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1. 发明授权

US5276289A Electronic circuit device and method of producing the same 失效
标题翻译：电子电路装置及其制造方法
公开(公告)号：US5276289A
公开(公告)日：1994-01-04
申请号：US674599
申请日：1991-03-25
申请人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
发明人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34 , H05K1/00
CPC分类号： H01L24/81 , B23K35/30 , H01L23/10 , H01L23/16 , H01L23/5385 , H01L25/0655 , H05K3/3463 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/30107 , H05K2201/094 , H05K2201/10704 , H05K2201/10734
摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
摘要翻译：本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金（熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃））。

2. 发明授权

US5151773A Electronic circuit apparatus comprising a structure for sealing an electronic circuit 失效
标题翻译：电子电路装置，包括用于密封电子电路的结构
公开(公告)号：US5151773A
公开(公告)日：1992-09-29
申请号：US676389
申请日：1991-03-28
申请人： Kiyoshi Matsui , Ryohei Satoh , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai , Kenichi Hamamura
发明人： Kiyoshi Matsui , Ryohei Satoh , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai , Kenichi Hamamura
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , H01L2924/0002 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/16315
摘要： An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.
摘要翻译：将电子电路部件安装到多路接线基板等上以与诸如LSI的电子电路一起使用的电子电路装置通过密封单元密封。密封单元由指定为上板密封单元的上板和指定为侧板密封单元的侧板密封，侧板的横截面的边缘的形状为凸形或圆形。金属化应用于基板和侧板之间以及侧板和上板之间的焊接部分，并且由支撑柱提供预定的焊点高度以实现焊料接合。

3. 发明授权

US5923539A Multilayer circuit substrate with circuit repairing function, and electronic circuit device 失效
标题翻译：具有电路修复功能的多层电路基板和电子电路装置
公开(公告)号：US5923539A
公开(公告)日：1999-07-13
申请号：US547988
申请日：1995-10-25
申请人： Kiyoshi Matsui , Ryohei Satoh , Michifumi Kawai , Masashi Ohkubo , Yutaka Watanabe , Masakazu Yamamoto , Tsutomu Imai , Shinji Abe , Hiroyuki Hidaka
发明人： Kiyoshi Matsui , Ryohei Satoh , Michifumi Kawai , Masashi Ohkubo , Yutaka Watanabe , Masakazu Yamamoto , Tsutomu Imai , Shinji Abe , Hiroyuki Hidaka
IPC分类号： H01L23/538 , H05K1/00 , H05K3/22 , H05K1/11 , H05K1/14
CPC分类号： H01L23/5382 , H05K1/0292 , H01L2224/16225 , H01L2924/09701 , H01L2924/15311 , H01L2924/19107 , H05K1/0298 , H05K2201/10674 , H05K2201/10734
摘要： A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.
摘要翻译：一种具有电路修复功能的多层电路基板，其具有经由基板间绝缘膜在内层具有电路图案和修复图案的电路基板，并且具有用于切割和接合这些图案上的电路的电路修复区域，端子接合用于接合安装在该基板上的电子电路部件的焊盘，以及用于将所述电路图案接合到端子焊盘的导电通孔，其中至少修复图案的电路修复区域和至少电路图案的电路修复区域设置在所述内层上彼此靠近并且位于同一平面上。

4. 发明授权

US5743009A Method of making multi-pin connector 失效
标题翻译：制造多针连接器的方法
公开(公告)号：US5743009A
公开(公告)日：1998-04-28
申请号：US627459
申请日：1996-04-04
申请人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
发明人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
IPC分类号： H01R12/04 , H01R43/02 , H05K3/30 , H05K7/10 , H01R9/06
CPC分类号： H05K3/303 , H01R43/0256 , H05K7/1084 , H05K2201/09472 , H05K2201/10704 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , Y10T29/49149
摘要： Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.
摘要翻译：接触针的端部插入到印刷电路板上所需位置的有底连接孔中，使得接触针以期望的形式排列。通过在该状态下进行焊料回流，接触销固定地焊接到连接孔。因此提供了一种多针连接器，其可以在短时间内容易地制造，并且可以具有任何间距，任意数量的销和任何形状。

5. 发明授权

US06213786B1 Electronic device and multi-pin connector therefor 失效
标题翻译：电子设备和多针连接器
公开(公告)号：US06213786B1
公开(公告)日：2001-04-10
申请号：US09632242
申请日：2000-08-03
申请人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
发明人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
IPC分类号： H01R1200
CPC分类号： H05K3/303 , H01R43/0256 , H05K7/1084 , H05K2201/09472 , H05K2201/10704 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , Y10T29/49149
摘要： A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.
摘要翻译：多针连接器具有固定焊接到印制板上所需位置的有底连接孔中的接触针，使得接触针以期望的形式排列而没有外壳。多针连接器可以在短时间内制造，并且可以具有任何间距，任意数量的销和任何形状。

6. 发明授权

US6132221A Multi-pin connector 失效
标题翻译：多针连接器
公开(公告)号：US6132221A
公开(公告)日：2000-10-17
申请号：US64197
申请日：1998-04-22
申请人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
发明人： Kiyoshi Matsui , Takayuki Ono , Kenichi Kasai , Tsutomu Imai , Morio Suzuki , Hideyuki Fukasawa , Mitugu Shirai , Toshitaka Murakawa , Takeji Siokawa , Takeshi Kuroda
IPC分类号： H01R12/04 , H01R43/02 , H05K3/30 , H05K7/10 , H01R12/00
CPC分类号： H05K3/303 , H01R43/0256 , H05K7/1084 , H05K2201/09472 , H05K2201/10704 , H05K2203/0195 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , Y10T29/49149
摘要： A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.
摘要翻译：用于在主板上安装其它板或电子部件的多针连接器具有固定焊接到主板上所需位置的有底连接孔中的接触销，使得接触销被单独固定并以所需形式排列没有住房。接触销具有接触部分和销部分，其中销部分固定在连接孔中。

7. 发明授权

US5832595A Method of modifying conductive lines of an electronic circuit board and its apparatus 失效
标题翻译：修改电子电路板导线及其装置的方法
公开(公告)号：US5832595A
公开(公告)日：1998-11-10
申请号：US260382
申请日：1994-06-14
申请人： Shigenobu Maruyama , Mikio Hongo , Haruhisa Sakamoto , Tateoki Miyauchi , Ryohei Satoh , Kiyoshi Matsui , Shinichi Kazui , Kaoru Katayama , Hiroshi Fukuda
发明人： Shigenobu Maruyama , Mikio Hongo , Haruhisa Sakamoto , Tateoki Miyauchi , Ryohei Satoh , Kiyoshi Matsui , Shinichi Kazui , Kaoru Katayama , Hiroshi Fukuda
IPC分类号： H01L23/538 , H01L21/48 , H01L23/12 , H05K1/09 , H05K3/00 , H05K3/02 , H05K3/10 , H05K3/22
CPC分类号： H01L21/485 , H05K3/225 , H05K1/095 , H05K2203/0769 , H05K2203/0783 , H05K2203/107 , H05K2203/108 , H05K2203/121 , H05K2203/173 , H05K2203/175 , H05K3/0017 , H05K3/027 , H05K3/102 , Y10T29/49124 , Y10T29/49718 , Y10T29/49732
摘要： A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board. Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.
摘要翻译：通过在电子电路板的导线的指定或任意位置执行导线的断开或连接来改变电子电路板的方法，从而改变电路并完全改变导电线的开路图案缺陷，或绝缘体层及其装置，其中第一能量束照射到旨在连接或断开电子电路板中的导线5和5'的修复端子9和9'的部分，从而去除保护层，制造窗户并露出端子9和9'用于连接; 照射第二能量束，从而断开维修端子9和9'，或者用于连接的金属片供应到修理端子9和9'之间并向其施加能量，从而电连接它们; 并且断开或连接的窗口部分局部地涂覆有绝缘体层，从而修改电子电路板的导线。此外，窗311或311'形成在形成在耦合或导线断路部分309中的导线连接部分308上的绝缘保护层310中，导线断开部分的导线被断开或液体材料312 用于连接导线的导线被提供给导线连接部分308，金属层313通过加热液体材料312而沉淀，从而连接导线连接部分308，并且窗311或311'被涂覆有机绝缘体层。

8. 发明授权

US5375042A Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit 失效
标题翻译：半导体封装采用具有一对薄膜电路的基板组件，该薄膜电路设置在厚膜电路的相对的每个表面上
公开(公告)号：US5375042A
公开(公告)日：1994-12-20
申请号：US799950
申请日：1991-11-29
申请人： Hideo Arima , Kiyoshi Matsui , Kenji Takeda
发明人： Hideo Arima , Kiyoshi Matsui , Kenji Takeda
IPC分类号： H01L23/12 , H01L23/10 , H01L23/538 , H01L25/04 , H01L25/18 , H05K1/11
CPC分类号： H01L23/5385 , H01L23/10 , H01L2224/16 , H01L2224/16225 , H01L2224/45147 , H01L2924/00014 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H01L2924/15312 , H01L2924/16152
摘要： A semiconductor package and an electronic circuit board in which the semiconductor package is mounted on an external circuit board. The semiconductor package has a substrate assembly and a semiconductor mounted on the substrate, where the substrate assembly is composed of a thick film circuit in the form of a ceramic circuit board and a pair of thin film circuits disposed one on each of opposite surfaces of the thick film circuits. Such a substrate assembly has one surface thereof connected to, i.e. electrically contacting, the semiconductor and an opposing surface thereof adapted to be connected to an external circuit. The thin film circuits of the assembly are formed of a heat-resisting resin and a conducting material.
摘要翻译：半导体封装和电子电路板，其中半导体封装安装在外部电路板上。半导体封装具有基板组件和安装在基板上的半导体，其中基板组件由陶瓷电路板形式的厚膜电路和一对薄膜电路组成，薄膜电路一厚膜电路。这种基板组件的一个表面连接到半导体的电接触，以及适于连接到外部电路的相对表面。组件的薄膜电路由耐热树脂和导电材料形成。

9. 发明授权

US07027709B2 Method for forming magnetic gap of video signal erasure head, erasure head, and video recorder having the same 失效
标题翻译：用于形成具有其的视频信号擦除头，擦除头和录像机的磁隙的方法
公开(公告)号：US07027709B2
公开(公告)日：2006-04-11
申请号：US09847537
申请日：2001-05-01
申请人： Kiyoshi Matsui , Yoshinobu Umaji
发明人： Kiyoshi Matsui , Yoshinobu Umaji
IPC分类号： H04N5/76 , G11B5/127
CPC分类号： G11B5/232 , G11B5/127
摘要： The invention provides a simple method for forming a gap for an erasure head to improve the quality of this erasure head. A front core 3 constituting an erasure head H includes in configuration two magnetic substances 5 and a magnetic gap 6 made of a non-magnetic substance arranged between these two magnetic substances 5, in which the gap 6 made of the non-magnetic substance is bonded by adhesion or welding between those two magnetic substances 5. By this method, the gap can be formed free of an air bubble, with good mass-productivity, and inexpensively as compared to a prior art method of forming a gap by glass bonding.
摘要翻译：本发明提供了一种用于形成用于擦除头的间隙以提高该擦除头的质量的简单方法。构成擦除头H的前芯3包括两个磁性物质5和由这两个磁性物质5之间的非磁性物质制成的磁隙6，其中由非磁性物质形成的间隙6接合通过这两种磁性物质之间的粘合或焊接5。通过该方法，与现有技术的通过玻璃粘合形成间隙的方法相比，可以形成没有气泡的间隙，并且具有良好的批量生产率。

10. 发明授权

US4893105A Transformer with tapered core 失效
标题翻译：变压器带锥形铁心
公开(公告)号：US4893105A
公开(公告)日：1990-01-09
申请号：US212643
申请日：1988-06-28
申请人： Tsutomu Maeda , Kiyoshi Matsui , Takayuki Kanno , Kunihiro Sato
发明人： Tsutomu Maeda , Kiyoshi Matsui , Takayuki Kanno , Kunihiro Sato
IPC分类号： H01F38/12
CPC分类号： H01F38/12 , H01F2038/122
摘要： In a transformer including a low-voltage input coil, a high-voltage output coil disposed coaxially of the low-voltage input coil, and a core for magnetically connecting both of the coils together; the improvement comprising a first bobbin around which the low-voltage input coil is wound which first bobbin has an inner-diameter hole, wherein the core comprises a rod portion to be inserted into the inner-diameter hole of the first bobbin and a flange portion provided at one axial end of the rod portion. In another aspect of the invention, the transformer further comprises a second bobbin around which the high-voltage output coil is wound, and a connector adapted to be connected to an ignition plug which connector is mounted on an end surface of the second bobbin on the opposite side of the flange portion of the core in such a manner that a mounting direction of the connector substantially coincides with an axial direction of the second bobbin. In a further aspect of the invention, the transformer further comprises a shield case formed of a magnetic conductive material surrounding an outer periphery of the connector or entirely surrounding the transformer. The rod portion of the core may have a tapering cross section such that it is gradually tapered from a low voltage side of the high-voltage output coil to a high voltage side thereof. With this arrangement, the transformer may be easily assembled and made compact. Further, a magnetic efficiency may be improved, and an insulating distance between the low-voltage input coil and the high-voltage output coil may be ensured.
摘要翻译：在包括低压输入线圈的变压器中，与低压输入线圈同轴配置的高压输出线圈和用于将两个线圈磁连接在一起的铁芯; 所述改进包括第一线轴，所述低压输入线圈缠绕在所述第一线轴上，所述第一线轴具有内径孔，其中所述芯包括插入所述第一线轴的内径孔中的杆部分和凸缘部分设置在杆部分的一个轴向端部。在本发明的另一方面，变压器还包括绕其高压输出线圈的第二线轴，以及适于连接到火花塞的连接器，该连接器安装在第二线轴的端面上芯的凸缘部分的相对侧使得连接器的安装方向基本上与第二线轴的轴向方向一致。在本发明的另一方面，变压器还包括由围绕连接器的外周围或整个围绕变压器的磁性导电材料形成的屏蔽壳。芯的杆部可以具有锥形横截面，使得其从高压输出线圈的低压侧逐渐变细到高压侧。通过这种布置，变压器可以容易地组装和制造得紧凑。此外，可以提高磁效率，并且可以确保低电压输入线圈和高压输出线圈之间的绝缘距离。

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