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1. 发明授权

US06548175B2 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof 失效
公开(公告)号：US06548175B2
公开(公告)日：2003-04-15
申请号：US09759012
申请日：2001-01-11
申请人： Krishna G. Sachdev , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Megan J. Shannon
发明人： Krishna G. Sachdev , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Megan J. Shannon
IPC分类号： B32B2738
CPC分类号： H01L24/83 , C08G59/306 , C08G59/3254 , C08G59/38 , C08L63/00 , C09J9/02 , C09J163/00 , H01L24/29 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K3/321 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

2. 发明授权

US06458623B1 Conductive adhesive interconnection with insulating polymer carrier 有权
标题翻译：与绝缘聚合物载体的导电胶粘剂互连
公开(公告)号：US06458623B1
公开(公告)日：2002-10-01
申请号：US09765030
申请日：2001-01-17
申请人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
发明人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/30107 , H05K3/321 , H05K3/3436 , H05K2201/09472 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.
摘要翻译：提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地将固体导电材料附着到导电粘合剂上。然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构。

3. 发明授权

US06528145B1 Polymer and ceramic composite electronic substrates 有权
标题翻译：聚合物和陶瓷复合电子基板
公开(公告)号：US06528145B1
公开(公告)日：2003-03-04
申请号：US09606359
申请日：2000-06-29
申请人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
发明人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G02B600
CPC分类号： H05K1/0373 , H01L21/4857 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/4611 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , Y10S428/901 , Y10T428/24273 , Y10T428/24479 , Y10T428/24917 , Y10T428/24942 , Y10T428/249955 , Y10T428/249956 , Y10T428/251 , Y10T428/254 , Y10T428/259 , H01L2924/00
摘要： A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
摘要翻译：包括聚合物和陶瓷材料的复合电子和/或光学基底，其中复合基底具有小于4的介电常数和8-14ppm /℃的热膨胀系数。在100℃下。复合衬底可以是陶瓷填充的聚合材料或聚合物填充的陶瓷材料。

4. 发明授权

US5532608A Ceramic probe card and method for reducing leakage current 失效
标题翻译：陶瓷探针卡和减少漏电流的方法
公开(公告)号：US5532608A
公开(公告)日：1996-07-02
申请号：US417623
申请日：1995-04-06
申请人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
发明人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G01R31/26 , G01R1/073 , H05K3/28 , H05K9/00 , G01R15/12
CPC分类号： G01R1/07307
摘要： An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.
摘要翻译：用于具有减小的漏电流的微电子学参数测试的电探针卡包括在裸露导体之间涂覆陶瓷卡的整个暴露表面的自固化硅氧烷材料的疏水层。疏水层的厚度小于1微米，优选小于0.1微米，最优选为0.01至0.001微米。疏水层不会干扰随后焊接到卡上的触点，价格低廉，耐溶剂性，并且易于应用于新的和预先存在的探针卡。施用方法包括将过量的疏水性硅氧烷材料应用于其未固化状态，然后剧烈擦拭多余的材料以使层变薄，产生良好的粘结并清洁探针卡上的暴露的导体。

5. 发明授权

US06221269B1 Method of etching molybdenum metal from substrates 失效
标题翻译：从基材上蚀刻钼金属的方法
公开(公告)号：US06221269B1
公开(公告)日：2001-04-24
申请号：US09233384
申请日：1999-01-19
申请人： Krishna G. Sachdev , Umar M. Ahmad , Hsing H. Chen , Lawrence D. David , Charles H. Perry , Donald R. Wall
发明人： Krishna G. Sachdev , Umar M. Ahmad , Hsing H. Chen , Lawrence D. David , Charles H. Perry , Donald R. Wall
IPC分类号： C03C1500
CPC分类号： C04B41/009 , C04B41/5353 , C04B2111/00844 , H05K1/092 , H05K3/067 , H05K3/26 , H05K2201/0761 , H05K2203/0789
摘要： A method is provided for etching and removing extraneous molybdenum or debris on ceramic substrates such as semiconductor devices and also for molybdenum etching in the fabrication of molybdenum photomasks. The method employs a multi-step process using an acidic aqueous solution of a ferric salt to remove (etch) the molybdenum debris followed by contacting the treated substrate with an organic quaternary ammonium hydroxide to remove any molybdenum black oxides which may have formed on the exposed surface of treated molybdenum features in ceramic substrates. The method is environmentally safe and the waste solutions may be easily waste treated for example by precipitating the ferric salts as ferric hydroxide and removing anions such as sulfate by precipitation with lime. The method replaces the currently used method of employing ferricyanide salts which create serious hazardous waste disposal and environmental problems.
摘要翻译：提供了一种用于在陶瓷衬底（例如半导体器件）上蚀刻和去除外来的钼或碎片以及在钼光掩模的制造中用于钼蚀刻的方法。该方法采用多步法，使用酸式的铁盐水溶液去除（蚀刻）钼碎片，随后将经处理的底物与有机季铵氢氧化物接触以除去可能形成于暴露的钼黑氧化物处理的钼特征在陶瓷衬底中的表面。该方法是环境安全的，并且废溶液可以容易地被废物处理，例如通过将铁盐沉淀为氢氧化铁并通过用石灰沉淀除去诸如硫酸盐的阴离子。该方法取代了目前使用的铁氰化物盐的方法，造成严重的危险废物处理和环境问题。

6. 发明授权

US5277725A Process for fabricating a low dielectric composite substrate 失效
标题翻译：低介电复合衬底的制造方法
公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译：在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

7. 发明授权

US06858111B2 Conductive polymer interconnection configurations 失效
标题翻译：导电聚合物互连配置
公开(公告)号：US06858111B2
公开(公告)日：2005-02-22
申请号：US09911069
申请日：2001-07-23
申请人： Charles H. Perry , Mark G. Courtney , Lewis S. Goldmann , Gregory B. Martin
发明人： Charles H. Perry , Mark G. Courtney , Lewis S. Goldmann , Gregory B. Martin
IPC分类号： H01L21/60 , H05K3/32 , H05K3/34 , C09J5/00
CPC分类号： H01L24/10 , B23K2101/36 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K3/321 , H05K3/3436 , H05K2201/0129 , H05K2201/10674 , H05K2201/10734 , H05K2201/10992 , Y02P70/613 , Y10T428/256 , Y10T428/26 , Y10T428/31678 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.
摘要翻译：公开了一种在两个装置之间形成电连接的方法。在本发明的示例性实施例中，该方法包括将互连的第二可焊接焊锡焊接到第一部件的第一接触焊盘。互连还包括包含聚合物组分和导电组分的导电聚合物。第一可焊接帽设置成与导电聚合物接触，并且第二可焊接帽设置成与第一可焊接帽相对的导电聚合物接触。然后将第一可焊接帽焊接到第二部件的第二接触焊盘。

8. 发明授权

US06848914B2 Electrical coupling of substrates by conductive buttons 有权
标题翻译：通过导电按钮电连接基板
公开(公告)号：US06848914B2
公开(公告)日：2005-02-01
申请号：US09975213
申请日：2001-10-11
申请人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
发明人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
IPC分类号： H01R12/52 , H01R13/24 , H01R43/00 , H01R12/00
CPC分类号： H01R43/007 , H01R12/52 , H01R13/2421
摘要： A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.
摘要翻译：用于电耦合两个基板（例如，印刷线路板和电子模块）的结构和方法。首先，提供介质芯。导电布线围绕介质芯螺旋缠绕。此外，可以在导电布线周围形成电介质护套。所得的导电杆结构沿着导电棒的长度被轴向地切割，以产生具有端部触头的导电按钮。导电按钮的端部触点可用于将两个基板电耦合到两个基板的相应焊盘处。

9. 发明授权

US06333104B1 Conductive polymer interconnection configurations 失效
标题翻译：导电聚合物互连配置
公开(公告)号：US06333104B1
公开(公告)日：2001-12-25
申请号：US09580131
申请日：2000-05-30
申请人： Charles H. Perry , Mark G. Courtney , Lewis s. Goldmann , Gregory B. Martin
发明人： Charles H. Perry , Mark G. Courtney , Lewis s. Goldmann , Gregory B. Martin
IPC分类号： B32B516
CPC分类号： H01L24/10 , B23K2101/36 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K3/321 , H05K3/3436 , H05K2201/0129 , H05K2201/10674 , H05K2201/10734 , H05K2201/10992 , Y02P70/613 , Y10T428/256 , Y10T428/26 , Y10T428/31678 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.
摘要翻译：这里公开了用于两个电气设备的电连接的互连。互连包括与一个或两个可焊接盖接触设置的导电聚合物。一起，可焊接帽和导电聚合物形成互连，其可以用于通过电气设备上的接触焊盘连接两个电气设备。例如，封装的集成电路芯片可以使用互连阵列连接到“卡”。由于互连具有可焊接表面，所以可以使用互连来代替常规生产线中的焊球。

10. 发明授权

US5135595A Process for fabricating a low dielectric composite substrate 失效
标题翻译：制造低介电复合基板的工艺
公开(公告)号：US5135595A
公开(公告)日：1992-08-04
申请号：US503495
申请日：1990-03-30
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

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