专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06458623B1 Conductive adhesive interconnection with insulating polymer carrier 有权
标题翻译：与绝缘聚合物载体的导电胶粘剂互连
公开(公告)号：US06458623B1
公开(公告)日：2002-10-01
申请号：US09765030
申请日：2001-01-17
申请人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
发明人： Lewis S. Goldmann , Mario J. Interrante , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Brenda L. Peterson
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/49827 , H01L24/29 , H01L24/81 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/30107 , H05K3/321 , H05K3/3436 , H05K2201/09472 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method and apparatus is provided for forming an electronic assembly whereby an insulating polymer matrix having a plurality of conductor holes is attached to a first substrate wherein the conductor holes align with a corresponding contact array on the first substrate. Subsequently, a flexible, electrically conductive adhesive is provided within the plurality of conductor holes and a solid conductive material, preferably having a high melting temperature, is attached to at least one end thereof. The insulating polymer matrix with the electrically conductive adhesive and the solid conductive material is then cured at a temperature sufficient to completely cure the matrix to completely surround the electrically conductive adhesive, as well as permanently attaching the matrix and conductive adhesive to the first substrate and permanently attaching the solid conductive material to the conductive adhesive. A second substrate may then be attached to the conductive matrix structure secured to the first substrate by providing a low melting temperature attachment means to the solid conductive material attached to the matrix and subsequently reflowing the assembly to form an electronic assembly adapted with the capability of reworkability.
摘要翻译：提供了一种用于形成电子组件的方法和装置，由此具有多个导体孔的绝缘聚合物基体附接到第一基底，其中导体孔与第一基底上的对应的接触阵列对准。随后，在多个导体孔内提供柔性的导电粘合剂，并且其至少一端连接有优选具有高熔融温度的固体导电材料。然后将具有导电粘合剂和固体导电材料的绝缘聚合物基质在足以完全固化基质以完全包围导电粘合剂的温度下固化，以及将基质和导电粘合剂永久地附着到第一基材上并永久地将固体导电材料附着到导电粘合剂上。然后可以通过向连接到基质的固体导电材料提供低熔点温度的附着装置，随后回流组件以形成适于具有再加工性能的电子组件，然后将第二衬底附接到固定到第一衬底的导电矩阵结构。

2. 发明授权

US06548175B2 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof 失效
公开(公告)号：US06548175B2
公开(公告)日：2003-04-15
申请号：US09759012
申请日：2001-01-11
申请人： Krishna G. Sachdev , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Megan J. Shannon
发明人： Krishna G. Sachdev , Raymond A. Jackson , Amy B. Ostrander , Charles H. Perry , Megan J. Shannon
IPC分类号： B32B2738
CPC分类号： H01L24/83 , C08G59/306 , C08G59/3254 , C08G59/38 , C08L63/00 , C09J9/02 , C09J163/00 , H01L24/29 , H01L2224/13111 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K3/321 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.

3. 发明授权

US06528352B1 Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications 失效
标题翻译：使用导电胶来形成用于TCA（临时芯片连接）应用的临时电气连接
公开(公告)号：US06528352B1
公开(公告)日：2003-03-04
申请号：US09981269
申请日：2001-10-17
申请人： Raymond A. Jackson , John U. Knickerbocker , Thomas E. Lombardi , Amy B. Ostrander
发明人： Raymond A. Jackson , John U. Knickerbocker , Thomas E. Lombardi , Amy B. Ostrander
IPC分类号： H01L2144
CPC分类号： G01R1/0408
摘要： A structure and method for converting a standard ceramic carrier into a temporary chip attach carrier, wherein the device comprises a substrate, a plurality of metal vias interspersed in the substrate, a carrier layer further comprising a cavity dam with a plurality of holes filled with conductive adhesive. The process of forming the temporary chip attach carrier comprises applying a secondary layer further comprising a plurality of holes on a substrate, applying conductive adhesive in the holes, curing the adhesive, placing a chip containing C4 solder bumps onto the secondary layer, applying a force onto the chip, testing and burning-in the secondary layer, removing the force from the chip, separating the chip from the secondary layer, and then re-using the secondary layer.
摘要翻译：一种用于将标准陶瓷载体转换成临时芯片连接载体的结构和方法，其中所述装置包括基板，散布在所述基板中的多个金属通孔，还包括具有多个填充有导电胶粘剂。形成临时芯片连接载体的过程包括在基板上施加进一步包括多个孔的二次层，在孔中施加导电粘合剂，固化粘合剂，将含有C4焊料凸块的芯片放置在次级层上，施加力在芯片上进行测试并在二级层中燃烧，去除芯片上的力，将芯片与次级层分开，然后重新使用二级层。

4. 发明授权

US6158644A Method for enhancing fatigue life of ball grid arrays 失效
标题翻译：提高球栅阵列疲劳寿命的方法
公开(公告)号：US6158644A
公开(公告)日：2000-12-12
申请号：US70163
申请日：1998-04-30
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： H01L23/12 , B23K35/02 , B23K35/14 , H01L21/60 , H01L23/498 , H05K3/34 , B23K35/24 , B23K35/26
CPC分类号： H01L24/12 , B23K35/0222 , H01L23/49811 , H01L24/11 , H01L24/16 , H05K3/3436 , B23K35/0244 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译：本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路板。焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面被绑定。

5. 发明授权

US5543584A Structure for repairing electrical lines 失效
标题翻译：修理电线的结构
公开(公告)号：US5543584A
公开(公告)日：1996-08-06
申请号：US843684
申请日：1992-02-28
申请人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
发明人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/498 , H01L23/52 , H01L23/525 , H01L23/538 , H05K3/00 , H05K3/02 , H05K3/22 , H05K3/34 , H05K1/11
CPC分类号： H01L21/76892 , H01L23/49866 , H01L23/525 , H05K3/225 , H01L2924/0002 , H05K2201/10181 , H05K2201/10234 , H05K2201/1028 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/173 , H05K2203/175 , H05K3/0017 , H05K3/027 , H05K3/34 , Y10T29/49124
摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
摘要翻译：本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热焊接并允许焊料熔化并修复开路。本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。本发明还允许修复通常不能通过常规技术修复的细线图案。

6. 发明授权

US06360938B1 Process and apparatus to remove closely spaced chips on a multi-chip module 有权
公开(公告)号：US06360938B1
公开(公告)日：2002-03-26
申请号：US09794597
申请日：2001-02-27
申请人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
发明人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
IPC分类号： B23K1018
摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bi-metallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

7. 发明授权

US06283359B1 Method for enhancing fatigue life of ball grid arrays 有权
标题翻译：提高球栅阵列疲劳寿命的方法
公开(公告)号：US06283359B1
公开(公告)日：2001-09-04
申请号：US09644486
申请日：2000-08-23
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K35/0222 , B23K35/0244 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991 , H01L2224/29099 , H01L2924/00
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译：本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路板。焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面被绑定。

8. 发明授权

US06497357B2 Apparatus and method for removing interconnections 失效
标题翻译：用于去除互连的装置和方法
公开(公告)号：US06497357B2
公开(公告)日：2002-12-24
申请号：US09850350
申请日：2001-05-07
申请人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
发明人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
IPC分类号： B23K120
CPC分类号： B08B1/008 , B08B7/0071 , H01L21/4864 , H05K3/3436 , H05K3/3457
摘要： A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.
摘要翻译：一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

9. 发明授权

US06216937B1 Process and apparatus to remove closely spaced chips on a multi-chip module 失效
标题翻译：在多芯片模块上去除紧密间隔的芯片的工艺和装置
公开(公告)号：US06216937B1
公开(公告)日：2001-04-17
申请号：US09470455
申请日：1999-12-22
申请人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
发明人： Stephen A. DeLaurentis , Mario J. Interrante , Raymond A. Jackson , John U. Knickerbocker , Sudipta K. Ray , Kathleen A. Stalter
IPC分类号： B23K100
CPC分类号： H01L21/687 , B23K1/018 , H01L24/98
摘要： A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bimetallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.
摘要翻译：一种用于通过在将模块加热到足以导致的温度的温度下向一个或多个倒装芯片的背面施加张力而将一个或多个去除构件施加拉力而移除通过安装在多芯片模块上的C4接头的倒装芯片的方法和装置 C4接头变得熔化。张力可以是压缩弹簧，也可以是在室温下平坦并在加热到这样的温度时变得弯曲的双金属构件，或者原始形状是弯曲的并且在室温下弯曲平坦但回到其中的记忆合金原来弯曲的形状加热到这样的温度。使用粘合剂将去除构件粘合到要去除的芯片上，并且是固化后具有耐高温性的低温快速固化粘合剂。

10. 发明授权

US5153408A Method and structure for repairing electrical lines 失效
标题翻译：修复电线的方法和结构
公开(公告)号：US5153408A
公开(公告)日：1992-10-06
申请号：US607969
申请日：1990-10-31
申请人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
发明人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/498 , H01L23/52 , H01L23/525 , H01L23/538 , H05K3/00 , H05K3/02 , H05K3/22 , H05K3/34
CPC分类号： H01L21/76892 , H01L23/49866 , H01L23/525 , H05K3/225 , H01L2924/0002 , H05K2201/10181 , H05K2201/10234 , H05K2201/1028 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/173 , H05K2203/175 , H05K3/0017 , H05K3/027 , H05K3/34 , Y10T29/49124
摘要： The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
摘要翻译：本发明一般涉及一种修复电线的新方法，并且更具体地涉及在装置就位时修复在模块级具有开路的电线。使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。它可以通过将跨接线或熔核固定在开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热焊接并允许焊料熔化并修复开路。本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。本发明还允许修复通常不能通过常规技术修复的细线图案。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式