专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 外观设计

USD415184S Apparatus for manufacturing a semiconductor for a liquid crystal display 失效
公开(公告)号：USD415184S
公开(公告)日：1999-10-12
申请号：US90228
申请日：1998-07-01
申请人： Noriyuki Anai , Tsutae Omori , Shinkou Matsumoto
设计人： Noriyuki Anai , Tsutae Omori , Shinkou Matsumoto

2. 外观设计

USD415776S Apparatus for manufacturing a semiconductor for a liquid crystal display 失效
公开(公告)号：USD415776S
公开(公告)日：1999-10-26
申请号：US90241
申请日：1998-07-01
申请人： Noriyuki Anai , Tsutae Omori , Shinkou Matsumoto
设计人： Noriyuki Anai , Tsutae Omori , Shinkou Matsumoto

3. 发明授权

US06635113B2 Coating apparatus and coating method 失效
标题翻译：涂布设备和涂布方法
公开(公告)号：US06635113B2
公开(公告)日：2003-10-21
申请号：US09313860
申请日：1999-05-18
申请人： Hideyuki Takamori , Noriyuki Anai , Masafumi Nomura , Kiyohisa Tateyama , Tsutae Omori
发明人： Hideyuki Takamori , Noriyuki Anai , Masafumi Nomura , Kiyohisa Tateyama , Tsutae Omori
IPC分类号： B05C1110
CPC分类号： H01L21/6715
摘要： A substrate is held on a spin chuck, and resist solution is supplied to the surface of the substrate at a plurality of positions spaced at predetermined intervals from a plurality of resist nozzles provided the bottom surface of a resist pipe provided over a first direction across the surface of the substrate. Thereafter, the substrate is oscillated or rotated, thereby making the resist solution on the substrate a thin coating film with a uniform thickness. In the coating apparatus and method, which are excellent in responsiveness to a degree of viscosity of coating solution, various kinds of treatment agents with a wide range of viscosity can be used, and mechanical accuracy such as the space between the nozzles and the substrate, accuracy of the nozzle size, and the like can be loosened.
摘要翻译：将基板保持在旋转卡盘上，并且将抗蚀剂溶液以多个位置间隔开的多个位置从多个抗蚀剂喷嘴供应到基板的表面，所述多个抗蚀剂喷嘴设置在沿着第一方向设置的抗蚀剂管的底表面基板的表面。此后，基板振荡或旋转，从而使抗蚀剂溶液在基板上具有均匀厚度的薄涂层膜。在对涂布液的粘度的响应性优异的涂布装置和方法中，可以使用具有宽范围粘度的各种处理剂，并且可以使用诸如喷嘴和基板之间的空间的机械精度，可以使喷嘴尺寸的精度等松动。

4. 发明授权

US06458208B1 Film forming apparatus 失效
标题翻译：成膜装置
公开(公告)号：US06458208B1
公开(公告)日：2002-10-01
申请号：US09643941
申请日：2000-08-23
申请人： Noriyuki Anai , Tsutae Omori , Masaaki Takizawa , Mitsuhiro Sakai
发明人： Noriyuki Anai , Tsutae Omori , Masaaki Takizawa , Mitsuhiro Sakai
IPC分类号： B05C1108
CPC分类号： H01L21/6715 , B01D19/0005 , B01D19/0031 , B05D1/005 , B05D5/00 , G03F7/162 , Y10S118/04
摘要： A film forming apparatus comprising: a spin chuck; a cup; a lid; a first circular/tubular nozzle for supplying a resist solution to a first portion corresponding to the rotation center portion of a rectangular substrate; a plurality of second circular/tubular nozzles that supply the resist solution to a plurality of second portions of the rectangular substrate to which supply of the resist solution by centrifugal force is difficult, the distances between the rotation center portion and each of the second portions being greater than a half of a shorter side of the rectangular substrate; a rectangular nozzle holder that holds the first nozzle and the second nozzles; a mechanism that positions the nozzle holder; a controller that controls an amount of the resist solution from the first and second nozzles, attaches the lid to the cup, and rotates the substrate with the spin chuck; a resist solution tank; a supply tube provided between the resist solution tank and the first and second nozzles; a bellows pump for supplying the resist solution to the first and second nozzles; and an air operation valve for passing or stopping the resist solution in the supply tube.
摘要翻译：一种成膜设备，包括：旋转卡盘; 一杯; 盖子用于将抗蚀剂溶液供应到对应于矩形基板的旋转中心部分的第一部分的第一圆形/管状喷嘴; 多个第二圆形/管状喷嘴，其将抗蚀剂溶液供给到通过离心力供应抗蚀剂溶液的矩形基板的多个第二部分，旋转中心部分和每个第二部分之间的距离为大于矩形基板的短边的一半; 保持所述第一喷嘴和所述第二喷嘴的矩形喷嘴保持器; 定位喷嘴座的机构; 控制器，其控制来自第一和第二喷嘴的抗蚀剂溶液的量，将盖子附接到杯子，并且用旋转卡盘旋转基板; 抗蚀剂溶液罐; 供应管，设置在所述抗蚀剂溶液罐与所述第一和第二喷嘴之间; 用于将抗蚀剂溶液供应到第一和第二喷嘴的波纹管泵; 以及用于使供给管中的抗蚀剂溶液通过或停止的空气操作阀。

5. 发明授权

US06165552A Film forming method 失效
标题翻译：成膜方法
公开(公告)号：US06165552A
公开(公告)日：2000-12-26
申请号：US135408
申请日：1998-08-18
申请人： Noriyuki Anai , Tsutae Omori , Masaaki Takizawa , Mitsuhiro Sakai
发明人： Noriyuki Anai , Tsutae Omori , Masaaki Takizawa , Mitsuhiro Sakai
IPC分类号： B01D19/00 , B05D1/00 , B05D5/00 , G03F7/16 , H01L21/00 , B05D1/40
CPC分类号： H01L21/6715 , B01D19/0005 , B01D19/0031 , B05D1/005 , B05D5/00 , G03F7/162 , Y10S118/04
摘要： A film-forming method comprises the steps of: (a) holding a rectangular substrate by a spin chuck provided in a cup; (b) positioning a solvent supply nozzle above the rectangular substrate and supplying a solvent to the rectangular substrate, the solvent supply nozzle having a liquid discharge port which has a length at least corresponding to that of a peripheral portion of the rectangular substrate; (c) positioning a process liquid supply nozzle above the rectangular substrate and supplying a process liquid to a portion at a rotation center portion of the rectangular substrate, thereby to form a film; (d) rotating the rectangular substrate in the cup to adjust a film thickness of the film; and (e) thereafter positioning the solvent supply nozzle above one peripheral portion of the rectangular substrate and supplying the solvent to the one peripheral portion of the rectangular substrate, whereby the film is removed from the one peripheral portion of the rectangular substrate, the substrate being subsequently rotated by the spin chuck to position the solvent supply nozzle to another peripheral portion of the rectangular substrate, whereby the film is removed from the another peripheral portion of the rectangular substrate.
摘要翻译：一种成膜方法包括以下步骤：（a）通过设置在杯中的旋转卡盘保持矩形基板; （b）将溶剂供应喷嘴定位在矩形基板上方并将溶剂供应到矩形基板上，所述溶剂供应喷嘴具有至少对应于矩形基板的周边部分的长度的液体排出口; （c）将工艺液体供给喷嘴定位在矩形基板上方并将处理液体供给到矩形基板的旋转中心部分的部分，从而形成膜; （d）使杯中的矩形基板旋转以调节膜的膜厚度; 和（e）然后将溶剂供给喷嘴定位在矩形基板的一个周边部分上方，并将溶剂供应到矩形基板的一个周边部分，由此从矩形基板的一个周边部分去除膜，基板为随后通过旋转卡盘旋转以将溶剂供应喷嘴定位到矩形基板的另一个周边部分，由此从矩形基板的另一个周边部分移除薄膜。

6. 发明授权

US5681614A Hydrophobic treatment method involving delivery of a liquid process agent to a process space 失效
标题翻译：涉及将液体加工剂输送到工艺空间的疏水处理方法
公开(公告)号：US5681614A
公开(公告)日：1997-10-28
申请号：US595785
申请日：1996-02-02
申请人： Tsutae Omori , Kouji Harada , Takami Satoh , Noriyuki Anai , Masafumi Nomura
发明人： Tsutae Omori , Kouji Harada , Takami Satoh , Noriyuki Anai , Masafumi Nomura
IPC分类号： G03F7/16 , C23C16/44 , C23C16/448 , H01L21/027 , H01L21/30 , C23C16/52
CPC分类号： C23C16/4485 , C23C16/4412 , Y10S427/101
摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.
摘要翻译：用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量时间。处理室可以通过排气管连接到处理室的喷射器进行减压。安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。一个环围绕安装座，两个液体接收凹口形成在环的顶部。两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。液相中的HMDS被供应到处理室中并在其中蒸发。通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。

7. 发明授权

US5505781A Hydrophobic processing apparatus including a liquid delivery system 失效
标题翻译：疏水处理装置，包括液体输送系统
公开(公告)号：US5505781A
公开(公告)日：1996-04-09
申请号：US189071
申请日：1994-01-28
申请人： Tsutae Omori , Kouji Harada , Takami Satoh , Noriyuki Anai , Masafumi Nomura
发明人： Tsutae Omori , Kouji Harada , Takami Satoh , Noriyuki Anai , Masafumi Nomura
IPC分类号： G03F7/16 , C23C16/44 , C23C16/448 , H01L21/027 , H01L21/30 , C23C16/00
CPC分类号： C23C16/4485 , C23C16/4412 , Y10S427/101
摘要： An apparatus for hydrophobic treatment of a semiconductor wafer comprises a tank in which HMDS liquid is stored, a process chamber in which the wafer is treated, and a unit for supplying HMDS liquid from the tank into the process chamber in an amount needed at any desired time. The process chamber can be decompressed by an ejector which is connected to the process chamber through an exhaust pipe. A mount on which the wafer is mounted is arranged in the process chamber and it includes a heater embedded therein. A ring surrounds the mount and two liquid receiving recesses are formed on the top of the ring. Two HMDS liquid supply pipes extend just above their corresponding liquid receiving recesses. HMDS in liquid phase is supplied into the process chamber and vaporized in it. The density of HMDS gas in the process chamber is controlled by adjusting the amount of HMDS liquid supplied.
摘要翻译：用于半导体晶片的疏水处理的设备包括其中存储HMDS液体的罐，处理所述晶片的处理室，以及用于将HMDS液体从所述罐供应到所述处理室中的单元，其以任何所需的量时间。处理室可以通过排气管连接到处理室的喷射器进行减压。安装有晶片的安装件布置在处理室中，并且其包括嵌入其中的加热器。一个环围绕安装座，两个液体接收凹口形成在环的顶部。两个HMDS液体供应管正好在其相应的液体接收凹槽上方延伸。液相中的HMDS被供应到处理室中并在其中蒸发。通过调节供应的HMDS液体的量来控制处理室中的HMDS气体的密度。

8. 发明授权

US06261007B1 Substrate process method and substrate process apparatus 失效
标题翻译：基板工艺方法和基板工艺装置
公开(公告)号：US06261007B1
公开(公告)日：2001-07-17
申请号：US09362860
申请日：1999-07-29
申请人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
发明人： Hideyuki Takamori , Kiyohisa Tateyama , Kengo Mizosaki , Noriyuki Anai , Mitsuhiro Sakai , Shinobu Tanaka , Yoichi Honda , Yuji Shimomura
IPC分类号： G03D500
CPC分类号： H01L21/6715 , G03F7/168 , H01L21/67034
摘要： Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
摘要翻译：刚刚将抗蚀剂溶液涂覆在基材上之后，其基本处于非加热状态。实际上，惯性气体等从喷头吹送到基板。因此，涂布在基板上的抗蚀剂溶液被干燥。因此，可以防止导致抗蚀剂膜的膜厚度不均匀的转印标记和电路图案的线宽波动。

9. 发明授权

US5782990A Method for washing objects 失效
标题翻译：清洗物品的方法
公开(公告)号：US5782990A
公开(公告)日：1998-07-21
申请号：US789537
申请日：1997-01-27
申请人： Shinya Murakami , Yuuji Kamikawa , Sinichiro Izumi , Noriyuki Anai , Takami Satoh , Hirofumi Shiraishi , Koji Harada , Takayuki Tomoeda , Hiroshi Tanaka
发明人： Shinya Murakami , Yuuji Kamikawa , Sinichiro Izumi , Noriyuki Anai , Takami Satoh , Hirofumi Shiraishi , Koji Harada , Takayuki Tomoeda , Hiroshi Tanaka
IPC分类号： B08B3/02 , B08B3/04 , B08B3/10 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67754 , B08B3/02 , B08B3/04 , B08B3/102 , H01L21/67051 , H01L21/67057 , H01L21/67757 , Y10S134/902
摘要： A washing method for washing objects includes the steps of supplying a washing liquid to a washing vessel and immersing objects in the washing liquid contained in the washing vessel. The method also includes the steps of discharging the liquid at least once from the washing vessel, and starting to apply the washing liquid to the objects when the objects are partly exposed to air as the liquid is discharged from the washing vessel. The washing liquid application is continued during exposure of the objects to the air to prevent the surface of the objects from being dried and stained.
摘要翻译：用于清洗物体的清洗方法包括以下步骤：将洗涤液体供应到洗涤容器中，并将物品浸入容纳在洗涤容器中的洗涤液体中。该方法还包括以下步骤：从洗涤容器排出至少一次液体，并且当液体从洗涤容器中排出时，当物体部分暴露在空气中时，开始将洗涤液施加到物体上。在将物体暴露于空气中期间继续洗涤液体的应用，以防止物体的表面被干燥和染色。

10. 发明授权

US5671764A Washing apparatus, and washing method 失效
标题翻译：洗衣机和洗涤方法
公开(公告)号：US5671764A
公开(公告)日：1997-09-30
申请号：US560708
申请日：1995-11-20
申请人： Shinya Murakami , Yuuji Kamikawa , Sinichiro Izumi , Noriyuki Anai , Takami Satoh , Hirofumi Shiraishi , Koji Harada , Takayuki Tomoeda , Hiroshi Tanaka
发明人： Shinya Murakami , Yuuji Kamikawa , Sinichiro Izumi , Noriyuki Anai , Takami Satoh , Hirofumi Shiraishi , Koji Harada , Takayuki Tomoeda , Hiroshi Tanaka
IPC分类号： B08B3/02 , B08B3/04 , B08B3/10 , H01L21/00 , H01L21/677 , B08B15/00
CPC分类号： H01L21/67754 , B08B3/02 , B08B3/04 , B08B3/102 , H01L21/67051 , H01L21/67057 , H01L21/67757 , Y10S134/902
摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.
摘要翻译：本文公开了一种洗涤装置，包括洗涤室，打开/关闭机构和喷嘴。该室具有开口，设计用于清洗从外部通过开口运送的物体。打开/关闭机构设计成打开和关闭洗涤室的开口。喷嘴用于清洗打开/关闭机构。该装置还包括一个填充有洗涤液体的洗涤容器，用于清洗物体，还有一个喷嘴，用于当清洗液体从洗涤液中排出时物体被部分暴露时，将洗涤液施加到位于洗涤容器中的物体上船只。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式