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    • 2. 发明授权
    • Assist features for contact hole mask patterns
    • 辅助接触孔掩模图案的功能
    • US06627361B2
    • 2003-09-30
    • US09901241
    • 2001-07-09
    • Orest BulaMichael S. HibbsSteven J. HolmesPaul A. Rabidoux
    • Orest BulaMichael S. HibbsSteven J. HolmesPaul A. Rabidoux
    • G03F900
    • G03F1/36G03F7/095
    • An assist feature is formed on a lithographic reticle or mask using a hybrid resist and an exposure dose such that only an annular area is effectively exposed having a width that is potentially less than the minimum feature size that can be resolved by the mask exposure tool to simultaneously or sequentially form both a feature of interest and an assist feature for enhancing imaging of the feature of interest when the feature is printed to a wafer. Since the assist feature can be imaged simultaneously with the feature of interest or multiple assist features imaged concurrently, possibly between closely spaced features, data volume and mask writing time are greatly reduced. The invention is particularly applicable to the scaling of contact holes for connections to active devices in extremely high density integrated circuits.
    • 使用混合抗蚀剂和曝光剂量在光刻掩模版或掩模上形成辅助特征,使得只有环形区域被有效地暴露,其宽度可能小于可由掩模曝光工具解析的最小特征尺寸, 同时或顺序地形成感兴趣的特征和当将特征印刷到晶片时增强感兴趣特征的成像的辅助特征。 由于可以与感兴趣的特征或同时成像的多个辅助特征(可能在紧密间隔的特征之间)同时成像辅助特征,所以数据量和掩模写入时间被大大减少。 本发明特别适用于用于连接到极高密度集成电路中的有源器件的接触孔的缩放。
    • 5. 发明授权
    • Mask defect analysis system
    • 面膜缺陷分析系统
    • US07257247B2
    • 2007-08-14
    • US09683836
    • 2002-02-21
    • James A. BruceOrest BulaEdward W. ConradWilliam C. LeipoldMichael S. HibbsJoshua J. Krueger
    • James A. BruceOrest BulaEdward W. ConradWilliam C. LeipoldMichael S. HibbsJoshua J. Krueger
    • G06K9/00
    • G03F1/84
    • An automated system for analyzing mask defects in a semiconductor manufacturing process is presented. This system combines results from an inspection tool and design layout data from a design data repository corresponding to each mask layer being inspected with a computer program and a predetermined rule set to determine when a defect on a given mask layer has occurred. Mask inspection results include the presence, location and type (clear or opaque) of defects. Ultimately, a determination is made as to whether to scrap, repair or accept a given mask based on whether the defect would be likely to cause product failure. Application of the defect inspection data to the design layout data for each mask layer being inspected prevents otherwise acceptable wafer masks from being scrapped when the identified defects are not in critical areas of the mask.
    • 提出了一种用于分析半导体制造过程中的掩模缺陷的自动化系统。 该系统将来自检查工具的结果和来自被检查的每个掩模层的设计数据存储库的设计布局数据与计算机程序和预定规则集相结合,以确定给定掩模层上的缺陷何时发生。 掩模检查结果包括缺陷的存在,位置和类型(透明或不透明)。 最终,根据缺陷是否可能导致产品故障,确定是否废除,修理或接受给定的掩模。 将缺陷检查数据应用于被检查的每个掩模层的设计布局数据防止当所识别的缺陷不在掩模的关键区域时被报废。
    • 7. 发明授权
    • Apparatus and method for inspection of photolithographic mask
    • 用于光刻掩模检查的装置和方法
    • US06950183B2
    • 2005-09-27
    • US10248808
    • 2003-02-20
    • Timothy A. BrunnerMichael S. HibbsChristopher J. Progler
    • Timothy A. BrunnerMichael S. HibbsChristopher J. Progler
    • G01N21/956G01N21/88
    • G01N21/95692
    • A method for inspecting masks used to project patterns in photolithographic imaging comprises initially providing a photolithographic mask having a pattern field thereon, where in normal production use the pattern is transferred by a reduction projector as a demagnified pattern on a production substrate, and providing a movable field-defining aperture adjacent the mask, the aperture having a field area less than, and capable of defining a pattern subfield comprising only a portion of the entire photolithographic mask pattern field. The method then includes aligning the field-defining aperture with a pattern subfield comprising only a portion of the entire photolithographic mask pattern field. Using an energy source, the method includes projecting the pattern subfield onto a test substrate and exposing onto the test substrate the pattern subfield at a size between that normally exposed on a production substrate and the actual size of the pattern subfield on the photolithographic mask. Subsequently, the method includes inspecting the exposed pattern subfield on the test substrate for defects in the photolithographic mask.
    • 用于检查用于在光刻成像中投影图案的掩模的方法包括首先提供其上具有图案场的光刻掩模,其中在正常生产中使用图案通过缩小投影仪作为缩小图案转印在生产基板上,并且提供可移动 与该掩模相邻的场限定孔径,该孔径具有小于并且能够限定仅包括整个光刻掩模图案场的一部分的图案子场的场区域。 该方法然后包括将场限定孔与仅包括整个光刻掩模图案场的一部分的图案子场对准。 使用能量源,该方法包括将图案子场投射到测试基板上,并以通常暴露在生产基板上的尺寸与光刻掩模上的图案子场的实际尺寸之间的尺寸将图案子区域暴露在测试基板上。 随后,该方法包括检查在光刻掩模中的缺陷的测试基板上的曝光图案子场。
    • 8. 发明授权
    • Self-aligned alternating phase shift mask patterning process
    • 自对准交替相移掩模图案化工艺
    • US06824932B2
    • 2004-11-30
    • US10164242
    • 2002-06-05
    • Scott J. BukofskyCarlos A. FonsecaMichael S. HibbsLars W. Liebmann
    • Scott J. BukofskyCarlos A. FonsecaMichael S. HibbsLars W. Liebmann
    • G03F900
    • G03F1/30G03F7/0035G03F7/2022
    • A method and apparatus for making phase shift masks are provided wherein an anti-reflective coating used on an opaque pattern layer of the mask fully covers the opaque pattern layer and has not been etched in the etching process to form the phase shift mask. A two-exposure method to form the phase shift mask is used wherein a photoresist having a defined dose-to-clear level is coated on the surface of the mask and the lower surface of the mask is exposed to a blanket exposure in an energy amount less than the dose-to-clear level. The open areas of the upper surface of the mask to be etched are exposed to an energy dose in an amount less than the dose-to-clear level, with the sum of the amounts of the lower surface energy and upper surface energy being at least the dose-to-clear level. The method and apparatus minimizes and/or avoids etching of the anti-reflective coating.
    • 提供了一种用于制造相移掩模的方法和装置,其中在掩模的不透明图案层上使用的抗反射涂层完全覆盖不透明图案层,并且在蚀刻工艺中没有被蚀刻以形成相移掩模。 使用形成相移掩模的双曝光方法,其中具有确定的剂量至清晰度的光致抗蚀剂被涂覆在掩模的表面上,并且掩模的下表面以能量的量曝光 小于剂量到清除水平。 要蚀刻的掩模的上表面的开放区域暴露于小于剂量至清除水平的量的能量剂量,其中下表面能和上表面能的量的总和至少为 剂量到清晰度。 该方法和装置使抗反射涂层的蚀刻最小化和/或避免。
    • 9. 发明授权
    • Pellicle distortion reduction
    • 防护薄膜失真减少
    • US06731378B2
    • 2004-05-04
    • US09683748
    • 2002-02-11
    • Michael S. Hibbs
    • Michael S. Hibbs
    • G03B2762
    • G03F1/64G03B27/62
    • The invention provides systems and a method for reducing pellicle distortion. One feature of the invention reduces distortion of a pellicle by providing an airtight mounting structure for coupling a pellicle to a mask; and a port on the mounting structure though which a pressure difference can be created between the interior portion and an exterior environment. Hence, distortion can be reduced by controlling the pressure in the interior portion between the pellicle, the pellicle mounting structure and the mask. Another feature places an aerodynamic fairing adjacent the mask to reduce aerodynamic drag and, hence, suppress turbulent air flow over the pellicle. The features can be used separately or in combination.
    • 本发明提供了减少防护薄膜畸形的系统和方法。 本发明的一个特征是通过提供用于将防护薄膜组件耦合到掩模的气密安装结构来减少防护薄膜的变形; 以及安装结构上的端口,通过该端口可以在内部部分和外部环境之间产生压力差。 因此,可以通过控制防护薄膜组件,防护薄膜组件安装结构和掩模之间的内部部分中的压力来减小变形。 另一个特征是在靠近面罩的地方放置一个气动整流罩,以减少气动阻力,从而抑制防护薄膜上的湍流空气流动。 功能可单独使用或组合使用。
    • 10. 发明授权
    • Methods for repair of photomasks
    • 修复光掩模的方法
    • US06190836B1
    • 2001-02-20
    • US09561560
    • 2000-04-28
    • Brian J. GrenonRichard A. HaightDennis M. HaydenMichael S. HibbsJ. Peter LevinTimothy E. NearyRaymond E. RochefortDennis A. SchmidtJacek G. SmolinskiAlfred Wagner
    • Brian J. GrenonRichard A. HaightDennis M. HaydenMichael S. HibbsJ. Peter LevinTimothy E. NearyRaymond E. RochefortDennis A. SchmidtJacek G. SmolinskiAlfred Wagner
    • G03C500
    • G03F1/74B23K26/0624
    • A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain. In another embodiment, opaque defects are repaired with a short pulse duration laser without damage to underlying quartz or adjacent clear regions while avoiding the need for a coating.
    • 修复掩模上的缺陷的方法包括在掩模上提供涂层以防止由于激光烧蚀溅射,激光烧蚀引起的石英点蚀,激光沉积染色和FIB引起的镓染色而对掩模的清晰区域的损害的步骤。 涂层是金属,聚合物或碳材料。 涂层形成在掩模的透明区域以及掩模的光吸收材料的上方或下方。 包含薄铜层的涂层显着地改善了用离子束的成像,同时保护掩模的清除区域不受FIB染色。 由光敏聚合物形成的涂层用于蚀刻不透明缺陷。 虽然在该蚀刻步骤中也蚀刻邻近不透明缺陷的不透明区域,然后在随后的FIB沉积步骤中修复这些产生的明确缺陷,而铜涂层保护相邻的清晰区域免受FIB染色。 在另一个实施例中,用短脉冲持续时间激光修复不透明缺陷,而不损害下面的石英或相邻的透明区域,同时避免了涂层的需要。