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1. 发明授权

US09870989B2 Electrical fuse and/or resistor structures 有权
公开(公告)号：US09870989B2
公开(公告)日：2018-01-16
申请号：US15466380
申请日：2017-03-22
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Veeraraghavan S. Basker , Kangguo Cheng , Ali Khakifirooz , Juntao Li
IPC分类号： H01L29/66 , H01L23/525 , H01H69/02 , H01C17/00 , H01L21/8234
CPC分类号： H01L23/5256 , H01C17/006 , H01H69/022 , H01L21/31051 , H01L21/31116 , H01L21/31144 , H01L21/823437 , H01L21/823475 , H01L23/5228 , H01L23/5329 , H01L23/535 , H01L27/0617 , H01L27/0629 , H01L28/20 , H01L29/495 , H01L29/4966 , H01L29/66545
摘要： Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.

2. 发明申请

US20160372293A1 FUSE IN CHIP DESIGN 审中-公开
标题翻译：保险丝芯片设计
公开(公告)号：US20160372293A1
公开(公告)日：2016-12-22
申请号：US15180586
申请日：2016-06-13
申请人： VISHAY BCcomponents BEYSCHLAG GmbH
发明人： Werner Blum , Reiner Friedrich , Wolfgang Werner , Reimer Hinrichs
IPC分类号： H01H85/046 , H01H69/02 , H01H85/041 , H01H85/00
CPC分类号： H01H85/046 , H01H69/022 , H01H85/006 , H01H85/0411 , H01H2085/0414 , Y10T29/49107
摘要： To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
摘要翻译：为了生产具有成本效益的芯片设计保险丝，其应用于由具有高导热性的Al 2 O 3陶瓷制成的载体衬底上，并且具有可熔金属导体和覆盖层，其中熔点金属导体可以可靠地定义，建议在载体基板和金属导体之间定位具有低导热性的中间层，中间层由施加在丝网印刷中的低熔点无机玻璃浆料形成方法或应用于岛印刷的有机中间层。此外，规定了制造保险丝的方法。

3. 发明授权

US09337671B2 Protective element, protective element fabrication method, and battery module in which protective element is embedded 有权
标题翻译：保护元件，保护元件制造方法以及嵌入保护元件的电池模块
公开(公告)号：US09337671B2
公开(公告)日：2016-05-10
申请号：US14366630
申请日：2012-12-17
申请人： Dexerials Corporation
发明人： Chisato Komori , Yuji Furuuchi , Yoshihiro Yoneda , Koichi Mukai , Koji Ejima , Takashi Fujihata , Kazutaka Furuta , Toshiaki Araki
IPC分类号： H02J7/00 , G01N27/416 , G08B21/00 , G01N27/02 , H01M2/34 , H02H3/08 , H01H85/02 , H02H7/18 , H02H9/04 , H01M10/0525 , H01H69/02
CPC分类号： H02J7/0029 , G01N27/416 , G08B21/00 , H01H69/022 , H01H85/0241 , H01M2/34 , H01M10/0525 , H01M2200/103 , H02H3/08 , H02H7/18 , H02H9/041 , H02H9/042 , H02J7/0031 , H02J7/007 , H02J2007/0037 , H02J2007/004 , Y10T29/49208
摘要： A protective element including a substrate having a first insulating member and a concave portion formed thereon, a heating body layered on the concave portion of the substrate, a second insulating member layered on the substrate so as to cover at least covering the heating body, first and second electrodes layered on a surface of the substrate on which the second insulating member is layered, a heating body electrode layered on the second insulating member so as to be superimposed with the heating body, and electrically connected to a current path between the first and the second electrodes as well as onto and the heating body, and a low-melting point metal layered from the heating body electrode toward the first and the second electrodes configured to cause a blowout of the current path between the first and the second electrodes by heating.
摘要翻译：一种保护元件，包括具有形成在其上的第一绝缘构件和凹部的基板，层叠在基板的凹部上的加热体，第一绝缘构件，其被层叠在基板上，以至少覆盖加热体，以及第二电极，层叠在其上层叠有第二绝缘构件的基板的表面上;加热体电极，层叠在第二绝缘构件上，以与加热体重叠，并且电连接到第一绝缘构件和第二绝缘构件之间的电流路径; 所述第二电极以及所述加热体以及从所述加热体电极朝向所述第一和第二电极层叠的低熔点金属，所述低熔点金属被配置为通过加热而引起所述第一和第二电极之间的电流通路的吹出。

4. 发明授权

US09224563B2 Electronic part and electronic control unit 有权
标题翻译：电子部件和电子控制单元
公开(公告)号：US09224563B2
公开(公告)日：2015-12-29
申请号：US14190299
申请日：2014-02-26
申请人： DENSO CORPORATION , Murata Manufacturing Co., Ltd.
发明人： Toru Itabashi , Yuki Mikami , Ryoichi Shiraishi , Akihiro Yanagisawa , Shigeki Nishiyama
IPC分类号： H02B1/18 , H01H85/02 , H01H85/50 , H01H85/46 , H01G2/16 , H01H69/02 , H01G2/18 , H01H85/48 , H05K1/18 , H05K1/02 , H02H5/04 , H01G2/00 , H02B1/04 , H01H39/00 , H01H73/24 , H01H71/10 , H05K3/34 , H01H85/10
CPC分类号： H01H85/0241 , H01G2/16 , H01G2/18 , H01H69/022 , H01H85/10 , H01H85/463 , H01H85/48 , H01H85/50 , H01H2085/0275 , H05K1/0263 , H05K1/18 , H05K1/181 , H05K3/3426 , H05K2201/10181 , H05K2201/10454 , H05K2201/10946
摘要： A main body of an electronic part is formed in a rectangular pillared shape having a first and a second axial end surface. A first electrode is formed on the first axial end surface electrically and mechanically connected to a first wiring pattern formed on a board surface of a printed board. A second electrode is formed on the second axial end surface, to which one end of a fuse terminal is electrically connected. The other end of the fuse terminal is connected to a second wiring pattern of the printed board or a wiring member which is formed as an independent member from the printed board. A cut-off portion is formed in a connecting portion of the fuse terminal.
摘要翻译：电子部件的主体形成为具有第一和第二轴向端面的矩形柱状。第一电极形成在第一轴向端面上，电和机械地连接到形成在印刷电路板的电路板表面上的第一布线图案。第二电极形成在第二轴向端面上，熔丝端子的一端电连接到该第二电极。熔丝端子的另一端连接到印刷电路板的第二布线图案或与印刷电路板形成为独立构件的布线构件。在熔丝端子的连接部分形成有切断部分。

5. 发明授权

US09129769B2 Protective device 有权
标题翻译：保护装置
公开(公告)号：US09129769B2
公开(公告)日：2015-09-08
申请号：US12875771
申请日：2010-09-03
申请人： Chung-Hsiung Wang , Hung-Ming Lin , Wen-Shiang Luo , Chun-Tiao Liu , Kuo-Shu Chen
发明人： Chung-Hsiung Wang , Hung-Ming Lin , Wen-Shiang Luo , Chun-Tiao Liu , Kuo-Shu Chen
IPC分类号： H01H85/48 , H01H85/02 , H01H85/00 , H01H85/041 , H01H69/02 , H01H85/046 , H01H85/048 , H01H85/11 , H01H85/46
CPC分类号： H01H85/48 , H01H69/022 , H01H85/0047 , H01H85/0241 , H01H85/0411 , H01H85/046 , H01H85/048 , H01H85/11 , H01H2085/0283 , H01H2085/466
摘要： A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.
摘要翻译：提供了包括基板，导电部分和桥接元件的保护装置。导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。桥接元件跨过金属元件横跨金属元件中的电流流动方向穿过金属元件，其中桥接元件有助于熔化时金属元件的断裂。

6. 发明授权

US08675333B2 Protective device 有权
标题翻译：保护装置
公开(公告)号：US08675333B2
公开(公告)日：2014-03-18
申请号：US13894160
申请日：2013-05-14
申请人： Cyntec Co., Ltd.
发明人： Chung-Hsiung Wang , Hung-Ming Lin , Lang-Yi Chiang , Wen-Shiang Luo , Kuo-Shu Chen
IPC分类号： H02H5/00
CPC分类号： H02H5/00 , H01H69/022 , H01H85/0047 , H01H85/0065 , H01H85/0411 , H01H85/046 , H01H85/048 , H01H85/11 , H01H2085/466
摘要： A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.
摘要翻译：提供了包括基板，导电部分和第一辅助介质的保护装置。导电部分由衬底支撑，其中导电部分包括电连接在第一和第二电极之间的金属元件。金属元件用作熔点低于第一和第二电极的熔点的牺牲结构。第一辅助介质设置在金属元件和基板之间，其中第一辅助介质的熔点低于金属元件的熔点。第一辅助介质有助于熔化时金属元件的断裂。

7. 发明申请

US20120103930A1 METHOD OF MAKING FUSIBLE LINKS 有权
标题翻译：制作可靠链接的方法
公开(公告)号：US20120103930A1
公开(公告)日：2012-05-03
申请号：US12938298
申请日：2010-11-02
申请人： Peng Zhou , Paul Tsao
发明人： Peng Zhou , Paul Tsao
IPC分类号： C23F1/04
CPC分类号： H05K13/00 , H01H11/00 , H01H69/022 , H01H85/02 , H01H85/046 , H01H2085/025 , H01M2/26 , H01M2200/10 , H05K1/0293 , Y10T29/49107 , Y10T29/49108 , Y10T29/49117
摘要： Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer used as current collector conductor pads and battery cell conductor pads, and one or more tabs made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.
摘要翻译：制造可熔连接件的方法涉及处理具有适于形成可熔连接件的第一层的多层复合箔和适用于形成一个或多个焊接焊盘的第二层。在一些实施例中，第一层是铝层，第二层是镍层。在复合箔上进行两步蚀刻工艺或单步蚀刻工艺以形成具有由用作集流体导体焊盘和电池单元导体焊盘的第二层制成的多个接片的蚀刻的复合箔，并且制成一个或多个接片形成铝导体的第一层。铝导体的形状和尺寸在蚀刻工艺或随后的冲压工艺期间形成铝熔丝导体。可以形成单个可熔连接件或可熔连接件阵列。

8. 发明申请

US20110163840A1 HIGH RELIABILITY BLADE FUSE AND THE MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：高可靠性刀片保险丝及其制造方法
公开(公告)号：US20110163840A1
公开(公告)日：2011-07-07
申请号：US13063985
申请日：2009-10-23
申请人： Xiurong Lu , Xiaoming Cao , Shirong Nan , Manxue Yang
发明人： Xiurong Lu , Xiaoming Cao , Shirong Nan , Manxue Yang
IPC分类号： H01H85/06 , H01H69/02
CPC分类号： H01H69/022 , H01H85/06 , Y10T29/49107
摘要： The invention relates to the field of fuses, and particularly to a blade fuse used to protect electronic components and its manufacturing method. The said blade fuse comprises a ceramic substrate, a first metal layer, a second metal layer, an encapsulating layer, back electrodes and metal ends, wherein an insulating layer is between the first metal layer and the second metal layer, and the softening point of the insulating layer is between the melting points of the first and second metal layers; the method of manufacturing the said blade fuse includes the following steps: forming back electrodes on the back side of the substrate and then forming the first metal layer on the substrate in accordance with the pattern of the fuse wire; securing a metal mesh on the substrate, covering the two ends of the first metal layer, and forming the insulating layer with vapor deposition; removing the metal mesh, printing the second metal layer on the insulating layer with screen-printing technology and then covering all the surface of the substrate with the protective layer except its two ends wherein end electrodes are located so that the fuse wire is protected; the finished product is obtained after formation of end inner electrodes and end electrodes at last; the manufacturing processes disclosed in this invention is simple, and the blade fuse manufactured thereby is characteristic of excellent fusing performance, strong anti-aging capability and the smoother fusing curve.
摘要翻译：本发明涉及保险丝领域，特别涉及用于保护电子部件的刀片保险丝及其制造方法。所述刀片保险丝包括陶瓷衬底，第一金属层，第二金属层，封装层，背电极和金属端，其中绝缘层在第一金属层和第二金属层之间，软化点绝缘层位于第一和第二金属层的熔点之间; 制造所述刀片保险丝的方法包括以下步骤：在衬底的背面形成背电极，然后根据熔丝的图案在衬底上形成第一金属层; 将金属网固定在基板上，覆盖第一金属层的两端，并用气相沉积形成绝缘层; 去除金属网，用丝网印刷技术在绝缘层上印刷第二金属层，然后用保护层覆盖基板的所有表面，除了两端，其末端电极被定位成使得熔丝被保护; 最终在终端内电极和端电极形成后获得成品; 本发明公开的制造工艺简单，由此制造的刀片保险丝具有优异的熔合性能，强抗老化能力和更平滑的熔化曲线。

9. 发明申请

US20090167480A1 Manufacturability of SMD and Through-Hole Fuses Using Laser Process 有权
标题翻译：使用激光工艺的SMD和通孔保险丝的可制造性
公开(公告)号：US20090167480A1
公开(公告)日：2009-07-02
申请号：US11967161
申请日：2007-12-29
申请人： Sidharta Wiryana , Tianyu Zhu
发明人： Sidharta Wiryana , Tianyu Zhu
IPC分类号： H01H85/04 , H01H69/02
CPC分类号： H01H69/022 , H01H85/0411 , H01H85/046 , H01H2069/025 , H01H2085/0414 , Y10T29/49107
摘要： The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.
摘要翻译：本发明涉及制造电路保护器和电路保护器的方法。该方法包括以下步骤：提供具有相对端部的衬底，将元件层耦合到衬底的顶表面，以及激光加工元件层以将元件层成形为预定几何形状。电路保护器包括具有相对端部的衬底，在衬底的相对端部处耦合到顶表面的端接焊盘，跨过端接焊盘之间的空间并且电连接端接焊盘的熔丝元件，熔丝元件具有预定的几何; 具有约0.025至约0.050毫米的最窄宽度的预定几何形状，连接顶表面并使衬底充满的盖，熔丝元件和终止焊盘以及在相对端部处与端接焊盘电接触的终端。

10. 发明申请

US20080191832A1 Chip-type fuse and method of manufacturing the same 审中-公开
标题翻译：片式保险丝及其制造方法
公开(公告)号：US20080191832A1
公开(公告)日：2008-08-14
申请号：US11802694
申请日：2007-05-24
申请人： Chon-Ming Tsai
发明人： Chon-Ming Tsai
IPC分类号： H01H85/04 , H01H69/02
CPC分类号： H01H85/0411 , H01H69/022 , H01H85/0065 , H01H85/0082 , H01H85/046 , H01H85/047 , H01H85/06 , H01H85/42 , H01H2085/0414 , Y10T29/49107
摘要： A chip-type fuse is based on an electrically insulating substrate and fusible element is disposed thereon. A protective layer is formed over the fusible element and adheres to the substrate around the fusible element so as to define a cavity between the protective layer and the fusible element. The cavity isolates the protective layer from direct contact with the fusible element so that the protective layer will not be melted or breached by the excessive heat and arc generated by the fusible element under overload condition. Further, the cavity can be hermetically sealed to enclose a gas of pressure less than one atmosphere. A thermally insulating layer and an arc suppressive layer may be incorporated to reduce the response time and arc intensity of the chip-type fuse respectively under overload condition. The method of manufacturing chip-type fuse, particularly the method of forming fusible element and cavity, is described too.
摘要翻译：芯片式保险丝基于电绝缘基板，并且可熔元件设置在其上。在可熔元件之上形成保护层，并且粘附到可熔元件周围的基板上，以便在保护层和可熔元件之间限定空腔。空腔将保护层与可熔元件直接接触，使得保护层不会在过载条件下由易熔元件产生的过热和电弧熔化或破裂。此外，空腔可以气密地密封以包围低于一个大气压的气体。可以并入绝热层和电弧抑制层，以在过载条件下分别降低芯片型熔丝的响应时间和电弧强度。还描述了制造芯片型熔断器的方法，特别是形成可熔元件和腔体的方法。

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