装到支撑构件上，以调节支撑构件的热响应。使用可移除元件，可以调节支撑构件，使得不会向工件或从工件传出热量的净传递。

5. 发明授权

US5439636A Large ceramic articles and method of manufacturing 失效
标题翻译：大型陶瓷制品及其制造方法
公开(公告)号：US5439636A
公开(公告)日：1995-08-08
申请号：US836675
申请日：1992-02-18
申请人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
发明人： Raschid J. Bezama , Jon A. Casey , Mario E. Ecker , Shaji Farooq , Irene S. Frantz , Katharine G. Frase , David H. Gabriels , Lester W. Herron , John U. Knickerbocker , Sara H. Knickerbocker , Govindarajan Natarajan , John Thomson , Yee-Ming Ting , Sharon L. Tracy , Robert M. Troncillito , Vivek M. Sura , Donald R. Wall , Giai V. Yen
IPC分类号： B28B11/02 , H01L21/48 , H01L21/768 , H01L23/15 , H01L23/522 , H05K1/03 , H05K1/14 , H05K3/46 , B22F3/00
CPC分类号： H05K1/142 , H01L21/4807 , H01L23/15 , H05K3/46 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09972 , Y10T428/12049 , Y10T428/12146 , Y10T428/16 , Y10T428/163 , Y10T428/166 , Y10T428/192
摘要： A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.
摘要翻译：一种用于电子应用的大型陶瓷衬底制品，包括至少一层烧结陶瓷材料，该层包括多个边缘到边缘连接的陶瓷材料毛坯块。还公开了一种制造大型陶瓷毛坯制品的方法以及大型陶瓷基片制品。

6. 发明申请

US20120325667A1 MULTI-ANODE SYSTEM FOR UNIFORM PLATING OF ALLOYS 失效
标题翻译：用于均匀镀合金的多阳极系统
公开(公告)号：US20120325667A1
公开(公告)日：2012-12-27
申请号：US13604666
申请日：2012-09-06
申请人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
发明人： Charles L. Arvin , Raschid J. Bezama , Harry D. Cox , Krystyna W. Semkow
IPC分类号： C25D3/00 , C25D3/56 , C25D21/12
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译：公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例。该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。

7. 发明申请

US20120043217A1 Rinsing and drying for electrochemical processing 有权
标题翻译：电化学处理的冲洗和干燥
公开(公告)号：US20120043217A1
公开(公告)日：2012-02-23
申请号：US12806730
申请日：2010-08-19
申请人： Charles L. Arvin , Raschid J. Bezama , Hariklia Deligianni
发明人： Charles L. Arvin , Raschid J. Bezama , Hariklia Deligianni
IPC分类号： C25D17/00 , C25F3/00 , C25D3/00
CPC分类号： C25D17/00 , C25D5/48 , C25D21/08 , C25F3/02 , C25F3/12 , C25F7/00
摘要： An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.
摘要翻译：一种电镀/蚀刻装置，包括存在于含有用于电镀/蚀刻工艺的电解质的罐的流体射流和干燥器。流体射流和干燥器从被电镀或蚀刻的部件，例如工作电极上去除多余的液体，例如电解质。工作电极存在于在电镀或蚀刻操作期间从罐中的第一位置穿过到包含电镀电解质外侧的第二位置的保持器。当保持器处于第二位置时，流体喷射器冲洗工作电极，并且强制空气干燥器将来自流体射流和电解质的任何剩余流体从工作电极吹入罐中。

8. 发明申请

US20120043216A1 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元件电化学处理工作电极设计
公开(公告)号：US20120043216A1
公开(公告)日：2012-02-23
申请号：US12806719
申请日：2010-08-19
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/10 , C25D7/00 , C25D5/00
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：提供一种电镀设备，其包括用于容纳电镀液的镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

9. 发明申请

US20100117209A1 MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS 审中-公开
标题翻译：具有冷却方式的半导体芯片上的多个芯片
公开(公告)号：US20100117209A1
公开(公告)日：2010-05-13
申请号：US11680311
申请日：2007-02-28
申请人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
发明人： Raschid J. Bezama , Minhua Lu , Lawrence S. Mok
IPC分类号： H01L23/52 , H01L23/46
CPC分类号： H01L23/427 , F28D15/046 , H01L25/065 , H01L25/18 , H01L2224/05001 , H01L2224/05009 , H01L2224/05026 , H01L2224/05568 , H01L2224/0557 , H01L2224/05647 , H01L2224/16145 , H01L2224/16225 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/15311 , H01L2224/05099
摘要： The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring heat away from the semiconductor chips. Another embodiment is to construct a vapor chamber with a substrate such that at least one multiple chip stack is embedded inside the vapor chamber.
摘要翻译：本发明涉及一种利用内置高效冷却装置在多个半导体芯片上封装多个半导体芯片的方法。一个实施例是将两个多个芯片堆放置在蒸气室的相对侧上，以将热量从半导体芯片传送出去。另一个实施例是构造具有衬底的蒸汽室，使得至少一个多个芯片堆叠被嵌入在蒸气室内。

10. 发明授权

US07536870B2 High power microjet cooler 失效
标题翻译：大功率微型喷墨冷却器
公开(公告)号：US07536870B2
公开(公告)日：2009-05-26
申请号：US11308504
申请日：2006-03-30
申请人： Raschid J. Bezama , Govindarajan Natarajan
发明人： Raschid J. Bezama , Govindarajan Natarajan
IPC分类号： F28D5/00
CPC分类号： H01L23/4735 , F28F3/12 , F28F13/02 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.
摘要翻译：一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化热系统在给定的最大工作压力。

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