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1. 发明申请

US20060275951A1 Microelectronic assemblies having low profile connections 审中-公开
标题翻译：具有薄型连接的微电子组件
公开(公告)号：US20060275951A1
公开(公告)日：2006-12-07
申请号：US11487880
申请日：2006-07-17
申请人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith
发明人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith
IPC分类号： H01L21/00
CPC分类号： H01L24/10 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/73204 , H01L2224/81193 , H01L2224/8193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05124
摘要： A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.
摘要翻译：微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸在顶面和底面之间，与第一微电子元件上的触点对齐。组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接，电介质层的顶表面与第二微电子元件的第一表面间隔开。

2. 发明授权

US07098074B2 Microelectronic assemblies having low profile connections 有权
标题翻译：具有薄型连接的微电子组件
公开(公告)号：US07098074B2
公开(公告)日：2006-08-29
申请号：US10699328
申请日：2003-10-31
申请人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
发明人： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John W. Smith
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/73204 , H01L2224/81193 , H01L2224/8193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05124
摘要： A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
摘要翻译：公开了一种制造微电子封装的方法。将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。微电子元件组装到微电子元件上。还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

3. 发明授权

US09178090B2 Reaction apparatus and method for manufacturing a CIGS absorber of a thin film solar cell 有权
标题翻译：用于制造薄膜太阳能电池的CIGS吸收体的反应装置和方法
公开(公告)号：US09178090B2
公开(公告)日：2015-11-03
申请号：US13941012
申请日：2013-07-12
申请人： Delin Li
发明人： Delin Li
IPC分类号： C23C16/54 , H01L21/67 , H01L31/0392 , H01L31/032 , C23C16/455
CPC分类号： H01L31/03928 , C23C16/45561 , C23C16/545 , H01L21/67155 , H01L21/67161 , H01L21/67173 , H01L22/10 , H01L22/26 , H01L31/0322 , H01L31/18 , Y02E10/541
摘要： The present invention provides an apparatus and a method for manufacturing a CIGS absorber of a thin film solar cell. The apparatus includes a supply chamber configured to provide a flexible substrate coated with precursors. The apparatus further includes a reaction chamber coupled to the supply chamber for at least subjecting the precursors on the flexible substrate to a reactive gas at a first state to form an absorber material. Additionally, the apparatus includes a gas-balancing chamber filled with the reactive gas at a second state. The gas-balancing chamber is communicated with the reaction chamber for automatically updating the first state of the reactive gas to the second state. Moreover, the apparatus includes a control system to maintain the second state of the reactive gas in the gas-balancing chamber at a preset condition and to adjust the transportation of the flexible substrate through the reaction chamber.
摘要翻译：本发明提供一种用于制造薄膜太阳能电池的CIGS吸收体的装置和方法。该设备包括供应室，其构造成提供涂覆有前体的柔性基材。该装置还包括耦合到供应室的反应室，用于至少使柔性基板上的前体经受第一状态的反应性气体以形成吸收材料。另外，该装置包括在第二状态下填充有反应性气体的气体平衡室。气体平衡室与反应室连通，用于将反应气体的第一状态自动更新为第二状态。此外，该装置包括将气体平衡室中的反应气体的第二状态保持在预设状态并调节柔性基板通过反应室的输送的控制系统。

4. 发明授权

US07705467B2 Stacked package electronic device 有权
标题翻译：堆叠式封装电子器件
公开(公告)号：US07705467B2
公开(公告)日：2010-04-27
申请号：US11769536
申请日：2007-06-27
申请人： Delin Li
发明人： Delin Li
IPC分类号： H01L23/34
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/48237 , H01L2224/48245 , H01L2224/48247 , H01L2224/4911 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2224/92125 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.
摘要翻译：电气部件包括衬底，附接到衬底的第一集成电路，耦合到第一集成电路的金属部分和附接到第一集成电路的第二集成电路。金属部分夹在第一集成电路和第二集成电路之间。

5. 发明申请

US20060003494A1 Stacked package electronic device 有权
标题翻译：堆叠式封装电子器件
公开(公告)号：US20060003494A1
公开(公告)日：2006-01-05
申请号：US10880998
申请日：2004-06-30
申请人： Delin Li
发明人： Delin Li
IPC分类号： H01L21/44
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/552 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/48237 , H01L2224/48245 , H01L2224/48247 , H01L2224/4911 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2224/92125 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2225/06575 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01033 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18301 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2224/0401 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.
摘要翻译：电气部件包括衬底，附接到衬底的第一集成电路，耦合到第一集成电路的金属部分和附接到第一集成电路的第二集成电路。金属部分夹在第一集成电路和第二集成电路之间。

6. 发明申请

US20050018975A1 Metallized optical fibers and ferrules for optical fibers for direct attachment to photodiodes 失效
公开(公告)号：US20050018975A1
公开(公告)日：2005-01-27
申请号：US10625255
申请日：2003-07-23
申请人： Yen-Ping Ho , Delin Li
发明人： Yen-Ping Ho , Delin Li
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4202 , G02B6/4238
摘要： An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.

7. 发明授权

US06601292B2 Method for the connection and repair of flex and other circuits 失效
标题翻译：柔性和其他电路的连接和修复方法
公开(公告)号：US06601292B2
公开(公告)日：2003-08-05
申请号：US09891697
申请日：2001-06-26
申请人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
发明人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
IPC分类号： H05K300
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要翻译：用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。

8. 发明授权

US06499214B2 Method of making a circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06499214B2
公开(公告)日：2002-12-31
申请号：US09812449
申请日：2001-03-20
申请人： Delin Li , Richard Keith McMillan , Zhong-You Shi
发明人： Delin Li , Richard Keith McMillan , Zhong-You Shi
IPC分类号： H05K320
CPC分类号： H05K3/429 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917
摘要： A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
摘要翻译：一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

9. 发明授权

US06467161B2 Method for making a circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06467161B2
公开(公告)日：2002-10-22
申请号：US09812989
申请日：2001-03-20
申请人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
发明人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
IPC分类号： H05K320
CPC分类号： H05K3/4685 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
摘要翻译：一种用于制造具有金属化孔18,20,118,120的多层电子电路板82,148的方法10,110，其可以选择性地和电连接到地电位源。

10. 发明授权

US5968386A Method for protecting electronic components 失效
标题翻译：保护电子部件的方法
公开(公告)号：US5968386A
公开(公告)日：1999-10-19
申请号：US993112
申请日：1997-12-18
申请人： Lakhi Nandlal Goenka , Delin Li , Daniel Phillip Dailey , Charles Frederick Schweitzer , Michael Bednarz , Brenda Joyce Nation
发明人： Lakhi Nandlal Goenka , Delin Li , Daniel Phillip Dailey , Charles Frederick Schweitzer , Michael Bednarz , Brenda Joyce Nation
IPC分类号： H05K3/28 , H05K5/06 , H05B1/00
CPC分类号： H05K5/068 , H05K3/284
摘要： An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.
摘要翻译：一种具有改善的防恶劣环境保护的电子电路，其优选实施例包括：具有顶表面12的基板10; 电子部件14，其安装在基板的上表面上; 塑料和金属箔层压壁板16，其周边具有外周边18，外周边密封地附接到基板的顶表面12，以便在顶表面12和阻挡层16之间形成封闭的袋20，组件14被封闭; 干燥剂元件50包括：具有内部室的壳体51，入口孔58和出口孔59，其中入口孔和出口孔各自与内部室连通; 包含在内部室内的预定量的干燥剂材料53; 位于入口孔58和内室之间的常开内部阀54; 位于出口孔59和内室之间的常闭外部阀56; 以及用于可选地加热干燥剂材料53的加热装置52，优选地在其再生温度之上。干燥剂元件50被定位成使得至少其内孔54密封地封闭在封闭的口袋20内。

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