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1. 发明授权

US08157001B2 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US08157001B2
公开(公告)日：2012-04-17
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： G05D23/00 , F28F7/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
摘要翻译：集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

2. 发明申请

US20070227708A1 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US20070227708A1
公开(公告)日：2007-10-04
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

3. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

4. 发明申请

US20090046423A1 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US20090046423A1
公开(公告)日：2009-02-19
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

5. 发明授权

US07746634B2 Internal access mechanism for a server rack 有权
标题翻译：服务器机架的内部访问机制
公开(公告)号：US07746634B2
公开(公告)日：2010-06-29
申请号：US12221961
申请日：2008-08-07
申请人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
发明人： James Hom , Hae-won Choi , Tien Chih (Eric) Lin , Douglas E. Werner , Norman Chow , Adrian Correa , Brandon Leong , Sudhakar Gopalakrishnan , Richard Grant Brewer , Mark McMaster , Girish Upadhya
IPC分类号： H05K7/20
CPC分类号： H05K7/20736
摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.
摘要翻译：电子外壳的后面板包括一个或多个热交换器。后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。可以通过在诸如标准门的铰链上使门打开来提供这种接近。在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。在一些实施例中，每个部分像标准门一样旋转打开。在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

6. 发明授权

US07806168B2 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange 有权
标题翻译：最优的撒布机系统，流体冷却微型热交换的装置和方法
公开(公告)号：US07806168B2
公开(公告)日：2010-10-05
申请号：US10698180
申请日：2003-10-30
申请人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson , James Hom
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson , James Hom
IPC分类号： F28F7/00
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.
摘要翻译：公开了一种用于流体冷却的微型热交换器的装置，方法和系统。流体冷却的微型热交换器利用具有高导热性材料的微尺度区域和扩散器区域，并且其尺寸适于从热源产生高的每单位体积的散热和转移面积。微尺度区域优选地包括微通道。

7. 发明申请

US20070175621A1 Re-workable metallic TIM for efficient heat exchange 审中-公开
标题翻译：可重复使用的金属TIM，用于高效的热交换
公开(公告)号：US20070175621A1
公开(公告)日：2007-08-02
申请号：US11345556
申请日：2006-01-31
申请人： Madhav Datta , Peng Zhou , James Hom , Mark Munch , Mark McMaster
发明人： Madhav Datta , Peng Zhou , James Hom , Mark Munch , Mark McMaster
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

8. 发明申请

US20070256815A1 Scalable liquid cooling system with modular radiators 审中-公开
标题翻译：具有模块化散热器的可扩展液体冷却系统
公开(公告)号：US20070256815A1
公开(公告)日：2007-11-08
申请号：US11800275
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , James Hom
发明人： Bruce Conway , Richard Brewer , James Hom
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , G06F1/185 , G06F2200/201
摘要： A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
摘要翻译：公开了可扩展和模块化的冷却系统。冷却系统包括具有多个膨胀槽的空气增压室。每个扩展槽被配置成接收模块化配置的流体对空气热交换器，例如散热器。空气增压室还包括用于通过膨胀槽吹送空气的一个或多个空气推动器，因此通过安装在膨胀槽内的任何散热器。对于那些未使用的扩展槽，每个未使用的扩展槽都安装一个挡板。每个挡板以类似于模块化配置的散热器的方式被模块化地配置。以这种方式，基本上防止了空气旁路。每个散热器是独立冷却回路的一部分，直接或间接地用于冷却发热装置。

9. 发明授权

US08250877B2 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 有权
标题翻译：用于通过安装在门上的热交换器从设备架排出热量的装置和方法
公开(公告)号：US08250877B2
公开(公告)日：2012-08-28
申请号：US12291884
申请日：2008-11-14
申请人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： F25D23/12
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

10. 发明申请

US20090225514A1 Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door 审中-公开
标题翻译：用于通过安装在门上的热交换器从设备架排出热量的装置和方法
公开(公告)号：US20090225514A1
公开(公告)日：2009-09-10
申请号：US12291918
申请日：2008-11-14
申请人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
发明人： Adrian Correa , Tien Chih (Eric) Lin , James Hom , Gregory Shiomoto , Norman Chow , Brandon Leong , Richard Grant Brewer , Douglas E. Werner , Mark McMaster
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

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