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1. 发明授权

US5151773A Electronic circuit apparatus comprising a structure for sealing an electronic circuit 失效
标题翻译：电子电路装置，包括用于密封电子电路的结构
公开(公告)号：US5151773A
公开(公告)日：1992-09-29
申请号：US676389
申请日：1991-03-28
申请人： Kiyoshi Matsui , Ryohei Satoh , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai , Kenichi Hamamura
发明人： Kiyoshi Matsui , Ryohei Satoh , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai , Kenichi Hamamura
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/16315
摘要： An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.
摘要翻译：将电子电路部件安装到多路接线基板等上以与诸如LSI的电子电路一起使用的电子电路装置通过密封单元密封。密封单元由指定为上板密封单元的上板和指定为侧板密封单元的侧板密封，侧板的横截面的边缘的形状为凸形或圆形。金属化应用于基板和侧板之间以及侧板和上板之间的焊接部分，并且由支撑柱提供预定的焊点高度以实现焊料接合。

2. 发明授权

US5136360A Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals 失效
标题翻译：电子电路器件，连接焊料和焊料的方法，用于连接镀金端子
公开(公告)号：US5136360A
公开(公告)日：1992-08-04
申请号：US563281
申请日：1990-08-06
申请人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
发明人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
IPC分类号： B23K35/22 , B23K35/26 , C22C13/00 , H01L21/60 , H01L23/488 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225
摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.
摘要翻译：一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分基材由1.0〜8.0重量份的合金组成构成。提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

3. 发明授权

US5276289A Electronic circuit device and method of producing the same 失效
标题翻译：电子电路装置及其制造方法
公开(公告)号：US5276289A
公开(公告)日：1994-01-04
申请号：US674599
申请日：1991-03-25
申请人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
发明人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34 , H05K1/00
CPC分类号： H01L24/81 , B23K35/30 , H01L23/10 , H01L23/16 , H01L23/5385 , H01L25/0655 , H05K3/3463 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/30107 , H05K2201/094 , H05K2201/10704 , H05K2201/10734
摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
摘要翻译：本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金（熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃））。

4. 发明授权

US5023407A Printed circuit board with a uniform conductive layer formed by equalization of metals therein 失效
标题翻译：具有通过均匀金属形成的均匀导电层的印刷电路板
公开(公告)号：US5023407A
公开(公告)日：1991-06-11
申请号：US390616
申请日：1989-08-07
申请人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
发明人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
IPC分类号： B23K1/20 , H01L21/48 , H01L21/52 , H01L21/60 , H01L23/50 , H05K1/03 , H05K1/09 , H05K3/24 , H05K3/34
CPC分类号： H05K3/246 , H01L21/4846 , H01L24/85 , H01L2224/45144 , H01L2224/48463 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/0306 , H05K1/092 , H05K2203/0723 , H05K2203/107 , H05K3/244 , H05K3/3457
摘要： A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.
摘要翻译：在陶瓷基板上形成金以外的金属层，在所述金属层上进一步形成金层，然后将高密度光束施加到处理过的基板部件。由此，通过热处理等将金的晶界扩散到金层的表面的底层的金属与金均匀混合，形成对焊料的润湿性优异的合金化层。同时，将金属杂质如粘附在金层表面上的碳熔化并除去。

5. 发明授权

US5801350A Surface reformation method of high polymer material 失效
标题翻译：高分子材料表面改性方法
公开(公告)号：US5801350A
公开(公告)日：1998-09-01
申请号：US619186
申请日：1996-03-21
申请人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号： C08J7/00 , H01L21/56 , H01L21/60 , H01L21/68 , H05K3/22 , H05K3/30 , H05K3/34
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/81 , H05K3/305 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , H05K3/22 , H05K3/303 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809
摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
摘要翻译：高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。仅用于临时固定的液体相对于预定面积的润湿性提高。通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

6. 发明授权

US5709338A Soldering method 失效
标题翻译：焊接方法
公开(公告)号：US5709338A
公开(公告)日：1998-01-20
申请号：US636186
申请日：1996-04-22
申请人： Mitugu Shirai , Hideaki Sasaki , Takeshi Takahashi
发明人： Mitugu Shirai , Hideaki Sasaki , Takeshi Takahashi
IPC分类号： B23K1/00 , B23K35/26 , H05K3/34 , B23K1/19 , B23K35/14 , B23K35/24
CPC分类号： B23K1/0016 , B23K35/26 , H05K3/3463 , B23K2201/36 , B23K35/262 , B23K35/268 , H05K2201/10992 , H05K3/341 , H05K3/3457
摘要： A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.
摘要翻译：以这样的方式进行焊接，使得具有不同熔点的两个焊料部分放置在用于接合的基板上的金属化和一部分之间。使具有较高熔点的芯片部分比具有较低熔点的焊料箔部分厚。最初，通过具有较高熔点的焊料芯片将部件保持在金属化之上。具有较低熔点的焊料箔在这种状态下首先被熔化，之后熔化熔点较高的焊料芯片。通过这样的焊接方法，可以通过一次焊接操作来进行可靠的焊接，而不会在部分接合部的下表面上产生空隙，从而不需要预焊工艺。

7. 发明授权

US4628616A Vapor tank 失效
标题翻译：蒸气罐
公开(公告)号：US4628616A
公开(公告)日：1986-12-16
申请号：US671872
申请日：1984-11-15
申请人： Mitugu Shirai , Hideaki Sasaki , Sadatoshi Ueda , Akira Sawada
发明人： Mitugu Shirai , Hideaki Sasaki , Sadatoshi Ueda , Akira Sawada
IPC分类号： H05K3/34 , B23K1/015 , F22B1/28 , F27D7/02 , H05K13/04 , F26B19/00
CPC分类号： B23K1/015 , H05K13/0465 , Y10S165/908
摘要： A vapor tank for processing a product by heating the same through exposure to vapor serving as a heat transfer medium. The vapor tank includes at least one partition wall separating a vapor chamber filled with vapor and a heating chamber for processing the product by heating the same for supplying a sufficient saturated vapor to the product. The partition wall is formed with openings for allowing the saturated vapor to be injected therethrough from the vapor chamber into the heating chamber where the product is enveloped by the saturated vapor. The vapor tank is provided with a recovery device for recovering the vapor flowing out of the tank through an inlet and an outlet for introducing and discharging the product into and out of the tank with a high degree of vapor recovering efficiency and with a minimum loss of energy. The vapor tank is also provided with a mechanism for externally supplying air currents to prevent the vapor from flowing out of the tank through the inlet and the outlet.
摘要翻译：一种用于通过将其暴露于作为传热介质的蒸气进行加热来加工产品的蒸气罐。蒸汽箱包括至少一个分隔出蒸气的蒸气室的分隔壁和加热室，用于通过加热产品来加热产品，以便向产品供应足够的饱和蒸气。分隔壁形成有开口，用于使饱和蒸汽从蒸汽室注入到加热室中，在该加热室中产物被饱和蒸气包围。蒸气罐设置有回收装置，用于通过入口和出口回收从罐中流出的蒸汽，用于以高回收蒸气回收效率将产物引入和排出罐，并以最小的损失能源。蒸汽箱还设置有用于从外部供应气流以防止蒸气通过入口和出口流出罐的机构。

8. 发明授权

US06423405B1 Surface reformation method of high polymer material 失效
标题翻译：高分子材料表面改性方法
公开(公告)号：US06423405B1
公开(公告)日：2002-07-23
申请号：US09384105
申请日：1999-08-27
申请人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号： B32B712
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K3/22 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K3/3452 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809 , H01L2924/00
摘要： There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.
摘要翻译：公开了一种高分子材料的表面改性方法，使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束，所述预定区域通过液体在具有高聚合物层的基底上仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。在通过使用该方法将电子部件暂时固定在基板上之后，可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。

9. 发明授权

US6017424A Laser assisted surface reformation method of high polymer material 失效
标题翻译：高分子材料激光辅助表面改性方法
公开(公告)号：US6017424A
公开(公告)日：2000-01-25
申请号：US028095
申请日：1998-02-23
申请人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
发明人： Tsutomu Shibuya , Kaoru Katayama , Mitugu Shirai , Shinichi Kazui , Hideaki Sasaki , Yasuhiro Iwata
IPC分类号： C08J7/00 , H01L21/56 , H01L21/60 , H01L21/68 , H05K3/22 , H05K3/30 , H05K3/34 , C07C1/00 , C07C2/00 , C07C4/00 , C07C5/00 , C07C6/00
CPC分类号： H01L21/6835 , H01L21/563 , H01L24/81 , H05K3/305 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H05K2201/0154 , H05K2201/10674 , H05K2201/10734 , H05K2203/0783 , H05K2203/107 , H05K3/22 , H05K3/303 , H05K3/3436 , H05K3/3452 , Y02P70/613 , Y10T29/49144 , Y10T428/24917 , Y10T428/2809
摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.
摘要翻译：高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。仅用于临时固定的液体相对于预定面积的润湿性提高。通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

10. 发明授权

US06705505B2 Paste providing method, soldering method and apparatus and system therefor 失效
标题翻译：糊剂提供方法，焊接方法及其设备及系统
公开(公告)号：US06705505B2
公开(公告)日：2004-03-16
申请号：US10278917
申请日：2002-10-24
申请人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
发明人： Fumio Yoshikawa , Hideyuki Fukasawa , Mitsugu Shirai , Hideaki Sasaki , Toshitaka Murakawa , Kenichi Hamamura
IPC分类号： B23K306
CPC分类号： H05K3/3484 , B23K3/0638 , B23K2101/42 , H05K3/1216 , H05K3/1233 , H05K3/3415 , H05K3/3447 , H05K3/42 , H05K2201/09572 , H05K2203/0143
摘要： A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.
摘要翻译：一种焊接系统，其减少了将糊料供应和焊接到印刷电路板上的步骤数量。印刷电路板具有通孔，每个所提供的部分的引线将被插入。打印掩模与通孔匹配，并且设置具有孔的糊状物接收板，相应于通孔向其供应焊膏。通过强力旋转印刷辊以填充焊膏，印刷辊被跟随印刷辊，以进一步填充通孔。零件加载在通孔上，并在印刷电路板和糊状物接收板上进行回流，从而将零件焊接到印刷电路板上。

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