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1. 发明授权

US08641273B2 Thermal interlock for battery pack, device, system and method 有权
标题翻译：电池组，装置，系统和方法的热互锁
公开(公告)号：US08641273B2
公开(公告)日：2014-02-04
申请号：US12938284
申请日：2010-11-02
申请人： Peng Zhou , Paul Tsao , David Kevin Pariseau
发明人： Peng Zhou , Paul Tsao , David Kevin Pariseau
IPC分类号： G01K11/06 , G01N17/00 , H01M10/50 , H02H5/04
CPC分类号： H01M10/486 , H01M2200/105 , H01M2200/106
摘要： Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.
摘要翻译：电池检测和定位装置和方法有故障的电池单元能够检测和定位故障。该装置将能量施加到感测构件，例如包含至少两个聚合物涂覆和扭绞电线的聚合物管。由故障电池产生的热量通过熔化聚合物的至少一部分而触发两条电线之间的电连通。由此产生的两根电线之间的电阻变化用于检测和定位故障电池。

2. 发明申请

US20120106593A1 THERMAL INTERLOCK FOR BATTERY PACK, DEVICE, SYSTEM AND METHOD 有权
标题翻译：用于电池组，装置，系统和方法的热互锁
公开(公告)号：US20120106593A1
公开(公告)日：2012-05-03
申请号：US12938284
申请日：2010-11-02
申请人： Peng Zhou , Paul Tsao , David Kevin Pariseau
发明人： Peng Zhou , Paul Tsao , David Kevin Pariseau
IPC分类号： G01N17/00 , G01N27/416
CPC分类号： H01M10/486 , H01M2200/105 , H01M2200/106
摘要： Faulty battery detecting and locating devices and methods are able to detect and locate a faulty battery cell. The device applies an energy to a sensing member, such as a polymeric tube containing at least two polymer-coated and twisted electric wires. Heat that is generated by a faulty battery triggers an electric communication between the two electric wires by melting at least a portion of the polymer. The resulting change in resistance between the two electric wires is used to detect and locate a faulty battery.
摘要翻译：电池检测和定位装置和方法有故障的电池单元能够检测和定位故障。该装置将能量施加到感测构件，例如包含至少两个聚合物涂覆和扭绞电线的聚合物管。由故障电池产生的热量通过熔化聚合物的至少一部分而触发两条电线之间的电连通。由此产生的两根电线之间的电阻变化用于检测和定位故障电池。

3. 发明授权

US07188662B2 Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效流体输送的装置和方法
公开(公告)号：US07188662B2
公开(公告)日：2007-03-13
申请号：US11049313
申请日：2005-02-01
申请人： Richard Grant Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
发明人： Richard Grant Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
IPC分类号： F28D7/02
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

4. 发明申请

US20120103930A1 METHOD OF MAKING FUSIBLE LINKS 有权
标题翻译：制作可靠链接的方法
公开(公告)号：US20120103930A1
公开(公告)日：2012-05-03
申请号：US12938298
申请日：2010-11-02
申请人： Peng Zhou , Paul Tsao
发明人： Peng Zhou , Paul Tsao
IPC分类号： C23F1/04
CPC分类号： H05K13/00 , H01H11/00 , H01H69/022 , H01H85/02 , H01H85/046 , H01H2085/025 , H01M2/26 , H01M2200/10 , H05K1/0293 , Y10T29/49107 , Y10T29/49108 , Y10T29/49117
摘要： Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer used as current collector conductor pads and battery cell conductor pads, and one or more tabs made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.
摘要翻译：制造可熔连接件的方法涉及处理具有适于形成可熔连接件的第一层的多层复合箔和适用于形成一个或多个焊接焊盘的第二层。在一些实施例中，第一层是铝层，第二层是镍层。在复合箔上进行两步蚀刻工艺或单步蚀刻工艺以形成具有由用作集流体导体焊盘和电池单元导体焊盘的第二层制成的多个接片的蚀刻的复合箔，并且制成一个或多个接片形成铝导体的第一层。铝导体的形状和尺寸在蚀刻工艺或随后的冲压工艺期间形成铝熔丝导体。可以形成单个可熔连接件或可熔连接件阵列。

5. 发明申请

US20080210405A1 Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems 有权
标题翻译：制造高表面与体积比的结构及其集成在液体冷却系统的微型换热器中
公开(公告)号：US20080210405A1
公开(公告)日：2008-09-04
申请号：US11326690
申请日：2006-01-06
申请人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
发明人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
IPC分类号： F28F27/02 , B21D53/02
CPC分类号： F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2245/04 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49369 , H01L2924/00
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

6. 发明授权

US07836597B2 Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system 有权
标题翻译：制造高表面与体积比结构的方法及其集成在液体冷却系统的微热交换器中
公开(公告)号：US07836597B2
公开(公告)日：2010-11-23
申请号：US11326690
申请日：2006-01-06
申请人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
发明人： Madhav Datta , Mark McMaster , Rick Brewer , Peng Zhou , Paul Tsao , Girish Upadhaya , Mark Munch
IPC分类号： B23P15/26 , F28D15/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2245/04 , H01L21/4882 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , Y10T29/49353 , Y10T29/49366 , Y10T29/49369 , H01L2924/00
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

7. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

8. 发明授权

US08157001B2 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US08157001B2
公开(公告)日：2012-04-17
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： G05D23/00 , F28F7/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
摘要翻译：集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

9. 发明申请

US20070227708A1 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US20070227708A1
公开(公告)日：2007-10-04
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

10. 发明授权

US08486283B2 Method of making fusible links 有权
标题翻译：制作易熔链接的方法
公开(公告)号：US08486283B2
公开(公告)日：2013-07-16
申请号：US12938298
申请日：2010-11-02
申请人： Peng Zhou , Paul Tsao
发明人： Peng Zhou , Paul Tsao
IPC分类号： H01B13/00 , C23F1/04
CPC分类号： H05K13/00 , H01H11/00 , H01H69/022 , H01H85/02 , H01H85/046 , H01H2085/025 , H01M2/26 , H01M2200/10 , H05K1/0293 , Y10T29/49107 , Y10T29/49108 , Y10T29/49117
摘要： Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer used as current collector conductor pads and battery cell conductor pads, and one or more tabs made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.
摘要翻译：制造可熔连接件的方法涉及处理具有适于形成可熔连接件的第一层的多层复合箔和适用于形成一个或多个焊接焊盘的第二层。在一些实施例中，第一层是铝层，第二层是镍层。在复合箔上进行两步蚀刻工艺或单步蚀刻工艺以形成具有由用作集流体导体焊盘和电池单元导体焊盘的第二层制成的多个接片的蚀刻的复合箔，并且制成一个或多个接片形成铝导体的第一层。铝导体的形状和尺寸在蚀刻工艺或随后的冲压工艺期间形成铝熔丝导体。可以形成单个可熔连接件或可熔连接件阵列。

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