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1. 发明授权

US06848914B2 Electrical coupling of substrates by conductive buttons 有权
标题翻译：通过导电按钮电连接基板
公开(公告)号：US06848914B2
公开(公告)日：2005-02-01
申请号：US09975213
申请日：2001-10-11
申请人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
发明人： Brian S. Beaman , William L. Brodsky , James A. Busby , Benson Chan , Voya R. Markovich , Charles H. Perry
IPC分类号： H01R12/52 , H01R13/24 , H01R43/00 , H01R12/00
CPC分类号： H01R43/007 , H01R12/52 , H01R13/2421
摘要： A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.
摘要翻译：用于电耦合两个基板（例如，印刷线路板和电子模块）的结构和方法。首先，提供介质芯。导电布线围绕介质芯螺旋缠绕。此外，可以在导电布线周围形成电介质护套。所得的导电杆结构沿着导电棒的长度被轴向地切割，以产生具有端部触头的导电按钮。导电按钮的端部触点可用于将两个基板电耦合到两个基板的相应焊盘处。

2. 发明授权

US07541058B2 Method of making circuitized substrate with internal optical pathway 有权
公开(公告)号：US07541058B2
公开(公告)日：2009-06-02
申请号：US11907006
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： G02B6/02 , H01L21/00 , G03G15/00 , G02B6/12
CPC分类号： G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4246 , H05K1/0274
摘要： A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.

3. 发明授权

US07441709B2 Electronic card assembly 有权
标题翻译：电子卡组装
公开(公告)号：US07441709B2
公开(公告)日：2008-10-28
申请号：US11086324
申请日：2005-03-23
申请人： Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
发明人： Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
IPC分类号： G06K19/06
CPC分类号： G06K19/005 , G06K7/084 , G06K17/00 , G06K19/07354 , G06K2017/0064
摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
摘要翻译：提供一种电子卡组件，其包括其中具有可移动卡的保护壳体。在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹）被大会的阅读器组件接收。

4. 发明授权

US07152319B2 Method of making high speed circuit board 失效
标题翻译：制造高速电路板的方法
公开(公告)号：US07152319B2
公开(公告)日：2006-12-26
申请号：US10811817
申请日：2004-03-30
申请人： Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
发明人： Benson Chan , John M. Lauffer , How T. Lin , Voya R. Markovich , David L. Thomas
IPC分类号： H01K3/10
CPC分类号： H05K3/4688 , H01L23/3128 , H01L23/5383 , H01L25/0652 , H01L25/0655 , H01L25/18 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H01L2924/3025 , H05K1/024 , H05K1/113 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , Y10T29/49126 , Y10T29/49165 , H01L2224/0401
摘要： A multilayered PCB including two multilayered portions, one of these able to electrically connect electronic components mounted on the PCB to assure high frequency connections therebetween. The PCB further includes a conventional PCB portion to reduce costs while assuring a structure having a satisfactory overall thickness for use in the PCB field. Coupling is also possible to the internal portion from these components. Methods of making these structures have also been provided.
摘要翻译：包括两个多层部分的多层PCB，其中之一能够电连接安装在PCB上的电子部件，以确保其间的高频连接。 PCB还包括常规PCB部分以降低成本，同时确保具有令人满意的整体厚度的结构以用于PCB领域。这些组件的内部部分也可以进行耦合。也提供了制造这些结构的方法。

5. 发明申请

US20130033827A1 ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERCONNECTS 有权
标题翻译：用于多层设备互连的电导体粘合剂（ECA）
公开(公告)号：US20130033827A1
公开(公告)日：2013-02-07
申请号：US13198756
申请日：2011-08-05
申请人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
发明人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
IPC分类号： H05K5/00 , H05K1/09 , B23K31/02 , H05K1/00 , H01B1/00 , H01B1/02
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.
摘要翻译：用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

6. 发明申请

US20120260063A1 MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM 审中-公开
标题翻译：具有计算机系统的模块化，可分离的计算机叶片
公开(公告)号：US20120260063A1
公开(公告)日：2012-10-11
申请号：US13082599
申请日：2011-04-08
申请人： Voya R. Markovich , How T. Lin , Benson Chan , Frank D. Egitto
发明人： Voya R. Markovich , How T. Lin , Benson Chan , Frank D. Egitto
IPC分类号： G06F15/76 , G06F9/02
CPC分类号： H05K3/365 , H01L2924/0002 , H05K1/148 , H05K2201/047 , H05K2201/10159 , H05K2201/209 , H01L2924/00
摘要： A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.
摘要翻译：在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

7. 发明申请

US20090109624A1 Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
标题翻译：具有内部冷却结构的电路化基板和利用其的电气组件
公开(公告)号：US20090109624A1
公开(公告)日：2009-04-30
申请号：US11976468
申请日：2007-10-25
申请人： Benson Chan , Frank D. Egitto , How T. Lin , Roy H. Magnuson , Voya R. Markovich , David L. Thomas
发明人： Benson Chan , Frank D. Egitto , How T. Lin , Roy H. Magnuson , Voya R. Markovich , David L. Thomas
IPC分类号： H05K7/20 , H05K3/20
CPC分类号： H05K1/0206 , H01L2924/0002 , H05K1/0272 , H05K3/0061 , H05K3/44 , H05K2201/064 , H05K2201/09745 , H05K2201/10674 , Y10S428/901 , Y10T29/49126 , Y10T29/4913 , Y10T428/24917 , H01L2924/00
摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.
摘要翻译：一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。热冷却结构适于在组件的操作期间使冷却流体通过。还提供了制造基板的方法。

8. 发明授权

US09451693B2 Electrically conductive adhesive (ECA) for multilayer device interconnects 有权
标题翻译：导电胶（ECA）用于多层器件互连
公开(公告)号：US09451693B2
公开(公告)日：2016-09-20
申请号：US13198756
申请日：2011-08-05
申请人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
发明人： Rabindra N. Das , Voya R. Markovich , John M. Lauffer , Roy H. Magnuson , Konstantinos I. Papathomas , Benson Chan
IPC分类号： H05K1/11 , H05K1/03
CPC分类号： H05K1/0313 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/172 , B23K2103/52 , H01B1/22 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/01322 , H01L2924/15311 , H05K1/097 , H05K3/4053 , H05K3/4069 , H05K3/462 , H05K3/4623 , H05K3/4641 , H05K2201/0257 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09718 , H05K2201/10378 , H05K2203/0425 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165 , H01L2924/00
摘要： A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.
摘要翻译：用于连接多级Z轴互连的多层导电粘合剂（ECA）混合物和形成连接多级Z轴互连的ECA的方法。具有多层能力的ECA包含允许糊料适应特定要求的组成成分的混合物，其中制造电路化衬底组件的方法，其中具有潜在不同的热膨胀系数（CTE）的两个或更多个子组件对齐，并且Z- 在连接期间创建轴互连。导体的冶金和多层导电浆料的冶金被有效地混合，并且在配合子组件之间使用的可流动的中间电介质流动以接合和围绕导体耦合。

9. 发明申请

US20090093073A1 Method of making circuitized substrate with internal optical pathway using photolithography 失效
标题翻译：使用光刻法制造具有内部光学路径的电路化衬底的方法
公开(公告)号：US20090093073A1
公开(公告)日：2009-04-09
申请号：US11907004
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： H01L21/77
CPC分类号： G02B6/43 , G02B6/132 , G02B6/136 , H05K1/0274
摘要： A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.
摘要翻译：一种制造电路化衬底（例如，PCB）的方法，其包括至少一个可能的几个内部光学路径作为其一部分，使得所得到的衬底将能够传输和/或接收电信号和光信号。该方法包括在光学核心的一侧和相邻的直立构件之间形成至少一个开口，使得开口由至少一个角形侧壁限定。通过光学芯材料（或从上方进入芯体）的光从该角形侧壁反射。因此，开口内的介质（例如空气）由于其相对于相邻的光学芯材料的反射率而与反射介质一样起作用。该方法利用了常规PCB制造中使用的许多工艺，从而将成本降至最低。所形成的基底能够光学和电耦合到具有相似能力的一个或多个其它基底，从而形成这种基底的电光学组件。

10. 发明申请

US20090092353A1 Method of making circuitized substrate with internal optical pathway 有权
标题翻译：制造具有内部光通路的电路化基板的方法
公开(公告)号：US20090092353A1
公开(公告)日：2009-04-09
申请号：US11907006
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： G02B6/122
CPC分类号： G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4246 , H05K1/0274
摘要： A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.
摘要翻译：包括作为其一部分的内部光学路径的电路化衬底（例如，PCB），使得衬底能够传输和/或接收电信号和光信号。衬底包括在一个包覆层上的角反射器，使得穿过光学核心的光信号将撞击角形反射器的成角度的反射表面，并通过开口（包括其中具有光学透明材料的一个）反射，例如涉及另外还具有至少一个内部光学路径作为其一部分的第二电路化基板，从而光学地连接两个基板。还提供了制造基板的方法。

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