会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Additional n-type LDD/pocket implant for improving short-channel NMOS ESD robustness
    • 额外的n型LDD /袋式注入,用于改善短沟道NMOS ESD稳健性
    • US06822297B2
    • 2004-11-23
    • US09876292
    • 2001-06-07
    • Mahalingam NandakumarSong ZhaoYoungmin Kim
    • Mahalingam NandakumarSong ZhaoYoungmin Kim
    • H01L2362
    • H01L29/6659H01L27/0266H01L29/1083H01L29/7833
    • A short-channel NMOS transistor in a p-well, bordered laterally on each side by an isolation region and vertically by a channel stop region, has a n-source and a n-drain, each comprising a shallow region extending to the transistor gate and a deeper region recessed from the gate, and both having a depletion region when reverse biased. The shallow regions are surrounded in part by an enhanced p-doping implant pocket. The transistor further has in these regions of enhanced p-doping another region of a p-resistivity higher than the remainder of the semiconductor. These regions extend laterally approximately from the inner border of the respective shallow region to the inner border of the respective recessed region, and vertically from a depth just below the depletion regions of source and drain to approximately the top of the channel stop regions. According to the invention, these regions of higher p-type resistivity are created after gate definition by an ion implant of compensating n-doping, such as arsenic or phosphorus, using the same photomask already used for implants creating the extended source and drain and the pockets of enhanced p-doping. In an ESD event, these regions of higher resistivity increase the current gain of the parasitic lateral npn bipolar transistor and thus raise the current It2, which initiates the thermal breakdown with its destructive localized heating, thereby improving ESD robustness.
    • p阱中的短沟道NMOS晶体管具有n源极和n沟道,每个包含延伸到晶体管栅极的浅区域,每个侧面由隔离区域横向限定并由沟道停止区域垂直地限定 以及从栅极凹陷的较深区域,并且当反向偏置时都具有耗尽区域。 浅区域部分地被增强的p掺杂注入口袋包围。 晶体管还在这些增强的p掺杂区域中具有比半导体其余部分高的p电阻率的另一区域。 这些区域大致从相应的浅区域的内部边界横向延伸到相应的凹陷区域的内部边界,并且从刚好在源极和漏极的耗尽区域的深度的深度垂直地延伸到接近通道停止区域的顶部。根据 本发明通过使用已经用于形成扩展的源极和漏极的植入物的相同的光掩模,通过补偿n掺杂的离子注入(例如砷或磷)在栅极定义之后产生这些较高p型电阻率的区域, 在ESD事件中,这些具有较高电阻率的区域增加了寄生横向npn双极晶体管的电流增益,从而提高了电流It2,从而使其具有破坏性的局部加热引起热击穿,从而提高了ESD鲁棒性。
    • 5. 发明授权
    • Method to increase substrate potential in MOS transistors used in ESD protection circuits
    • 在ESD保护电路中使用的MOS晶体管中增加衬底电位的方法
    • US06767810B2
    • 2004-07-27
    • US10629514
    • 2003-07-29
    • Craig T. SallingAmitava ChatterjeeYoungmin Kim
    • Craig T. SallingAmitava ChatterjeeYoungmin Kim
    • H01L218249
    • H01L27/0277
    • An integrated circuit located between isolation trenches at the surface of a semiconductor chip comprising a first well of a first conductivity type having a first resistivity. This first well has a shallow buried region of higher resistivity than the first resistivity, extending between the isolation trenches and created by a compensating doping process. The circuit further comprises a second well of the opposite conductivity type extending to the surface between the isolation trenches, having a contact region and forming a junction with the shallow buried region of the first well, substantially parallel to the surface. Finally, the circuit has a MOS transistor located in the second well, spaced from the contact region, and having source, gate and drain regions at the surface. This space is predetermined to create a small voltage drop in I/O transistors for conditioning signals and power to a pad, or large voltage drops in ESD circuits for protecting the active circuitry connected to a pad. In the first embodiment, the space includes a dummy gate; in the second embodiment, an isolation region; in the third embodiment, the space a protected, stable surface.
    • 位于半导体芯片表面的隔离沟槽之间的集成电路,包括具有第一电阻率的第一导电类型的第一阱。 该第一阱具有比第一电阻率更高的电阻率的浅埋入区,在隔离沟槽之间延伸并由补偿掺杂工艺产生。 电路还包括延伸到隔离沟槽之间的表面的相反导电类型的第二阱,具有接触区域并与第一阱的浅埋入区域基本上平行于表面形成结。 最后,电路具有位于第二阱中的MOS晶体管,与接触区域间隔开,并且在表面具有源极,栅极和漏极区域。 该空间是预定的,以在I / O晶体管中产生一个小的电压降,用于调节信号和对焊盘的功率,或者ESD电路中的大的电压降,用于保护连接到焊盘的有源电路。 在第一实施例中,空间包括虚拟门; 在第二实施例中,隔离区域; 在第三实施例中,空间是受保护的,稳定的表面。