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    • 3. 发明授权
    • Target shields for improved magnetic properties of a recording medium
    • 用于提高记录介质的磁性能的目标屏蔽
    • US06482301B1
    • 2002-11-19
    • US09326245
    • 1999-06-04
    • Qixu ChenCharles LeuMark Anthony ShowsPaul Stephen McLeodRajiv Yadav Ranjan
    • Qixu ChenCharles LeuMark Anthony ShowsPaul Stephen McLeodRajiv Yadav Ranjan
    • C23C1432
    • G11B5/851C23C14/34H01J37/34H01J37/3447
    • A collimator system is disclosed for use in an in-line pass-by sputtering system during the fabrication of recording media to improve the data storage density and read/write performance characteristics of the media. The collimator system includes a collimator shield and a collimator honeycomb. The shield includes a rectangular tube having a flange and a frame at inner and outer ends, respectively. The various components of the shield in part serve to prevent possible contamination of substrates due to target atom accumulation on the chamber walls during the sputtering process. The collimator honeycomb is provided for blocking target atoms from contacting the substrate at low incident angles. The collimator honeycomb is comprised of a plurality of collimators which are identical to each other. In a preferred embodiment, the collimators have a hexagonal cross-section taken from a perspective perpendicular to the substrate. The collimators may also have other geometric shapes. It is also contemplated that more than one collimator honeycomb level be used in alternative embodiments.
    • 在制造记录介质期间公开了一种用于在线传递溅射系统的准直器系统,以改善数据存储密度和读/写性能特性。 准直仪系统包括准直器屏蔽和准直器蜂窝。 护罩包括分别在内端和外端具有凸缘和框架的矩形管。 屏蔽件的各种部件部分地用于防止在溅射过程期间由于靶室原子在室壁上的积聚而引起的基板的可能污染。 提供准直器蜂窝用于阻止目标原子以低入射角接触基板。 准直器蜂窝体由多个彼此相同的准直器构成。 在优选实施例中,准直器具有垂直于衬底的透视图的六边形截面。 准直器也可以具有其他几何形状。 还可以想到,在替代实施例中可以使用多于一个准直器蜂窝等级。
    • 8. 发明授权
    • Multilayer perpendicular media with high-boron or high-carbon additives to CoCr films
    • 多层垂直介质与高硼或高碳添加剂CoCr膜
    • US07323259B2
    • 2008-01-29
    • US10402772
    • 2003-03-28
    • Qixu ChenCharles BruckerRajiv Yadav Ranjan
    • Qixu ChenCharles BruckerRajiv Yadav Ranjan
    • G11B5/66G11B5/70
    • G11B5/667G11B5/656G11B5/66G11B5/7325Y10T428/265
    • Carbon or boron is added into the CoCr layers of a multiplayer perpendicular magnetic media structure to reduce media noise. The perpendicular magnetic media structure has sharp interfaces between Co-alloy layers and Pd or Pt layers and significantly reduced exchange coupling. In accordance with one embodiment of the invention, the perpendicular magnetic media structure with carbon or boron additives is 700 Å FeCo30.8B12/20 Å TaOx/700 Å FeCo30.8B12/20 Å TaOx/700 Å FeCo30.8B12/20 Å TaOx/158 Å FeCo30.8B12/17 Å Ta/49 Å ITO/33 Å CoCr37Ru10/2.5 Å COy/2.5 Å C/[(CoCr9)C6.8/Pd]19/50 Å CHN. [(CoCr9)C6.8/Pd]19 means 19 layers of the bi-layer stack (CoCr9)C6.8/Pd. TaOx stands for surface-oxidized Ta and COy stands for C oxides. ITO stands for Indium Tin Oxide and consists of In2O3 and Sn2O5 at 80 and 20 molecular percent respectively. CHN refers to hydrogenated and nitrogenated carbon.
    • 将碳或硼添加到多玩家垂直磁性介质结构的CoCr层中以降低介质噪声。 垂直磁介质结构在Co合金层和Pd或Pt层之间具有明显的界面,并显着降低了交换耦合。 根据本发明的一个实施方案,具有碳或硼添加剂的垂直磁性介质结构是700埃,30.8×12/20埃, 30/100FeCo 30.8 B 12/20Åx xÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅÅB B B B B B B B B B B B > 12/20ÅTaO x / 158ÅFeCo 30.8 B 12/17Å/ 49ITO / 33Å CoCr / / / / / / / /((C)Cr C > 6.8 / Pd] 19/50埃。 [(CoCr 9)C 6.8 / Pd] 19表示19层双层堆叠(CoCr 9 / / SUB >)C 6.8 / Pd。 TaO x代表表面氧化的Ta,CO 2代表C氧化物。 ITO代表氧化铟锡,由80和20组成的In 2 N 2 O 3和Sn 2 O 5 O 5组成。 分子百分比。 CHN是指氢化和氮化的碳。
    • 10. 发明授权
    • MRAM fabrication method with sidewall cleaning
    • MRAM制造方法与侧壁清洁
    • US08574928B2
    • 2013-11-05
    • US13443818
    • 2012-04-10
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • Kimihiro SatohYiming HuaiYuchen ZhouJing ZhangDong Ha JungEbrahim AbedifardRajiv Yadav RanjanParviz Keshtbod
    • H01L21/00
    • H01L27/222H01L43/12
    • Fabrication methods for MRAM are described wherein any re-deposited metal on the sidewalls of the memory element pillars is cleaned before the interconnection process is begun. In embodiments the pillars are first fabricated, then a dielectric material is deposited on the pillars over the re-deposited metal on the sidewalls. The dielectric material substantially covers any exposed metal and therefore reduces sources of re-deposition during subsequent etching. Etching is then performed to remove the dielectric material from the top electrode and the sidewalls of the pillars down to at least the bottom edge of the barrier. The result is that the previously re-deposited metal that could result in an electrical short on the sidewalls of the barrier is removed. Various embodiments of the invention include ways of enhancing or optimizing the process. The bitline interconnection process proceeds after the sidewalls have been etched clean as described.
    • 描述了用于MRAM的制造方法,其中在互连过程开始之前清洁存储元件柱的侧壁上的任何重新沉积的金属。 在实施例中,首先制造柱,然后将介电材料沉积在侧壁上的再沉积金属上的柱上。 电介质材料基本上覆盖任何暴露的金属,因此在随后的蚀刻期间减少再沉积的来源。 然后进行蚀刻以将电介质材料从顶部电极和柱的侧壁向下移动到至少阻挡层的底部边缘。 结果是可能导致在屏障的侧壁上导致电短路的先前重新沉积的金属被去除。 本发明的各种实施方案包括增强或优化方法的方法。 如所描述的那样,在侧壁被蚀刻清洁之后,进行位线互连处理。