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1. 发明授权

US5276289A Electronic circuit device and method of producing the same 失效
标题翻译：电子电路装置及其制造方法
公开(公告)号：US5276289A
公开(公告)日：1994-01-04
申请号：US674599
申请日：1991-03-25
申请人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
发明人： Ryohei Satoh , Fumiyuki Kobayashi , Yutaka Watanabe , Tositada Netsu , Mitugu Shirai , Kenji Takeda , Masahide Harada , Kiyoshi Matsui , Hideaki Sasaki
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34 , H05K1/00
CPC分类号： H01L24/81 , B23K35/30 , H01L23/10 , H01L23/16 , H01L23/5385 , H01L25/0655 , H05K3/3463 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/1616 , H01L2924/16195 , H01L2924/30107 , H05K2201/094 , H05K2201/10704 , H05K2201/10734
摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
摘要翻译：本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金（熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃））。

2. 发明授权

US5136360A Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals 失效
标题翻译：电子电路器件，连接焊料和焊料的方法，用于连接镀金端子
公开(公告)号：US5136360A
公开(公告)日：1992-08-04
申请号：US563281
申请日：1990-08-06
申请人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
发明人： Masahide Harada , Ryohei Satoh , Fumiyuki Kobayashi , Takaji Takenaka , Toshitada Netsu , Hideaki Sasaki , Mitugu Shirai
IPC分类号： B23K35/22 , B23K35/26 , C22C13/00 , H01L21/60 , H01L23/488 , H05K3/34
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225
摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.
摘要翻译：一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分基材由1.0〜8.0重量份的合金组成构成。提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

3. 发明授权

US5731066A Electronic circuit device 失效
标题翻译：电子电路装置
公开(公告)号：US5731066A
公开(公告)日：1998-03-24
申请号：US546795
申请日：1995-10-23
申请人： Akihiro Ando , Osamu Yamada , Ryohei Satoh , Takashi Inoue , Masahide Okamoto , Fumiyuki Kobayashi , Toshihiko Ohta , Minoru Tanaka
发明人： Akihiro Ando , Osamu Yamada , Ryohei Satoh , Takashi Inoue , Masahide Okamoto , Fumiyuki Kobayashi , Toshihiko Ohta , Minoru Tanaka
IPC分类号： H05K1/09 , B23K1/00 , H01L23/498 , H05K1/11 , H05K1/18 , H05K3/40 , H05K3/46 , B32B3/00 , B32B15/00 , B23K31/02 , H01R9/09
CPC分类号： H01L23/49811 , B23K1/0016 , H05K1/111 , B23K2201/40 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , H05K2201/0376 , H05K2201/098 , H05K3/4007 , H05K3/4611 , H05K3/4629 , Y02P70/611 , Y10T428/24926
摘要： In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.
摘要翻译：在具有输入/输出引脚接合电极的电子电路装置中，为了显着地改善诸如润湿性和接合强度的接合特性并且大大简化了制造工艺，在形成玻璃陶瓷用于板的电子电路板材料和布线导体和接合电极，其中Cu的尺寸设置成延伸超过针孔，使得焊料仅与其接触而不是陶瓷电路板。在使用基板材料的电极上形成覆盖层时，以相同的工序形成布线和接合电极，根据需要在该电极上形成Au或Au-Ni层叠膜，然后使用焊接如Au-Sn或Au-Ge。

4. 发明授权

US5281151A Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module 失效
标题翻译：具有安装在其中的相同芯片载体的半导体芯片载体，和具有相同模块的电子装置
公开(公告)号：US5281151A
公开(公告)日：1994-01-25
申请号：US902996
申请日：1992-06-23
申请人： Hideo Arima , Kenji Takeda , Hideho Yamamura , Fumiyuki Kobayashi
发明人： Hideo Arima , Kenji Takeda , Hideho Yamamura , Fumiyuki Kobayashi
IPC分类号： H01L23/12 , H01L23/498 , H01L23/538 , H01L25/10 , H05K1/11
CPC分类号： H01L23/49822 , H01L23/5383 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/45147 , H01L2224/73253 , H01L2225/1005 , H01L2924/00014 , H01L2924/01014 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/16152 , H01L2924/16195 , H01L2924/30107
摘要： A semiconductor chip carrier, an electronic module having the semiconductor chip carrier mounted therein, and an electronic device incorporating the electronic module. A semiconductor chip carrier comprises a multi-layer wiring substrate including a multi-layer ceramic board, and a thin film circuit mounted on said multi-layer ceramic board, and a semiconductor chip mounted and connected to the thin film circuit, wherein a low-resistance conductor path is provided on the surface of or in the multi-layer wiring substrate to connect between signal terminals which need to be connected with a low-resistance wire in the semiconductor chip, thereby realizing signal transmission at low resistance between the signal terminals of the semiconductor chip by this conductor path. This arrangement makes it possible to shorten the signal delay time of a semiconductor chip, and achieve higher speed signal processing in modules and electronic equipment in which a thus-improved semiconductor chip is used.
摘要翻译：半导体芯片载体，其中安装有半导体芯片载体的电子模块和结合有该电子模块的电子装置。半导体芯片载体包括：多层布线基板，包括多层陶瓷基板;以及薄膜电路，安装在所述多层陶瓷基板上;以及半导体芯片，安装并连接到所述薄膜电路，电阻导体路径设置在多层布线基板的表面上或者在多层布线基板的表面上，以连接需要与半导体芯片中的低电阻布线连接的信号端子，从而在信号端子之间实现低电阻的信号传输半导体芯片由该导体路径。这种布置使得可以缩短半导体芯片的信号延迟时间，并且在其中使用如此改进的半导体芯片的模块和电子设备中实现更高速度的信号处理。

5. 发明授权

US4739125A Electric component part having lead terminals 失效
标题翻译：具有引线端子的电气部件
公开(公告)号：US4739125A
公开(公告)日：1988-04-19
申请号：US907006
申请日：1986-09-15
申请人： Yutaka Watanabe , Fumiyuki Kobayashi , Masao Sekibata , Shigeo Kuroda , Akio Yasukawa , Shigejiro Sekine
发明人： Yutaka Watanabe , Fumiyuki Kobayashi , Masao Sekibata , Shigeo Kuroda , Akio Yasukawa , Shigejiro Sekine
IPC分类号： H01L23/50 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/18 , H05K3/34
CPC分类号： H01L23/49555 , H01L23/49811 , H05K3/3426 , H01L2924/0002 , H05K1/0271 , H05K2201/10689 , H05K2201/10719 , H05K2201/10727 , H05K2201/10757 , H05K2201/10946 , Y02P70/613
摘要： An electric component part has its lead terminals bent in thickness directions in a middle section thereof at least two positions so that a step section virtually in parallel to the bottom of a circuit substrate is formed with the intention of absorbing the external force applied to the part by chaging the shape of the lead terminals. Increase in the part layout area due to the formation of the horizontal step section can be avoided, when necessary, by shifting the terminal lead out position on the component part inward thereby to minimize the jetty dimensions.
摘要翻译：电气部件的导线端子在其中间部分的至少两个位置处具有在厚度方向上弯曲的引线端子，从而形成与电路基板的底部实际上平行的台阶部分，其目的是吸收施加到部件的外力通过跟踪引线端子的形状。当需要时，可以避免由于形成水平台阶部而导致的部件布局区域的增加，通过将部件部件上的端子引出位置向内移位，从而使喷射尺寸最小化。

6. 发明授权

US4624896A Multi-layer ceramic substrate and method for the production thereof 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US4624896A
公开(公告)日：1986-11-25
申请号：US627889
申请日：1984-07-05
申请人： Yutaka Watanabe , Fumiyuki Kobayashi , Satoru Ogihara , Yoshiyuki Ohzawa
发明人： Yutaka Watanabe , Fumiyuki Kobayashi , Satoru Ogihara , Yoshiyuki Ohzawa
IPC分类号： B32B15/04 , H01L21/48 , H01L23/15 , H01L23/538 , H05K1/00 , H05K1/03 , H05K3/46 , B32B3/10
CPC分类号： H01L21/4807 , H01L23/15 , H01L23/5383 , H01L2224/16 , H01L2224/16235 , H01L2924/01014 , H01L2924/01078 , H01L2924/09701 , H01L2924/15312 , H05K1/0306 , H05K3/4676 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： The multi-layer ceramic substrate of this invention includes conductor layers and insulating layers disposed between the conductor layers. The insulating layers include the layers of a sintered body principally composed of mullite and the layers of a sintered body principally composed of alumina. This multi-layer ceramic substrate is produced by laminating the green sheets and sintering the laminate. The green sheets principally composed of mullite and the green sheet principally composed of alumina are prepared, and they are laminated and sintered.
摘要翻译：本发明的多层陶瓷基板包括布置在导体层之间的导体层和绝缘层。绝缘层包括主要由莫来石组成的烧结体层和主要由氧化铝构成的烧结体层。该多层陶瓷基板通过层叠生片并烧结层压体而制造。制备主要由莫来石组成的生片和主要由氧化铝构成的生片，并将它们层压并烧结。

7. 发明授权

US09183797B2 Display device and control method for display device 有权
标题翻译：显示装置的显示装置和控制方法
公开(公告)号：US09183797B2
公开(公告)日：2015-11-10
申请号：US14110767
申请日：2012-04-09
申请人： Kohzoh Takahashi , Taketoshi Nakano , Asahi Yamato , Ken Inada , Fumiyuki Kobayashi , Toshihiro Yanagi
发明人： Kohzoh Takahashi , Taketoshi Nakano , Asahi Yamato , Ken Inada , Fumiyuki Kobayashi , Toshihiro Yanagi
IPC分类号： G09G3/36 , G09G3/20 , G09G5/04 , G09G5/06 , G09G3/34
CPC分类号： G09G3/36 , G09G3/2003 , G09G3/3406 , G09G3/3648 , G09G5/04 , G09G5/06 , G09G2300/0452 , G09G2320/0242 , G09G2320/0276 , G09G2340/02 , G09G2340/06 , G09G2360/16
摘要： Disclosed is a display device that (i) converts an input image formed of R, G, and B into a converted image formed of R, G, B, and W to display the converted image and that (ii) compresses the luminance of an input image for the subsequent frame on the basis of an adjustment value C which is corrected in correspondence with the number of, among all pixels in a converted image for the current frame, pixels in a state of luminance saturation and that then converts the input image into a converted image, the display device including a luminance oscillation detecting section (10) for detecting, while input images identical to each other are being inputted each as the above input image, whether converted images corresponding to the respective input images have an oscillating luminance, the display device, in the case where the luminance oscillation detecting section (10) has detected that the converted images have an oscillating luminance, stopping correction of the adjustment value C to fix the adjustment value C to a certain value, thereby preventing the converted images from having an oscillating luminance as a result of oscillation of the adjustment value C.
摘要翻译：公开了一种显示装置，（i）将由R，G和B形成的输入图像转换为由R，G，B和W形成的转换图像，以显示转换的图像，并且（ii）压缩基于对应于当前帧的转换图像中的所有像素中的亮度饱和状态的像素而被校正的调整值C的输入图像，然后将输入图像转换转换成图像的显示装置包括：亮度振荡检测部（10），用于检测输入图像相同的输入图像，作为上述输入图像，每个输入图像的转换图像是否具有振荡亮度在显示装置中，在亮度振荡检测部（10）检测到转换图像具有振荡亮度的情况下，停止将调整值C修正为fi 将调整值C设定为一定值，由此由于调整值C的振荡而使转换图像具有振荡亮度。

8. 发明申请

US20140028657A1 DISPLAY DEVICE AND METHOD FOR DRIVING SAME 有权
标题翻译：显示装置及其驱动方法
公开(公告)号：US20140028657A1
公开(公告)日：2014-01-30
申请号：US14009947
申请日：2012-04-04
申请人： Fumiyuki Kobayashi , Taketoshi Nakano , Asahi Yamato , Kohji Saitoh , Ken Inada , Kohzoh Takahashi , Toshihiro Yanagi
发明人： Fumiyuki Kobayashi , Taketoshi Nakano , Asahi Yamato , Kohji Saitoh , Ken Inada , Kohzoh Takahashi , Toshihiro Yanagi
IPC分类号： G09G3/36
CPC分类号： G09G3/3696 , G09G3/3648 , G09G3/3677 , G09G3/3688 , G09G2310/0248 , G09G2310/0291 , G09G2320/103 , G09G2330/021 , G09G2330/022
摘要： An object of the present invention is to provide (i) a display device which, during a display of a moving image and a still image, reduces electric power consumption without causing a deterioration in display quality, and (ii) a method for displaying the display device. In an intermittent drive mode in which driving and a pause of the driving are repeated, an image identification section (6) identifies an input image (image data (DA)) as a still image or a moving image. In a case where the input image is identified as the moving image, a drive/pause control section (7) generates a drive/pause control signal (DSC) in accordance with a period ratio which is in accordance with the moving image. A timing control section (8) generates a driver control signal so that intermittent driving is carried out. Then, a source driver (3) and a gate driver (4) drives a display section (2) so that the drive period and the pause period are repeated in accordance with a predetermined period ratio, so that the input image (DA) is displayed. The drive/pause control section (7) sets a time ratio between the drive period and the pause period so that the time ratio is variable for each of the moving image and the still image.
摘要翻译：本发明的一个目的是提供一种显示装置，其在运动图像和静止图像的显示期间降低电力消耗而不会导致显示质量的劣化，并且（ii）显示装置显示设备。在重复驱动和暂停的间歇驱动模式中，图像识别部（6）将输入图像（图像数据（DA））识别为静止图像或运动图像。在将输入图像识别为运动图像的情况下，驱动/暂停控制部（7）根据与运动图像相应的周期比来生成驱动/暂停控制信号（DSC）。定时控制部（8）产生驱动控制信号，进行间歇驱动。然后，源驱动器（3）和栅极驱动器（4）驱动显示部（2），使得根据预定周期比重复驱动周期和暂停时段，使得输入图像（DA）为显示。驱动/暂停控制部（7）设定驱动周期和暂停时间之间的时间比，使得运动图像和静止图像中的每一个的时间比是可变的。

9. 发明申请

US20100203206A1 METHOD FOR TREATING FOOD PRODUCTS AND FOOD PRODUCT TREATMENT APPARATUS 审中-公开
标题翻译：食品和食品处理设备的处理方法
公开(公告)号：US20100203206A1
公开(公告)日：2010-08-12
申请号：US12671329
申请日：2008-07-23
申请人： Yasuyoshi Hayata , Fumiyuki Kobayashi
发明人： Yasuyoshi Hayata , Fumiyuki Kobayashi
IPC分类号： A23L3/3418 , A23B7/148 , C12G3/00 , C12C11/11 , C12G1/08
CPC分类号： B01F5/106 , A23B7/148 , A23L3/3418 , B01F3/04503 , B01F3/0876 , B01F2003/04858 , C02F1/685 , C02F2301/066 , C02F2303/04 , C12C11/11 , C12G1/02 , C12H1/14
摘要： For the purpose of simply sterilizing drinking water and food products utilizing carbon dioxide that is in a gaseous state, there is provided a method for treating a food product, which is characterized in that the method comprises allowing microscopic bubbles of carbon dioxide to come into contact with a food product containing microorganisms or enzymes at a pressure of 0.2 to 2 MPa, thereby sterilizing the microorganisms or deactivating the enzymes contained in the food product.
摘要翻译：为了简单地利用处于气态的二氧化碳对饮用水和食品进行消毒，提供了一种处理食品的方法，其特征在于该方法包括使二氧化碳的微小气泡接触含有0.2〜2MPa压力的微生物或酶的食品，从而对微生物进行灭菌或使食品中所含的酶失活。

10. 发明申请

US20060037848A1 Key button structure and portable terminal device therewith 失效
标题翻译：键按钮结构和便携式终端设备
公开(公告)号：US20060037848A1
公开(公告)日：2006-02-23
申请号：US11200085
申请日：2005-08-10
申请人： Fumiyuki Kobayashi
发明人： Fumiyuki Kobayashi
IPC分类号： H01H9/00
CPC分类号： H04M1/7258 , G06F3/0202 , G06F3/0238 , H01H13/83 , H01H2219/02 , H01H2219/028 , H01H2219/03 , H01H2219/039 , H01H2221/07 , H04M1/22
摘要： The present invention provides a key button structure, capable of easily and positively finding a targeted character in accordance with an entry mode preset by a user, comprises: a key top; a light shielding section, which is attached onto rear face of the key top and of which is formed by reversely printing characters assigned to a key button for each character type display area; key backlights, each of which is provided in a dome anchoring sheet for covering a metal dome, and are arranged so as to be divided into three types: key backlights for lighting a numeral display area, a kana character display area, and an alphabetical letter display area respectively. For example, with a numeral entry mode preset, only the key backlight for lighting the numeral display area is lighted, thus displaying only a required numeral bright in the number entry mode.
摘要翻译：本发明提供一种键按钮结构，能够根据用户预先设定的输入模式容易且积极地发现目标人物，包括：键顶; 遮光部，其安装在键顶的后表面上，并且通过反转打印分配给每个字符型显示区域的按键的字符而形成; 关键背光灯，其中每个都设置在用于覆盖金属圆顶的圆顶锚固片材中，并且被布置成被分为三种类型：用于点亮数字显示区域的钥匙背光灯，假名字符显示区域和字母字母显示区域。例如，在数字输入模式被预先设定的情况下，只有点亮数字显示区域的按键背光灯被点亮，从而在数字输入模式中只显示所需的数字亮。

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