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1. 发明授权

US06528145B1 Polymer and ceramic composite electronic substrates 有权
标题翻译：聚合物和陶瓷复合电子基板
公开(公告)号：US06528145B1
公开(公告)日：2003-03-04
申请号：US09606359
申请日：2000-06-29
申请人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
发明人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G02B600
CPC分类号： H05K1/0373 , H01L21/4857 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/4611 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , Y10S428/901 , Y10T428/24273 , Y10T428/24479 , Y10T428/24917 , Y10T428/24942 , Y10T428/249955 , Y10T428/249956 , Y10T428/251 , Y10T428/254 , Y10T428/259 , H01L2924/00
摘要： A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
摘要翻译：包括聚合物和陶瓷材料的复合电子和/或光学基底，其中复合基底具有小于4的介电常数和8-14ppm /℃的热膨胀系数。在100℃下。复合衬底可以是陶瓷填充的聚合材料或聚合物填充的陶瓷材料。

2. 发明授权

US06742530B2 Semi-aqueous solvent cleaning of paste processing residue from substrates 失效
标题翻译：半水溶剂清洗膏从底物处理残留物
公开(公告)号：US06742530B2
公开(公告)日：2004-06-01
申请号：US10294236
申请日：2002-11-14
申请人： Krishna G. Sachdev , James N. Humenik , Chon Cheong Lei , Glenn A. Pomerantz
发明人： Krishna G. Sachdev , James N. Humenik , Chon Cheong Lei , Glenn A. Pomerantz
IPC分类号： B08B308
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译：清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

3. 发明授权

US06569252B1 Semi-aqueous solvent cleaning of paste processing residue from substrates 失效
标题翻译：半水溶剂清洗膏从底物处理残留物
公开(公告)号：US06569252B1
公开(公告)日：2003-05-27
申请号：US09609283
申请日：2000-06-30
申请人： Krishna G. Sachdev , James N. Humenik , Chon Cheong Lei , Glenn A. Pomerantz
发明人： Krishna G. Sachdev , James N. Humenik , Chon Cheong Lei , Glenn A. Pomerantz
IPC分类号： C23G502
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译：清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

4. 发明授权

US06277799B1 Aqueous cleaning of paste residue 失效
标题翻译：糊状残留物的水性清洗
公开(公告)号：US06277799B1
公开(公告)日：2001-08-21
申请号：US09344886
申请日：1999-06-25
申请人： Krishna G. Sachdev , James N. Humenik , John U. Knickerbocker , Glenn A. Pomerantz
发明人： Krishna G. Sachdev , James N. Humenik , John U. Knickerbocker , Glenn A. Pomerantz
IPC分类号： C11D172
CPC分类号： C11D11/0047 , C11D1/008 , C11D1/02 , C11D1/24 , C11D1/29 , C11D1/66 , C11D1/662 , C11D1/72 , C11D1/88 , C11D1/90 , C11D3/2086 , H05K3/1216 , H05K3/26
摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.
摘要翻译：本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如，筛选掩模，相关筛选设备，基材等，用于生产电子元件。

5. 发明授权

US06351871B1 Aqueous quaternary ammonium hydroxide as a screening mask cleaner 失效
标题翻译：水性季铵氢氧化物作为筛选面膜清洁剂
公开(公告)号：US06351871B1
公开(公告)日：2002-03-05
申请号：US09335420
申请日：1999-06-17
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： A47L2500
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译：本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法陶瓷（MLC）基板。

6. 发明授权

US06280527B1 Aqueous quaternary ammonium hydroxide as a screening mask cleaner 失效
标题翻译：水性季铵氢氧化物作为筛选面膜清洁剂
公开(公告)号：US06280527B1
公开(公告)日：2001-08-28
申请号：US09096841
申请日：1998-06-12
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B308
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译：本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法陶瓷（MLC）基板。

7. 发明授权

US07405247B2 Conductive adhesive composition 有权
标题翻译：导电胶组成
公开(公告)号：US07405247B2
公开(公告)日：2008-07-29
申请号：US11831039
申请日：2007-07-31
申请人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
发明人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
IPC分类号： C08L63/00 , C08L83/00 , C09J163/00 , C09J183/00 , C08K3/08 , B32B27/38
CPC分类号： H01L24/32 , C08K3/08 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/29111 , H01L2224/32014 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , H05K3/321 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.
摘要翻译：一种可再加工的导电粘合剂组合物，其包含环氧基导电粘合剂，其包含分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒。

8. 发明授权

US07312261B2 Thermal interface adhesive and rework 有权
标题翻译：热界面粘合剂和返工
公开(公告)号：US07312261B2
公开(公告)日：2007-12-25
申请号：US10709518
申请日：2004-05-11
申请人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
发明人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
IPC分类号： C08L63/00 , C08K3/08 , C08K7/00 , B32B27/38
CPC分类号： H01L24/32 , C08K3/08 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/29111 , H01L2224/32014 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , H05K3/321 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
摘要翻译：可再加工的导电粘合剂组合物及其制造方法包括含有分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒的环氧基导电粘合剂。在另外的实施方案中，从用于回收或回收模块组件的可用部件，特别是高成本半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的改进方法。

9. 发明授权

US07393419B2 Conductive adhesive rework method 失效
标题翻译：导电胶返修方法
公开(公告)号：US07393419B2
公开(公告)日：2008-07-01
申请号：US11831030
申请日：2007-07-31
申请人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
发明人： Krishna G. Sachdev , Daniel George Berger , Kelly May Chioujones , Glenn Graham Daves , Hilton T. Toy
IPC分类号： B08B7/04 , B08B3/04 , B08B3/08 , B08B3/10
CPC分类号： H01L24/32 , C08K3/08 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/29111 , H01L2224/32014 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , H05K3/321 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
摘要翻译：从用于回收或回收模块组件的可用部件，特别是高成本的半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的方法。

10. 发明授权

US5532608A Ceramic probe card and method for reducing leakage current 失效
标题翻译：陶瓷探针卡和减少漏电流的方法
公开(公告)号：US5532608A
公开(公告)日：1996-07-02
申请号：US417623
申请日：1995-04-06
申请人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
发明人： Abbas Behfar-Rad , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G01R31/26 , G01R1/073 , H05K3/28 , H05K9/00 , G01R15/12
CPC分类号： G01R1/07307
摘要： An electrical probe card for parametric testing of microelectronics having reduced leakage current, includes a hydrophobic layer of a self curing silicone material coating the entire exposed surface of the ceramic card between exposed conductors. The hydrophobic layer has a thickness of less than 1 micrometer, preferably less than 0.1 micrometer and most preferably between 0.01 and 0.001 micrometers. The hydrophobic layer does not interfere with subsequent soldering to the contacts on the card, is inexpensive, solvent resistant and easily applied to new and pre-existing probe cards. The method of application involves applying an excess of the hydrophobic silicone material in its uncured state, followed by vigorously wiping excess material off to thin the layer, produce a good bond and clean the exposed conductors on the probe card.
摘要翻译：用于具有减小的漏电流的微电子学参数测试的电探针卡包括在裸露导体之间涂覆陶瓷卡的整个暴露表面的自固化硅氧烷材料的疏水层。疏水层的厚度小于1微米，优选小于0.1微米，最优选为0.01至0.001微米。疏水层不会干扰随后焊接到卡上的触点，价格低廉，耐溶剂性，并且易于应用于新的和预先存在的探针卡。施用方法包括将过量的疏水性硅氧烷材料应用于其未固化状态，然后剧烈擦拭多余的材料以使层变薄，产生良好的粘结并清洁探针卡上的暴露的导体。

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