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1. 发明授权

US08926820B2 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元器件电化学处理工作电极设计
公开(公告)号：US08926820B2
公开(公告)日：2015-01-06
申请号：US13612661
申请日：2012-09-12
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D21/00 , C25D17/02 , C25D17/12 , C25D7/12 , C25D5/04 , C25D17/00
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：一种电镀设备，包括用于容纳电镀电解质的电镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

2. 发明授权

US08784618B2 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元件电化学处理工作电极设计
公开(公告)号：US08784618B2
公开(公告)日：2014-07-22
申请号：US12806719
申请日：2010-08-19
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/00 , C25D7/12
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：提供一种电镀设备，其包括用于容纳电镀液的镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

3. 发明申请

US20120043216A1 Working electrode design for electrochemical processing of electronic components 有权
标题翻译：电子元件电化学处理工作电极设计
公开(公告)号：US20120043216A1
公开(公告)日：2012-02-23
申请号：US12806719
申请日：2010-08-19
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/10 , C25D7/00 , C25D5/00
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：提供一种电镀设备，其包括用于容纳电镀液的镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

4. 发明申请

US20130062209A1 WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRONIC COMPONENTS 有权
标题翻译：电子元器件电化学处理工作电极设计
公开(公告)号：US20130062209A1
公开(公告)日：2013-03-14
申请号：US13612661
申请日：2012-09-12
申请人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
发明人： Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
IPC分类号： C25D17/02 , C25D21/12 , C25D17/12
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译：一种电镀设备，包括用于容纳电镀电解质的电镀槽。对电极，例如阳极，存在于镀槽的第一部分中。阴极系统存在于镀槽的第二部分中。阴极系统包括工作电极和小偷电极。小电极存在于工作电极和对电极之间。防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

5. 发明授权

US5562320A Gripper head 失效
标题翻译：夹爪头
公开(公告)号：US5562320A
公开(公告)日：1996-10-08
申请号：US334668
申请日：1994-11-04
申请人： Jeffrey A. Bloomberg , Peter O. Johnson , James A. Landor , Matthew W. Naughton , Tracy A. Tong
发明人： Jeffrey A. Bloomberg , Peter O. Johnson , James A. Landor , Matthew W. Naughton , Tracy A. Tong
IPC分类号： B25J15/02 , B25J15/08
CPC分类号： B25J15/0253 , Y10S294/902
摘要： A gripping apparatus comprising a body having a fastener for attaching the body to an automated manufacturing device, a pair of jaws slidably attached to the body, each jaw projecting away from the body, a jaw driver for opening and closing the jaws, the movement of each jaw defining one range of motion, a pair of fingers, each of which extending from and movably attached to a corresponding jaw, and a finger driver connected to open and close the fingers, the movement of each finger defining another range of motion, one range of motion being significantly smaller than the other range of motion, the movement of the fingers being independent of the movement of the jaws.
摘要翻译：一种夹持装置，包括具有用于将主体附接到自动化制造装置的紧固件的主体，可滑动地附接到主体的一对夹爪，离开主体突出的每个卡爪，用于打开和关闭夹爪的卡爪驱动器，每个钳口限定一个运动范围，一对手指，每个手指从每个手指延伸并可移动地连接到相应的钳口，以及连接以打开和关闭手指的手指驱动器，每个手指的运动限定另一运动范围，一个运动范围明显小于其他运动范围，手指的运动与夹爪的运动无关。

6. 发明授权

US6080289A Electroplating apparatus with self-cleaning contacts 失效
标题翻译：具有自清洁触点的电镀设备
公开(公告)号：US6080289A
公开(公告)日：2000-06-27
申请号：US181164
申请日：1998-10-28
申请人： Phillip W. Palmatier , Tracy A. Tong
发明人： Phillip W. Palmatier , Tracy A. Tong
IPC分类号： C25D17/00 , C25D17/06 , C25B9/00 , C25D17/04
CPC分类号： C25D17/005 , C25D17/06
摘要： An electroplating apparatus comprising a plating tank containing electroplating solution, one or more substrates to be electroplated, and an electrical contact mechanism. The electrical contact mechanism comprises a first set of one or more conductive contacts electrically connected to a power supply and a second set of one or more conductive contacts mounted to a substrate carrier. The second set of contacts wipes against the first set of contacts when the carrier is maneuvered into and out of a plating position. At least one of the first and second sets of contacts is spring-biased. The first set of contacts may comprise one or more inverted-L-shaped, pivotable contacts, each mounted within a notch in a contact block.
摘要翻译：一种电镀设备，包括含有电镀溶液的镀槽，一个或多个要被电镀的衬底和电接触机构。电接触机构包括电连接到电源的第一组一个或多个导电触点和安装到衬底载体上的第二组一个或多个导电触点。当载体被操纵进入和离开电镀位置时，第二组触点擦拭第一组触点。第一和第二组触点中的至少一个是弹簧偏置的。第一组触点可以包括一个或多个倒置的L形的可枢转接触件，每个触点可安装在接触块中的凹口内。

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