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1. 发明授权

US07566955B2 High-frequency chip packages 有权
标题翻译：高频芯片封装
公开(公告)号：US07566955B2
公开(公告)日：2009-07-28
申请号：US10488210
申请日：2002-08-28
申请人： Michael Warner
发明人： Michael Warner
IPC分类号： H01L23/02
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/12105 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45099 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2224/85399 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H2009/0019 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.
摘要翻译：封装的半导体芯片包括诸如具有大导热体的芯片载体的特征，其可以焊接到电路板，以便为电路板和电磁屏蔽提供增强的导热性，以及导电外壳，其部分地或完全地围绕封装芯片提供额外的散热和屏蔽。封装单元可以包括有源半导体芯片和无源元件，期望地包括芯片形式，其包括电阻器和电容器。电感器可以全部或部分地设置在芯片载体上。模块包括两个电路和在电路之间具有中间壁的外壳，以在电路之间提供电磁屏蔽。

2. 发明授权

US07407038B2 Lifting framework for an industrial truck 失效
标题翻译：工业卡车起重架构
公开(公告)号：US07407038B2
公开(公告)日：2008-08-05
申请号：US10984692
申请日：2004-11-09
申请人： Barry Michael Warner , Paul John Eckersley , Keith Francis Messer
发明人： Barry Michael Warner , Paul John Eckersley , Keith Francis Messer
IPC分类号： B66F9/06
CPC分类号： B66F9/08
摘要： A lifting framework for an industrial truck has an extendible mast guided on a guide mast by rollers. Means are provided for bracing the extendible mast with the guide mast so as to prevent the extendible mast from inclining in the lateral direction of the lifting framework relative to the guide mast. The bracing means are configured such that, when the extendible mast is located in the top end position, a vertical movement of the extendible mast relative to the guide mast is prevented in the region of each of the two columns. A hydraulic lifting cylinder and a stop for the top end position of the extendible mast are arranged here in the region of each column.
摘要翻译：用于工业卡车的升降架具有通过滚子在导杆上引导的可伸缩的桅杆。提供了用于用导向杆支撑可伸缩桅杆的装置，以防止可伸缩桅杆相对于导向桅杆在提升框架的横向上倾斜。支撑装置被构造成使得当可伸缩桅杆位于顶端位置时，在两列中的每一个的区域中防止可延伸桅杆相对于导向桅杆的垂直移动。在每列的区域中布置有用于可伸缩桅杆的顶端位置的液压提升缸和止动件。

3. 发明授权

US07149095B2 Stacked microelectronic assemblies 有权
标题翻译：堆叠的微电子组件
公开(公告)号：US07149095B2
公开(公告)日：2006-12-12
申请号：US10281550
申请日：2002-10-28
申请人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
发明人： Michael Warner , Philip Damberg , John B. Riley , David Gibson , Young-Gon Kim , Belgacem Haba , Vernon Solberg
IPC分类号： H05K1/11
CPC分类号： H05K1/189 , H01L23/5387 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/3011 , H01L2224/05599
摘要： A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.
摘要翻译：堆叠的微电子组件包括多个微电子子组件。每个子组件包括具有至少一个位置，多个第一触点和多个第二触点的基板。每个子组件还具有组装到至少一个附接位置并电连接到第一和第二触点中的至少一些的至少一个微电子元件。折叠基板使得第一触头在子组件的底部可接近，并且第二触头可在子组件的顶部接近。多个子组件以大致垂直的配置堆叠在另一个之上。至少一个子组件的衬底具有多个附接位置和组装到附接位置的多个微电子元件。折叠基板使得多个微电子元件中的至少一些彼此并排设置。

4. 发明申请

US20060006693A1 Retractable deck for a vehicle 失效
公开(公告)号：US20060006693A1
公开(公告)日：2006-01-12
申请号：US10887597
申请日：2004-07-09
申请人： Anthony Anderson , Michael Warner
发明人： Anthony Anderson , Michael Warner
IPC分类号： B60P3/37
CPC分类号： B60P3/36
摘要： A deck for use with a vehicle having a frame includes a platform. The platform has opposite upper and lower surfaces. The platform is operatively coupled to the frame of the vehicle for selective movement between a storage position, wherein the upper surface is disposed substantially underneath the vehicle and a use position wherein the upper surface is disposed alongside the vehicle for ingress and egress thereon. A stabilizer extends from the lower surface for supporting the platform above the ground while in the use position. The stabilizer is selectively height adjustable to maintain the upper surface in a generally horizontal position.

5. 发明申请

US20050288609A1 Method and apparatus for inducing and detecting ankle torsion 失效
标题翻译：用于诱导和检测踝关节扭转的方法和装置
公开(公告)号：US20050288609A1
公开(公告)日：2005-12-29
申请号：US11159696
申请日：2005-06-23
申请人： Michael Warner , James Mertz
发明人： Michael Warner , James Mertz
IPC分类号： A61B5/103 , A61B5/11 , A61B5/117
CPC分类号： A61B5/1121 , A61B5/103 , A61B5/1126 , A61B5/4519 , A61B5/4528 , A61B5/4533 , A61B5/6829
摘要： A force applied to the foot of a patient causes the foot to rotate inwardly. After measuring the rotational displacement of the foot inwardly as the function of the applied force, the force is removed and the displacement of the foot is measured again. Next, a force is applied to the foot of the patient that causes the foot to rotate outwardly. After measuring the rotational displacement of the foot outwardly as a function of the applied force, the force is removed and the displacement of the foot is measured again. The displacements versus applied forces are plotted on a Cartesian coordinate system to produce a hysteresis curve. The data obtained and the hysteresis curve produced therefrom provides a quantitative measure of the motion quality and motion quantity of the foot and its corresponding ankle and is subject to detailed analytic and medical analysis.
摘要翻译：施加到患者脚部的力使得脚向内旋转。根据所施加的力量的函数测量脚的旋转位移量后，力就被移除，再次测量脚的位移。接下来，向患者的脚施加力，使得脚向外旋转。根据施加的力量测量脚的向外旋转位移后，力就被去除，并再次测量脚的位移。位移与施加力绘制在笛卡尔坐标系上以产生滞后曲线。获得的数据和由此产生的滞后曲线提供了足部及其相应脚踝的运动质量和运动量的定量测量，并进行详细的分析和医学分析。

6. 发明申请

US20050189622A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

7. 发明申请

US20050167814A1 Method of making microelectronic packages including electrically and/or thermally conductive element 审中-公开
标题翻译：制造包括电和/或导热元件的微电子封装的方法
公开(公告)号：US20050167814A1
公开(公告)日：2005-08-04
申请号：US11091880
申请日：2005-03-28
申请人： Masud Beroz , Bob Wen Kong , Michael Warner
发明人： Masud Beroz , Bob Wen Kong , Michael Warner
IPC分类号： H01L21/56 , H01L21/68 , H01L23/13 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/492 , H01L23/498 , H01L23/552 , H01L23/22
CPC分类号： H01L21/561 , H01L21/565 , H01L21/6835 , H01L23/13 , H01L23/24 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/4334 , H01L23/492 , H01L23/49816 , H01L23/4985 , H01L23/552 , H01L24/26 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73153 , H01L2224/8319 , H01L2224/83801 , H01L2224/85399 , H01L2224/97 , H01L2225/0651 , H01L2225/0652 , H01L2225/06582 , H01L2225/06589 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a plurality of microelectronic packages including electrically and/or thermally conductive elements. The method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support. A conductive element is then mated to the support structure in a male-to-female relationship. The depressions formed in the support structure and conductive element are used to house a microelectronic element such as a semiconductor chip. A substrate is provided so as to cover substantially each depression located in the conductive element. Leads interconnect contacts to the chip to terminals on the substrate. A curable encapsulant material may be deposited into the depression so as to protect and support the leads and the microelectronic element. Additionally, the curable encapsulant material forms part of the exterior of a single resulting chip package once the assembly is diced and cut into individual packages.
摘要翻译：一种制造包括电和/或导热元件的多个微电子封装件的方法。该方法包括提供具有从支撑体向外延伸的多个突起和凹陷的支撑结构。然后将导电元件以男性与女性的关系配合到支撑结构。在支撑结构和导电元件中形成的凹陷用于容纳诸如半导体芯片的微电子元件。提供基板以便基本上覆盖位于导电元件中的每个凹部。引线将接触芯片连接到基板上的端子。可固化的密封剂材料可以沉积到凹陷中，以保护和支撑引线和微电子元件。此外，一旦组装被切割并切割成单独的包装，可固化的密封剂材料形成单个所得的芯片封装的外部的一部分。

8. 发明申请

US20050046001A1 High-frequency chip packages 有权
标题翻译：高频芯片封装
公开(公告)号：US20050046001A1
公开(公告)日：2005-03-03
申请号：US10488210
申请日：2002-08-28
申请人： Michael Warner
发明人： Michael Warner
IPC分类号： G06F21/00 , H01L23/24 , H01L23/31 , H01L23/367 , H01L23/433 , H01L23/498 , H01L23/552 , H01L23/64 , H01L25/065 , H03H9/05 , H03H9/10 , H01L23/02 , H01L21/44
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/05599 , H01L2224/12105 , H01L2224/16145 , H01L2224/16235 , H01L2224/32145 , H01L2224/32245 , H01L2224/45014 , H01L2224/45099 , H01L2224/451 , H01L2224/48091 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/4824 , H01L2224/4911 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2224/85399 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06568 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H03H9/0542 , H03H9/0547 , H03H9/1064 , H03H2009/0019 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.
摘要翻译：封装的半导体芯片包括诸如具有大导热体的芯片载体的特征，其可以焊接到电路板，以便为电路板和电磁屏蔽提供增强的导热性，以及导电外壳，其部分地或完全地围绕封装芯片提供额外的散热和屏蔽。封装单元可以包括有源半导体芯片和无源元件，期望地包括芯片形式，其包括电阻器和电容器。电感器可以全部或部分地设置在芯片载体上。模块包括两个电路和在电路之间具有中间壁的外壳，以在电路之间提供电磁屏蔽。

9. 发明授权

US06825552B2 Connection components with anisotropic conductive material interconnection 有权
标题翻译：连接部件采用各向异性导电材料互连
公开(公告)号：US06825552B2
公开(公告)日：2004-11-30
申请号：US10139169
申请日：2002-05-06
申请人： David Light , Paula Lagattuta Tostado , Michael Warner
发明人： David Light , Paula Lagattuta Tostado , Michael Warner
IPC分类号： H01L2348
CPC分类号： H01R13/2414 , H01L23/49816 , H01L23/49827 , H01L2924/0002 , H01L2924/15311 , H01R43/007 , H01L2924/00
摘要： A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.
摘要翻译：用于微电子元件的连接部件包括具有相对的第一和第二表面的绝缘材料体。多个细长的引线在第一和第二表面之间延伸通过本体。引线具有在第一表面可接近的第一端和在第二表面可接近的第二端。一层各向异性导电材料覆盖在主体的第一端和第一表面上，用于将引线电连接到微电子元件。

10. 发明授权

US6081035A Microelectronic bond ribbon design 失效
标题翻译：微电子键带设计
公开(公告)号：US6081035A
公开(公告)日：2000-06-27
申请号：US736415
申请日：1996-10-24
申请人： Michael Warner , Thomas H. Distefano , David Gibson
发明人： Michael Warner , Thomas H. Distefano , David Gibson
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/50 , H01L23/49541 , H01L23/49558 , H01L23/49572 , H01L23/49586 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/12042 , H01L2924/14
摘要： An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use of the dual-tapered bond ribbons during bonding provides a bonded bond ribbon having a form that is substantially s-shaped. The radii of curvature making out the curves of the s-shaped configuration can be predetermined and controlled by the length and taper of the individual tapered section. The improved bond ribbon further comprises an anchor pad, said anchor pad characterized by a large surface area that decreases the likelihood of delamination of it from a supporting dielectric structure. A multiplicity of these improved bond ribbons can be fabricated in an external connection component so as to facilitate the alignment and bonding process of multiple bond ribbons to corresponding contacts of the semiconductor chip and can be designed, configured or placed such that the corner contact of the semiconductor chip are accessible for bonding. With respect to the problems associated with accessing the corner contacts of a semiconductor chip when using the connection component, three approaches are offered as solutions.
摘要翻译：改进的粘结带设计，所述粘结带具有双锥度，其功能是在粘结带与半导体芯片的相关联的接合处期间沿着粘合带的预定分布定位弯曲。在接合期间使用双锥形粘结带提供具有基本上S形的形式的粘结粘结带。形成s形构造曲线的曲率半径可以由单个锥形部分的长度和锥度来预定和控制。改进的粘结带还包括锚垫，所述锚垫的特征在于大的表面积减小了其从支撑介质结构分层的可能性。可以在外部连接部件中制造多个这些改进的接合带，以便于将多个接合带对准和接合处理到半导体芯片的对应接点，并且可以被设计，配置或放置，使得半导体芯片可用于接合。关于在使用连接部件时访问半导体芯片的角接触相关的问题，提供三种方案作为解决方案。

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