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1. 发明授权

US07563356B2 Composite processing apparatus and method 失效
标题翻译：复合加工设备及方法
公开(公告)号：US07563356B2
公开(公告)日：2009-07-21
申请号：US10549324
申请日：2004-03-12
申请人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
发明人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
IPC分类号： C25F3/16 , B23H5/08
CPC分类号： C25F7/00
摘要： A composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits is disclosed. The composite processing apparatus includes: a substrate holder for holding a substrate; a processing table including a mechanical processing section for processing a surface of the substrate by a processing method involving a mechanical action; and an electrolytic processing section which is separate from the mechanical processing section. The electrolytic processing section includes a processing electrode with an ion exchanger, for processing the substrate by applying a voltage between the processing electrode and the substrate while keeping the ion exchanger (92) in contact with the substrate. The composite processing apparatus also includes a liquid supply section for supplying a liquid between the substrate and the processing electrode, and between the substrate and the mechanical processing section; and a drive section for moving the substrate and the processing table relative to each other.
摘要翻译：公开了一种复合处理装置，其能够在有效地防止凹坑形成的同时，以低表面压力和高速度可靠地处理诸如铜膜的导电材料。复合处理装置包括：用于保持基板的基板保持件; 一种处理台，包括用于通过涉及机械动作的处理方法来处理所述基板的表面的机械处理部分; 以及与机械加工部分开的电解处理部。电解处理部包括具有离子交换器的处理电极，用于通过在保持离子交换器（92）与基板接触的同时在处理电极和基板之间施加电压来处理基板。所述复合处理装置还包括用于在所述基板和所述处理电极之间以及所述基板和所述机械加工部之间供给液体的液体供给部; 以及用于相对于彼此移动所述基板和所述处理台的驱动部。

2. 发明申请

US20060175191A1 Composite machining device and method 失效
标题翻译：复合加工装置及方法
公开(公告)号：US20060175191A1
公开(公告)日：2006-08-10
申请号：US10549324
申请日：2004-03-12
申请人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
发明人： Osamu Nabeya , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Ikutaro Noji
IPC分类号： B01J19/12
CPC分类号： C25F7/00
摘要： The present invention relates to composite processing apparatus which can securely process a conductive material, such as a copper film, at a low surface pressure and a high rate while effectively preventing the formation of pits. The composite processing apparatus of this invention including: a substrate holder (42) for holding a substrate (W); a processing table (46) including a mechanical processing section (82) for processing a surface of the substrate (W) by a processing method involving a mechanical action, and an electrolytic processing section (84), provided separately from the mechanical processing section and having a processing electrode (86) provided with an ion exchanger (92), for processing the substrate (W) by applying a voltage between the processing electrode (86) and the substrate (W) while keeping the ion exchanger (92) in contact with the substrate (W); a liquid supply section (94) for supplying a liquid between the substrate (W) and the processing electrode (86), and between the substrate (W) and the mechanical processing section (94); and a drive section for moving the substrate (W) and the processing table (46) relative to each other.
摘要翻译：本发明涉及能够以低表面压力和高速率可靠地处理诸如铜膜的导电材料的复合加工装置，同时有效地防止凹坑的形成。本发明的复合处理装置包括：用于保持基板（W）的基板保持架（42）; 包括用于通过涉及机械动作的处理方法来处理所述基板（W）的表面的机械处理部（82）的处理台（46）和与所述机械处理部分开设置的电解处理部（84），以及具有设置有离子交换器（92）的处理电极（86），用于通过在保持离子交换器（92）接触的同时在处理电极（86）和基板（W）之间施加电压来处理基板（W）与基底（W）; 用于在衬底（W）和处理电极（86）之间以及衬底（W）和机械处理部分（94）之间供应液体的液体供应部分（94）; 以及用于相对于彼此移动衬底（W）和处理台（46）的驱动部分。

3. 发明申请

US20070187257A1 Electrolytic processing apparatus and electrolytic processing method 审中-公开
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US20070187257A1
公开(公告)日：2007-08-16
申请号：US10592673
申请日：2005-03-16
申请人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
发明人： Ikutaro Noji , Hozumi Yasuda , Takeshi Iizumi , Itsuki Kobata , Kazuto Hirokawa , Takayuki Saito , Tsukuru Suzuki , Yasushi Toma , Akira Kodera
IPC分类号： B23H7/00
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F3/02 , C25F7/00 , H01L21/32125
摘要： An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electrolytic processing apparatus including: a processing electrode capable of bringing into contact with or closing to a workpiece; a feeding electrode for feeding electricity to the workpiece; a contact member disposed between the workpiece and at least one of the processing electrode and the feeding electrode, the degree of deformation of said contact member by a contact load applied from the workpiece being smal
摘要翻译：电解处理装置可以保持工件表面中的凹部和凸起部之间的电阻差，从而提供具有改善的平坦度的加工表面。电解处理装置包括：能够与工件接触或闭合的处理电极; 用于向工件供电的供电电极; 设置在工件与处理电极和供电电极中的至少一个之间的接触构件，通过从工件施加的接触载荷为微小的所述接触构件的变形程度为小

4. 发明授权

US08133380B2 Method for regenerating ion exchanger 有权
标题翻译：离子交换器再生方法
公开(公告)号：US08133380B2
公开(公告)日：2012-03-13
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： B23H3/10
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

5. 发明授权

US07638030B2 Electrolytic processing apparatus and electrolytic processing method 有权
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07638030B2
公开(公告)日：2009-12-29
申请号：US10669468
申请日：2003-09-25
申请人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
发明人： Osamu Nabeya , Masayuki Kumekawa , Hozumi Yasuda , Itsuki Kobata , Takeshi Iizumi , Nobuyuki Takada , Koichi Fukaya , Mitsuhiko Shirakashi , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita
IPC分类号： C25F7/00 , B23H5/06
CPC分类号： C25F7/00
摘要： An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.
摘要翻译：一种在完全消除CMP处理或者尽可能减少CMP处理负荷的电解处理装置可以处理和平坦化形成在基板表面上的导电材料，或者可以除去（清洁）附着的附着物到工件（例如基板）的表面。本发明包括一个电极部分，它包括平行设置的多个电极部件，每个电极部件包括一个电极和一个覆盖电极表面的离子交换器，一个用于保持工件的保持器，它能使工件靠近或与电极部件的离子交换器接触，以及要连接到电极部分的每个电极部件的电极的电源。电极构件的离子交换器包括具有优异表面平滑度的离子交换器和离子交换容量大的离子交换器。

6. 发明申请

US20080314763A1 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
标题翻译：再生离子交换器的方法和装置，以及电解处理装置
公开(公告)号：US20080314763A1
公开(公告)日：2008-12-25
申请号：US12222733
申请日：2008-08-14
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiro Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25F1/00 , C25F7/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.
摘要翻译：用于再生离子交换剂的方法和装置可以容易且快速地再生离子交换器，并且可以在再生离子交换器的清洁和废液的处理时最小化负载。再生污染离子交换器的方法包括：提供一对再生电极和对置电极，设置在电极之间的隔板和设置在对电极与隔板之间的再生用离子交换器; 并在再生电极和对电极之间施加电压，同时在隔板和再生电极之间提供液体，并且还在分隔件和对电极之间供应液体。

7. 发明授权

US07427345B2 Method and device for regenerating ion exchanger, and electrolytic processing apparatus 有权
公开(公告)号：US07427345B2
公开(公告)日：2008-09-23
申请号：US10432397
申请日：2002-11-29
申请人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
发明人： Takayuki Saito , Tsukuru Suzuki , Yuji Makita , Kaoru Yamada , Masayuki Kumekawa , Hozumi Yasuda , Osamu Nabeya , Kazuto Hirokawa , Mitsuhiko Shirakashi , Yasushi Toma , Itsuki Kobata
IPC分类号： C25D17/00 , C25B15/00 , B23H3/00
CPC分类号： C25F3/00 , B01J49/30 , C25F7/00
摘要： A method and device for regenerating an ion exchanger can regenerate an ion exchanger easily and quickly, and can minimize a load upon cleaning of the regenerated ion exchanger and disposal of waste liquid. A method for regenerating a contaminated ion exchanger includes: providing a pair of a regeneration electrode and a counter electrode, a partition disposed between the electrodes, and an ion exchanger to be regenerated disposed between the counter electrode and the partition; and applying a voltage between the regeneration electrode and the counter electrode while supplying a liquid between the partition and the regeneration electrode and also supplying a liquid between the partition and the counter electrode.

8. 发明授权

US07208076B2 Substrate processing apparatus and method 失效
公开(公告)号：US07208076B2
公开(公告)日：2007-04-24
申请号：US10485177
申请日：2002-09-11
申请人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
发明人： Itsuki Kobata , Mitsuhiko Shirakashi , Masayuki Kumekawa , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Kaoru Yamada , Yuji Makita , Hozumi Yasuda
IPC分类号： C25F7/00 , C25F5/00 , C25F3/14
CPC分类号： H01L21/6708 , C25F3/00 , C25F7/00
摘要： A substrate processing apparatus can perform an electrolytic processing, which is different from a common, conventional etching, to remove (clean off) a conductive material (film) formed on or adhering to a bevel portion, etc. of a substrate, or process a peripheral portion of a substrate through an electrochemical action. The substrate processing apparatus includes: an electrode section having a plurality of electrodes which are laminated with insulators being interposed, and having a holding portion which is to be opposed to a peripheral portion of a substrate; an ion exchanger disposed in the holding portion of the electrode section; a liquid supply section for supplying a liquid to the holding position of the electrode section; and a power source for applying a voltage to the electrodes of the electrode section so that the electrodes alternately have different polarities.

9. 发明申请

US20100325913A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：US20100325913A1
公开(公告)日：2010-12-30
申请号：US12821456
申请日：2010-06-23
申请人： Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
发明人： Xinming WANG , Kazuo Yamauchi , Akira Kodera , Tsukuru Suzuki , Yasushi Toma , Takayuki Saito , Hirokuni Hiyama
IPC分类号： F26B7/00
CPC分类号： F26B5/12 , F26B21/004 , H01L21/67028
摘要： A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.
摘要翻译：不使用或仅使用尽可能少量有机溶剂的底物处理方法，并且可以快速且完全地从湿底物表面除去液体，而不会使液体残留在基材表面上。用于干燥被液体湿润的基板表面的基板处理方法包括：从基板表面去除液体并将其周围的气体与其一起吸入与基板表面相对设置的气/液吸嘴中，同时相对使气体/液体吸嘴和基板彼此平行移动; 并且将相对于基板表面设置的干燥气体供给喷嘴的干燥气体吹向基板表面的已被除去液体的区域，同时使干燥气体供给喷嘴和基板彼此平行地相对移动。

10. 发明授权

US07527723B2 Electrolytic processing apparatus and electrolytic processing method 失效
标题翻译：电解处理装置及电解处理方法
公开(公告)号：US07527723B2
公开(公告)日：2009-05-05
申请号：US11035373
申请日：2005-01-14
申请人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
发明人： Itsuki Kobata , Yutaka Wada , Hirokuni Hiyama , Takayuki Saito , Yasushi Toma , Tsukuru Suzuki , Akira Kodera
IPC分类号： B23H7/36 , B23H1/10 , B23H3/10
CPC分类号： H01L21/32115 , B23H5/08 , B24B37/042 , B24B37/046 , C25F1/00 , C25F3/00 , H01L21/7684
摘要： An electrolytic processing apparatus can increase the efficiency of the dissociation reaction of water and efficiently perform electrolytic processing, and can eliminate the need for an operation of a change of ion exchanger. The electrolytic processing apparatus includes: a processing electrode and a feeding electrode; a liquid supply section for supplying a liquid containing an ion-exchange material between the workpiece and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a drive section for moving the workpiece and at least one of the processing electrode and the feeding electrode relative to each other; wherein electrolytic processing of the workpiece is carried out while keeping the workpiece not in contact with but close to the processing electrode at a distance of not more than 10 μm.
摘要翻译：电解处理装置可以提高水的解离反应的效率，并且有效地进行电解处理，并且可以消除对离子交换剂的变化操作的需要。电解处理装置包括：处理电极和馈电电极; 液体供应部分，用于在工件和处理电极和馈电电极中的至少一个之间提供含有离子交换材料的液体; 用于在处理电极和馈电电极之间施加电压的电源; 以及用于相对于彼此移动所述工件和所述处理电极和所述馈送电极中的至少一个的驱动部分; 其中，对工件的电解处理在不超过10um的距离保持工件不与处理电极接触而靠近处理电极的同时进行。

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