专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07660117B2 Deformable duct guides that accommodate electronic connection lines 有权
标题翻译：适应电子连接线的可变形导管
公开(公告)号：US07660117B2
公开(公告)日：2010-02-09
申请号：US12221945
申请日：2008-08-07
申请人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
发明人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.
摘要翻译：管道工作组件联接到容纳一个或多个发热设备（例如电子设备服务器）的电子设备外壳的端部。管道工作组件包括单独的管道引导件，每个管道引导件具有可变形的端部，该可变形端部构造成围绕从一个或多个电子服务器的后部延伸的电连接线局部变形。可变形端可由刷毛制成，如刷子或包括狭缝和/或孔的泡沫。

2. 发明申请

US20090046430A1 Method and apparatus for providing supplemental cooling to server racks 审中-公开
标题翻译：为服务器机架提供补充冷却的方法和装置
公开(公告)号：US20090046430A1
公开(公告)日：2009-02-19
申请号：US12228053
申请日：2008-08-07
申请人： Richard Grant Brewer , Hae-won Choi , James Hom , Tien Chih (Eric) Lin , Douglas E. Werner
发明人： Richard Grant Brewer , Hae-won Choi , James Hom , Tien Chih (Eric) Lin , Douglas E. Werner
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： A cooling system includes a re-configurable duct work assembly for a server rack or other electronics enclosure. Heat generating devices are positioned within the electronics enclosure and heat exchangers are coupled to the heat generating devices via the duct work. The duct work is positioned within a plenum between the back of the electronics servers and the heat exchangers. The interior of the electronics enclosure is conceptually segmented into heat zones. The duct work is used to selectively direct heated air to the heat exchangers. In some embodiments, the heated air output from a single heat zone is directed by the duct work to a corresponding single heat exchanger. In other embodiments, the heated air output from a group of adjacent heat zones is combined within a single duct work guide that directs the combined heated air to a corresponding number of adjacent heat exchangers.
摘要翻译：冷却系统包括用于服务器机架或其他电子设备外壳的可重构管道工作组件。热产生装置位于电子设备外壳内，热交换器通过管道工作连接到发热装置。管道工作位于电子服务器的背面和热交换器之间的集气室内。电子外壳的内部在概念上分为热区。管道工作用于选择性地将加热的空气引导到热交换器。在一些实施例中，从单个加热区域输出的加热空气由管道工作引导到相应的单个热交换器。在其它实施例中，来自一组相邻加热区域的加热空气输出在单个管道工作导向器内组合，其将组合的加热空气引导到相应数量的相邻热交换器。

3. 发明申请

US20090046423A1 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US20090046423A1
公开(公告)日：2009-02-19
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

4. 发明授权

US07301773B2 Semi-compliant joining mechanism for semiconductor cooling applications 有权
标题翻译：半合规半导体冷却应用的连接机制
公开(公告)号：US07301773B2
公开(公告)日：2007-11-27
申请号：US10945807
申请日：2004-09-20
申请人： Richard Grant Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
发明人： Richard Grant Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：热收集装置使用包括万向接头的万向板安装在热源上。万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。保持力沿着与热源的热界面的面心法线向量共线的矢量施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向节接头到集热装置的配合力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

5. 发明申请

US20090225515A1 Thermal bus or junction for the removal of heat from electronic components 审中-公开
标题翻译：用于从电子部件去除热量的热母线或接头
公开(公告)号：US20090225515A1
公开(公告)日：2009-09-10
申请号：US12381332
申请日：2009-03-10
申请人： James Hom , Richard Grant Brewer , Hae-won Choi
发明人： James Hom , Richard Grant Brewer , Hae-won Choi
IPC分类号： H05K7/20 , F28D15/00 , F28F1/10
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A thermal bus enables the use of multiple separate heat pipe assemblies instead of using a single heat pipe assembly spanning the distance from heat source to cold plate. The use of a thermal bus can decrease the orientation effects as well as decrease the travel length of any single heat pipe assembly. In addition, the use of multiple heat pipe assemblies enables each individual heat pipe assembly to be optimized to meet localized heat transfer characteristics between each heat source, the thermal bus, and the cold plate. Such optimization can include the use of differently sized heat pipes, wick structures within the heat pipe, and working fluid used within the heat pipe. The thermal bus provides an intermediate thermal transfer from one heat pipe assembly serially coupled to another heat pipe assembly, thereby enabling multiple serially coupled heat pipe assemblies to transfer heat from a given heat source to the cold plate at the edge of the electronics board.
摘要翻译：热母线可以使用多个单独的热管组件，而不是使用跨过热源到冷板的距离的单个热管组件。使用热母线可以降低取向效果，并减少任何单个热管组件的行进长度。此外，使用多个热管组件可使每个单独的热管组件得以优化，以满足每个热源，热母线和冷板之间的局部热传递特性。这种优化可以包括使用不同尺寸的热管，热管内的芯结构以及在热管内使用的工作流体。热母线提供从串联耦合到另一热管组件的一个热管组件的中间热传递，从而使得多个串联耦合的热管组件能够将热量从给定的热源传送到电子板的边缘处的冷板。

6. 发明申请

US20090046429A1 Deformable duct guides that accommodate electronic connection lines 有权
标题翻译：适应电子连接线的可变形导管
公开(公告)号：US20090046429A1
公开(公告)日：2009-02-19
申请号：US12221945
申请日：2008-08-07
申请人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
发明人： Douglas E. Werner , James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Richard Grant Brewer
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H05K7/20736
摘要： A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.
摘要翻译：管道工作组件联接到容纳一个或多个发热设备（例如电子设备服务器）的电子设备外壳的端部。管道工作组件包括单独的管道引导件，每个管道引导件具有可变形的端部，该可变形端部构造成围绕从一个或多个电子服务器的后部延伸的电连接线局部变形。可变形端可由刷毛制成，如刷子或包括狭缝和/或孔的泡沫。

7. 发明授权

US07293423B2 Method and apparatus for controlling freezing nucleation and propagation 有权
标题翻译：用于控制冷冻成核和传播的方法和装置
公开(公告)号：US07293423B2
公开(公告)日：2007-11-13
申请号：US11049202
申请日：2005-02-01
申请人： Girish Upadhya , Richard Grant Brewer , Mark McMaster
发明人： Girish Upadhya , Richard Grant Brewer , Mark McMaster
IPC分类号： F25D21/00
CPC分类号： F28F3/12 , F28F2265/14
摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.
摘要翻译：公开了一种在液体系统中控制冷冻的装置和方法。该装置包括具有以表面积与体积比为特征的初始区的热交换器。该装置还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向上的冷冻期间促进体积膨胀。该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。优选地，最终的冷冻区具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

8. 发明授权

US08250877B2 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 有权
标题翻译：用于通过安装在门上的热交换器从设备架排出热量的装置和方法
公开(公告)号：US08250877B2
公开(公告)日：2012-08-28
申请号：US12291884
申请日：2008-11-14
申请人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： F25D23/12
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

9. 发明申请

US20090225514A1 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 审中-公开
标题翻译：用于通过安装在门上的热交换器从设备架排出热量的装置和方法
公开(公告)号：US20090225514A1
公开(公告)日：2009-09-10
申请号：US12291918
申请日：2008-11-14
申请人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

10. 发明申请

US20090225513A1 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 有权
公开(公告)号：US20090225513A1
公开(公告)日：2009-09-10
申请号：US12291884
申请日：2008-11-14
申请人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式