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    • 3. 发明申请
    • Liquid cooling loops for server applications
    • 用于服务器应用的液体冷却回路
    • US20070201210A1
    • 2007-08-30
    • US11707332
    • 2007-02-16
    • Norman ChowPaul TsaoDouglas WernerMark McMasterGirish UpadhyaFrederic LandryIan SpearingTim Schrader
    • Norman ChowPaul TsaoDouglas WernerMark McMasterGirish UpadhyaFrederic LandryIan SpearingTim Schrader
    • H05K7/20
    • H05K7/20781H01L2924/0002H05K7/20727H05K7/20772H01L2924/00
    • A mounting system provides mechanisms and form factors for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from a electronics server. To ensure good thermal contact, pressure is applied between the two heat exchangers, the rejector plate and the chassis cold plate. The mounting mechanism used to engage and disengage the heat exchangers is configured to isolate the force applied to the two heat exchangers. The mounting mechanism includes an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server. Without isolating this force, the force is applied to the electronics server and/or the rack chassis, possibly disconnecting the electrical connections between the electronics server and the rack, as well as providing mechanical stress to the electronics server and the rack chassis. The mounting mechanism is also coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact. This is a fail safe procedure since no separate process is required to engage the electronics server cooling loop.
    • 安装系统提供了将来自服务器机架的热交换器与来自电子服务器的热交换器热接触的机构和形式因素。 为了确保良好的热接触,在两个热交换器,排料盘和底盘冷板之间施加压力。 用于接合和分离热交换器的安装机构构造成隔离施加到两个热交换器的力。 安装机构包括互锁机构,其防止施加的力传递到电子服务器的其余部分。 在不隔离该力的情况下,该力被施加到电子服务器和/或机架机架,可能断开电子服务器和机架之间的电连接,以及向电子服务器和机架机架提供机械应力。 安装机构还耦合到电子服务器锁定机构,使得将电子服务器锁定到机架中的动作导致热交换器进行热接触。 这是一个故障安全程序,因为不需要单独的过程来接合电子服务器冷却回路。
    • 10. 发明申请
    • IMAGE TRANSFER PROCESS FOR THIN FILM COMPONENT DEFINITION
    • 薄膜组件定义的图像传输过程
    • US20080026325A1
    • 2008-01-31
    • US11870364
    • 2007-10-10
    • Dwight CornwellDouglas Werner
    • Dwight CornwellDouglas Werner
    • G03C5/00
    • G11B5/3163
    • A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of material to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the material layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the material layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.
    • 根据一个实施例的制造薄膜部件的方法包括:形成具有薄膜层,剥离层和光刻胶图案层的晶片; 将光致抗蚀剂层的图案转印到剥离层和薄膜层上; 向晶片添加一层材料; 将晶片加热到预定温度一段足以使光致抗蚀剂变形到使光致抗蚀剂在材料层中产生裂纹的程度; 施加溶剂以溶解至少一部分释放层,溶剂穿透材料层中的裂纹以到达剥离层; 以及去除脱模层和剥离层上方的层的任何部分。