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1. 发明授权

US5968386A Method for protecting electronic components 失效
标题翻译：保护电子部件的方法
公开(公告)号：US5968386A
公开(公告)日：1999-10-19
申请号：US993112
申请日：1997-12-18
申请人： Lakhi Nandlal Goenka , Delin Li , Daniel Phillip Dailey , Charles Frederick Schweitzer , Michael Bednarz , Brenda Joyce Nation
发明人： Lakhi Nandlal Goenka , Delin Li , Daniel Phillip Dailey , Charles Frederick Schweitzer , Michael Bednarz , Brenda Joyce Nation
IPC分类号： H05K3/28 , H05K5/06 , H05B1/00
CPC分类号： H05K5/068 , H05K3/284
摘要： An an electronic circuit having improved protection against harsh environments, a preferred embodiment thereof including: a substrate 10 having a top surface 12; an electronic component 14 attached to the top surface of the substrate; a plastic and metal foil laminated barrier 16 having an outer periphery 18 thereabout, the outer periphery being sealably attached to the top surface 12 of the substrate so as to define a closed pocket 20 between the top surface 12 and the barrier 16 within which the electronic component 14 is enclosed; and a desiccant element 50. The desiccant element 50 includes: a case 51 having an internal chamber, an inlet orifice 58, and an outlet orifice 59, wherein the inlet and outlet orifices are each in communication with the internal chamber; a predetermined amount of desiccant material 53 contained within the internal chamber; a normally-open interior valve 54 situated between the inlet orifice 58 and the internal chamber; a normally-closed exterior valve 56 situated between the outlet orifice 59 and the internal chamber; and heating means 52 for selectably heating the desiccant material 53 preferably above a regeneration temperature thereof. The desiccant element 50 is situated such that at least the interior orifice 54 thereof is sealably enclosed within the closed pocket 20.
摘要翻译：一种具有改善的防恶劣环境保护的电子电路，其优选实施例包括：具有顶表面12的基板10; 电子部件14，其安装在基板的上表面上; 塑料和金属箔层压壁板16，其周边具有外周边18，外周边密封地附接到基板的顶表面12，以便在顶表面12和阻挡层16之间形成封闭的袋20，组件14被封闭; 干燥剂元件50包括：具有内部室的壳体51，入口孔58和出口孔59，其中入口孔和出口孔各自与内部室连通; 包含在内部室内的预定量的干燥剂材料53; 位于入口孔58和内室之间的常开内部阀54; 位于出口孔59和内室之间的常闭外部阀56; 以及用于可选地加热干燥剂材料53的加热装置52，优选地在其再生温度之上。干燥剂元件50被定位成使得至少其内孔54密封地封闭在封闭的口袋20内。

2. 发明授权

US06320128B1 Environmentally-sealed electronic assembly and method of making same 失效
标题翻译：环保密封电子组件及其制造方法
公开(公告)号：US06320128B1
公开(公告)日：2001-11-20
申请号：US09578394
申请日：2000-05-25
申请人： Andrew Zachary Glovatsky , Brenda Joyce Nation , Charles Frederick Schweitzer , Daniel Phillip Dailey , Delin Li , Jay DeAvis Baker , Lakhi Nandlal Goenka , Lawrence LeRoy Kneisel , Myron Lemecha
发明人： Andrew Zachary Glovatsky , Brenda Joyce Nation , Charles Frederick Schweitzer , Daniel Phillip Dailey , Delin Li , Jay DeAvis Baker , Lakhi Nandlal Goenka , Lawrence LeRoy Kneisel , Myron Lemecha
IPC分类号： H01L2328
CPC分类号： H05K3/284 , H01L23/5387 , H01L2924/0002 , H05K1/189 , H05K5/0095 , H01L2924/00
摘要： An electronic assembly includes a flexible multilayer substrate having integral electrically-conductive traces that also includes, as a lowermost layer, a metal foil. A plurality of uppermost layers, likewise including a metal foil, form a thin barrier member that is sealingly attached to the substrate's other layers. In this manner, a plurality of electronic components, mounted on the substrate's other layers so as to be electrically interconnected with the traces before sealingly attaching the barrier member, are encapsulated within metal foil to provide an environmentally-sealed assembly featuring improved resistance to moisture diffusion and penetration/permeation of other substances characteristic of the assembly's service environment into the assembly. A filler material, also encapsulated within the metal foil, is operative to neutralize a predetermined amount of a penetrant, further improving the operability and service life of the assembly. Preferably, a relatively-rigid polymeric material is formed in touching contact with the substrate, as by overmolding the plastic material on the environmentally-sealed assembly, to thereby provide a plastic part incorporating the assembly.
摘要翻译：电子组件包括具有整体导电迹线的柔性多层基板，其还包括作为最下层的金属箔。同样包括金属箔的多个最上层形成密封地附接到基底的其它层的薄的阻挡构件。以这种方式，将多个电子部件安装在基板的其它层上，以便在密封地附接阻挡构件之前与迹线电互连，被封装在金属箔内以提供环境密封的组件，其特征在于具有改进的抗潮湿扩散性以及组装服务环境特征的其他物质的渗透/渗透。还封装在金属箔内的填充材料可操作以中和预定量的渗透剂，进一步提高组件的可操作性和使用寿命。优选地，相对刚性的聚合物材料形成为与基底接触接触，如通过将环境密封的组件上的塑料材料包覆成型，从而提供结合该组件的塑料部件。

3. 发明授权

US06475703B2 Method for constructing multilayer circuit boards having air bridges 失效
标题翻译：用于构造具有空气桥的多层电路板的方法
公开(公告)号：US06475703B2
公开(公告)日：2002-11-05
申请号：US09203148
申请日：1998-12-01
申请人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
发明人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
IPC分类号： G03C556
CPC分类号： H05K3/062 , H05K3/205 , H05K3/386 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2203/0369 , H05K2203/0376
摘要： A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
摘要翻译：一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

4. 发明授权

US06454878B1 Cladded material construction for etched-tri-metal circuits 失效
标题翻译：蚀刻三金属电路的包层材料结构
公开(公告)号：US06454878B1
公开(公告)日：2002-09-24
申请号：US09703553
申请日：2000-11-01
申请人： Achyuta Achari , Brenda Joyce Nation , Jay D Baker , Lakhi Nandlal Goenka , Mohan R. Paruchuri , Vladimir Stoica
发明人： Achyuta Achari , Brenda Joyce Nation , Jay D Baker , Lakhi Nandlal Goenka , Mohan R. Paruchuri , Vladimir Stoica
IPC分类号： C23C806
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
摘要： A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
摘要翻译：一种用于形成包含使用包层磨的三金属材料组的方法。当形成多组三金属材料时，通过氧化制备每组的外表面以防止每一组粘附到上述或下方。氧化的替代物是在三金属材料的外表面上提供可除去的层。或者可以在中间表面上使用粘合材料; 这种接合材料可以选自锡，镍，钛，铬，银和锌。

5. 发明授权

US07048423B2 Integrated light and accessory assembly 有权
公开(公告)号：US07048423B2
公开(公告)日：2006-05-23
申请号：US09966634
申请日：2001-09-28
申请人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
发明人： Walter Kuzma Stepanenko , Jay DeAvis Baker , Lawrence LeRoy Kneisel , Richard Keith McMillan , Brenda Joyce Nation , Cindy Maria Rutyna , Charles Frederick Schweitzer , Peter Langer
IPC分类号： B60Q1/26
CPC分类号： H05K1/0274 , B29C45/14811 , B29C2045/14868 , B29K2705/00 , B29L2031/3055 , B29L2031/747 , F21S41/00 , F21S41/17 , F21S43/14 , F21S43/195 , G01S2013/9396 , H05K1/0284 , H05K3/202 , H05K2201/09118 , H05K2201/10106 , H05K2201/10113 , H05K2201/2054
摘要： An integrated light and accessory assembly for a vehicle is disclosed. The assembly includes at least one lamp for illumination of a vehicle, and also includes reflective, conductive and insulative portions inside a housing, and a module for controlling or accessorizing the assembly. Also disclosed is a method of manufacturing the assembly. The method includes providing materials for molding or shaping the components of the assembly, selectively etching conductive materials, molding the materials into a desired configuration, connecting a lamp and an accessory module to the conductive portions, and enclosing the components in a housing. A portion of the module may be removed for emergency lighting.

6. 发明授权

US06601292B2 Method for the connection and repair of flex and other circuits 失效
标题翻译：柔性和其他电路的连接和修复方法
公开(公告)号：US06601292B2
公开(公告)日：2003-08-05
申请号：US09891697
申请日：2001-06-26
申请人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
发明人： Delin Li , Jay DeAvis Baker , Achyuta Achari , Brenda Joyce Nation , John Trublowski
IPC分类号： H05K300
CPC分类号： H05K3/361 , H05K1/0293 , H05K1/117 , H05K1/118 , H05K3/0052 , H05K3/225 , H05K2201/053 , H05K2201/09127 , H05K2201/09409 , H05K2201/09709 , H05K2201/0979 , H05K2203/0228 , H05K2203/175 , Y10T29/49124 , Y10T29/49169 , Y10T29/4973 , Y10T29/49732
摘要： A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.
摘要翻译：用于制造和修复第一和第二电路之间的连接的方法，例如柔性电路。物品10包括：具有第一和第二边缘14/16的柔性电介质基底12和布置在基底上或内部的多个导电电路迹线18，其中每个迹线从靠近第一边缘14延伸到接近第二边缘14 每个电路迹线18包括：靠近第一边缘14设置的第一连接特征20; 设置在第二边缘16附近的第二连接特征22; 以及设置在第一和第二边缘14/16之间的至少一个第三连接特征24。第一，第二和第三连接特征20/22/24中的每一个是电镀通孔，电镀盲孔或安装垫。本文10可以用于使用第一和第二连接特征20/22（例如通过焊接）将第一和第二电路50/60连接在一起。如果两个电路中的任一个需要随后分离（例如，由于部件故障），则可以切割物品10以便呈现一组第三连接特征24，新的替换电路可以连接到该组。

7. 发明授权

US06467161B2 Method for making a circuit board 失效
标题翻译：制作电路板的方法
公开(公告)号：US06467161B2
公开(公告)日：2002-10-22
申请号：US09812989
申请日：2001-03-20
申请人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
发明人： Achyuta Achari , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Richard Keith McMillan , Vivek A. Jairazbhoy
IPC分类号： H05K320
CPC分类号： H05K3/4685 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.
摘要翻译：一种用于制造具有金属化孔18,20,118,120的多层电子电路板82,148的方法10,110，其可以选择性地和电连接到地电位源。

8. 发明授权

US06852932B2 Circuit board with air-bridge 失效
标题翻译：带气桥的电路板
公开(公告)号：US06852932B2
公开(公告)日：2005-02-08
申请号：US10650309
申请日：2003-08-28
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K3/00 , H05K3/06 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46 , H05K1/11 , H01R12/04
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要： A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.
摘要翻译：一种多层电路板，其具有与电接地构件选择性地和电隔离的孔，并且还具有由聚合物材料在结构上支撑的选择性地形成的空气桥和/或交叉构件。每个孔选择性地接收导电材料。

9. 发明授权

US06729023B2 Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material 失效
标题翻译：制造具有由聚合物材料支撑的空气桥的多层电路板组件的方法
公开(公告)号：US06729023B2
公开(公告)日：2004-05-04
申请号：US09815564
申请日：2001-03-23
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K302
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要： A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
摘要翻译：一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个孔96,98选择性地接收导电材料114。

10. 发明授权

US06403893B2 Circuit board and a method for making the same 失效
标题翻译：电路板及其制作方法
公开(公告)号：US06403893B2
公开(公告)日：2002-06-11
申请号：US09907971
申请日：2001-03-20
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K114
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49156
摘要： A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.
摘要翻译：一种用于制造具有电镀孔96,98的多层电子电路板136的方法，其可以与电接地构件46选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件128 134。

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