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1. 发明授权

US06858111B2 Conductive polymer interconnection configurations 失效
标题翻译：导电聚合物互连配置
公开(公告)号：US06858111B2
公开(公告)日：2005-02-22
申请号：US09911069
申请日：2001-07-23
申请人： Charles H. Perry , Mark G. Courtney , Lewis S. Goldmann , Gregory B. Martin
发明人： Charles H. Perry , Mark G. Courtney , Lewis S. Goldmann , Gregory B. Martin
IPC分类号： H01L21/60 , H05K3/32 , H05K3/34 , C09J5/00
CPC分类号： H01L24/10 , B23K2101/36 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K3/321 , H05K3/3436 , H05K2201/0129 , H05K2201/10674 , H05K2201/10734 , H05K2201/10992 , Y02P70/613 , Y10T428/256 , Y10T428/26 , Y10T428/31678 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.
摘要翻译：公开了一种在两个装置之间形成电连接的方法。在本发明的示例性实施例中，该方法包括将互连的第二可焊接焊锡焊接到第一部件的第一接触焊盘。互连还包括包含聚合物组分和导电组分的导电聚合物。第一可焊接帽设置成与导电聚合物接触，并且第二可焊接帽设置成与第一可焊接帽相对的导电聚合物接触。然后将第一可焊接帽焊接到第二部件的第二接触焊盘。

2. 发明授权

US06333563B1 Electrical interconnection package and method thereof 有权
标题翻译：电互连封装及其方法
公开(公告)号：US06333563B1
公开(公告)日：2001-12-25
申请号：US09587944
申请日：2000-06-06
申请人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
发明人： Raymond A. Jackson , Anson J. Call , Mark G. Courtney , Stephen A. DeLaurentis , Mukta S. Farooq , Shaji Farooq , Lewis S. Goldmann , Gregory B. Martin , Sudipta K. Ray
IPC分类号： H01L2940
CPC分类号： H05K1/141 , H01L23/49833 , H01L2224/16 , H01L2924/01322 , H01L2924/09701 , H01L2924/12044 , H01L2924/15311 , H05K3/284 , H05K3/3436 , H05K3/368 , H05K2201/049 , H05K2201/10734 , H05K2201/10977
摘要： The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.
摘要翻译：本发明一般涉及电互连封装及其方法。更具体地，本发明包括增加球栅阵列（BGA）电互连的疲劳寿命的发明。本发明使用高模量底部填充材料将至少一个模块结构地耦合到有机插入件。然后使用标准连接工艺将有机插入物连接到有机基板。随后可以通过使用标准返工技术移动有机插入件，随时从有机板上移除本发明的模块。

3. 发明授权

US06333104B1 Conductive polymer interconnection configurations 失效
标题翻译：导电聚合物互连配置
公开(公告)号：US06333104B1
公开(公告)日：2001-12-25
申请号：US09580131
申请日：2000-05-30
申请人： Charles H. Perry , Mark G. Courtney , Lewis s. Goldmann , Gregory B. Martin
发明人： Charles H. Perry , Mark G. Courtney , Lewis s. Goldmann , Gregory B. Martin
IPC分类号： B32B516
CPC分类号： H01L24/10 , B23K2101/36 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H05K3/321 , H05K3/3436 , H05K2201/0129 , H05K2201/10674 , H05K2201/10734 , H05K2201/10992 , Y02P70/613 , Y10T428/256 , Y10T428/26 , Y10T428/31678 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a “card” using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.
摘要翻译：这里公开了用于两个电气设备的电连接的互连。互连包括与一个或两个可焊接盖接触设置的导电聚合物。一起，可焊接帽和导电聚合物形成互连，其可以用于通过电气设备上的接触焊盘连接两个电气设备。例如，封装的集成电路芯片可以使用互连阵列连接到“卡”。由于互连具有可焊接表面，所以可以使用互连来代替常规生产线中的焊球。

4. 发明授权

US06253986B1 Solder disc connection 失效
标题翻译：焊盘连接
公开(公告)号：US06253986B1
公开(公告)日：2001-07-03
申请号：US09400784
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： B23K3514
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译：提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成连接。焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

5. 发明授权

US06552529B1 Method and apparatus for interim assembly electrical testing of circuit boards 失效
标题翻译：电路板临时组装电气测试方法和装置
公开(公告)号：US06552529B1
公开(公告)日：2003-04-22
申请号：US10022270
申请日：2001-12-17
申请人： Benjamin V. Fasano , Mark G. Courtney
发明人： Benjamin V. Fasano , Mark G. Courtney
IPC分类号： G01R2708
CPC分类号： G01R31/2808 , G01R1/0408
摘要： A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.
摘要翻译：一种用于组装电路板的方法和结构，由此在连接永久性低温附着装置之前可以对高温附着装置进行电测试。具有低温附着的测试插入件已知的良好参考装置与包含高温附接装置的电路板电接触。测试插件/电路板组件可用于识别在连接电路板上的永久性低温连接装置之前可以更换的任何有缺陷的高温连接装置。这种部分中间测试当仅将高温附着装置安装在电路板上时，在高温附着装置返工过程中消除了从电路板中去掉已知的良好的低温附着装置的需要。

6. 发明授权

US06283359B1 Method for enhancing fatigue life of ball grid arrays 有权
标题翻译：提高球栅阵列疲劳寿命的方法
公开(公告)号：US06283359B1
公开(公告)日：2001-09-04
申请号：US09644486
申请日：2000-08-23
申请人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
发明人： Peter J. Brofman , Mark G. Courtney , Shaji Farooq , Mario J. Interrante , Raymond A. Jackson , Gregory B. Martin , Sudipta K. Ray , William E. Sablinski , Kathleen A. Stalter
IPC分类号： B23K3102
CPC分类号： H01L24/12 , B23K35/0222 , B23K35/0244 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/1184 , H01L2224/13099 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , H05K2203/0435 , Y02P70/613 , Y10T428/12687 , Y10T428/2991 , H01L2224/29099 , H01L2924/00
摘要： This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
摘要翻译：本发明涉及一种焊料结构，当用于特别是在第二层（例如BGA和CGA互连）的基材上时，其提供增强的疲劳寿命特性。焊料结构优选是球形或柱状，并且具有可被焊料润湿的金属层，并且该结构用于在电子部件中形成焊接连接，例如连接诸如连接到MLC的芯片的电子模块，该模块连接到电路板。焊料结构优选地在金属层上具有焊料的外涂层，以向金属层提供钝化涂层以保持其免于氧化和腐蚀，并且还提供用于将焊料结构附着到衬底的焊盘上的焊料的可润湿表面被绑定。

7. 发明授权

US5881944A Multi-layer solder seal band for semiconductor substrates 失效
标题翻译：用于半导体衬底的多层焊接密封带
公开(公告)号：US5881944A
公开(公告)日：1999-03-16
申请号：US846929
申请日：1997-04-30
申请人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
发明人： David L. Edwards , Armando S. Cammarano , Jeffrey T. Coffin , Mark G. Courtney , Stephen S. Drofitz, Jr. , Michael J. Ellsworth, Jr. , Lewis S. Goldmann , Sushumna Iruvanti , Frank L. Pompeo , William E. Sablinski , Raed A. Sherif , Hilton T. Toy
IPC分类号： B23K35/02 , B23K35/26 , H01L23/10 , B23K31/02 , B23K35/22
CPC分类号： H01L23/10 , B23K35/0238 , B23K35/26 , B23K2201/40 , H01L2224/16 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/15312 , H01L2924/16152 , H01L2924/163 , Y10T428/12361
摘要： The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.
摘要翻译：本发明一般涉及为半导体衬底和芯片载体提供密封带的新方案。更具体地，本发明包括使用多层金属密封件来为芯片载体上的芯片提供保护的结构和方法。这种多层金属密封提供增强的气密寿命和环境保护。对于优选实施例，多层金属密封带是用于为模块产生低成本，高可靠性气密密封的三层焊料夹层结构。该焊料夹层具有较高的熔化温度较厚的焊料内芯和较低熔点的薄互连焊料层，其中薄的互连焊料层可具有相似或不同的熔点。

8. 发明授权

US06278184B1 Solder disc connection 失效
公开(公告)号：US06278184B1
公开(公告)日：2001-08-21
申请号：US09400783
申请日：1999-09-22
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： H01L2348
CPC分类号： H01L24/12 , B23K1/0016 , B23K2101/42 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144 , H01L2924/00
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

9. 发明授权

US6070321A Solder disc connection 失效
标题翻译：焊盘连接
公开(公告)号：US6070321A
公开(公告)日：2000-06-06
申请号：US890458
申请日：1997-07-09
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Lewis S. Goldmann , Raymond A. Jackson , William E. Sablinski , Kathleen A. Stalter , Hilton T. Toy , Li Wang
IPC分类号： B23K1/00 , B23K35/14 , H01L21/60 , H01L23/10 , H01L23/50 , H05K3/34
CPC分类号： H01L24/12 , B23K1/0016 , H01L23/10 , H01L23/50 , H01L24/16 , H01L24/81 , H05K3/3436 , B23K2201/42 , H01L2224/0401 , H01L2224/06102 , H01L2224/13099 , H01L2224/1403 , H01L2224/81801 , H01L2224/83101 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K2201/1025 , H05K2201/10992 , H05K2203/0415 , Y02P70/613 , Y10T29/49144
摘要： A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.
摘要翻译：提供焊料预成型件，用于在多层陶瓷基片之间形成互连，包括上层和下层焊料，该材料由可由焊料润湿的材料的中间层分开，并且在用于回流焊料的温度下不熔化，形成连接。焊料预成型件用于连接基板，并且特别可用于同时电连接基板并且在被接合的基板之间形成气密密封。

10. 发明授权

US5964396A Enhanced ceramic ball grid array using in-situ solder stretch with clip 失效
标题翻译：增强型陶瓷球栅阵列使用原位焊料拉伸夹
公开(公告)号：US5964396A
公开(公告)日：1999-10-12
申请号：US909801
申请日：1997-08-12
申请人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
发明人： Peter J. Brofman , Patrick A. Coico , Mark G. Courtney , Shaji Farooq , Lewis S. Goldmann , Raymond A. Jackson , David C. Linnell , Gregory B. Martin , Frank L. Pompeo , Kathleen A. Stalter , Hilton T. Toy
IPC分类号： H01L23/12 , B23K3/06 , H01L21/60 , H05K3/34 , B23K31/02 , B23K37/04
CPC分类号： B23K3/0638 , H05K3/3436 , B23K2201/36 , H01L2924/00013 , H01L2924/0002 , H05K2203/0195 , H05K2203/0465 , H05K2203/306 , Y02P70/613
摘要： A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.
摘要翻译：提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

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