专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06264061B1 Electronic component supply apparatus 失效
标题翻译：电子元件供应装置
公开(公告)号：US06264061B1
公开(公告)日：2001-07-24
申请号：US09243790
申请日：1999-02-03
申请人： Kikuji Fukai , Koji Saito , Taro Yasuda , Yutaka Aikawa
发明人： Kikuji Fukai , Koji Saito , Taro Yasuda , Yutaka Aikawa
IPC分类号： B23Q712
CPC分类号： H05K13/028
摘要： A supply apparatus for prism-shaped chip components has two relatively movable taking-in members. When the members move relative to each other, flat surfaces thereof contact each other and a parallel space is formed between the upper portions of the two taking-in members. Relative movement of the two talking-in members causes the components in a storage chamber to enter the parallel space between the upper portions of the two taking-in members. The components entering the parallel space have the same thickness-wise orientation and are lengthwise in a supply passageway in a one by one in a state. The components move downward by gravity in the supply passageway and then in a discharge passageway.
摘要翻译：用于棱柱形芯片部件的供应装置具有两个相对可移动的接纳部件。当构件相对于彼此移动时，其平坦表面彼此接触，并且在两个取入构件的上部之间形成平行的空间。两个通话部件的相对运动导致存储室中的部件进入两个取入部件的上部之间的平行空间。进入平行空间的部件具有相同的厚度方向，并且在一个一个状态下在供给通道中纵向延伸。部件通过供给通道中的重力向下移动，然后在排放通道中移动。

2. 发明授权

US06250455B1 Method and apparatus for supplying electronic components 失效
标题翻译：电子元件供应方法及装置
公开(公告)号：US06250455B1
公开(公告)日：2001-06-26
申请号：US09553178
申请日：2000-04-20
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： B65G4714
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.
摘要翻译：公开了一种芯片部件供应装置。芯片部件供给装置包括用于沿随机方向存储芯片部件的存储室。放电通道允许储存室中的芯片部件沿预定方向向下移动。输送通道输送从排出通道排出的芯片部件，并且其中排出通道在其下部具有倾斜部分，并且排出通道中的切屑部件通过倾斜部分排出到输送通道。

3. 发明授权

US06371276B1 Method and apparatus for supplying chip parts 有权
公开(公告)号：US06371276B1
公开(公告)日：2002-04-16
申请号：US09859477
申请日：2001-05-18
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： B65G4714
摘要： A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.

4. 发明授权

US6102188A Method for supplying chip parts 失效
标题翻译：供应芯片部件的方法
公开(公告)号：US6102188A
公开(公告)日：2000-08-15
申请号：US141620
申请日：1998-08-27
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： H05K13/02 , H05K13/04 , B65G47/26
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.
摘要翻译：随机方向积累的电子芯片由芯片部件供应商以有序的方式布置。芯片部件馈送器将第一对准芯片传送到印刷电路板上。在料斗中具有随机方向的芯片部件被输送到排出通道，该排放通道以规定的方向组织并且在通过带子沿预定方向运送之前通过通道底端被排出到输送带之前通过排出通道传送。在第一芯片和下一个芯片之间强制导致的间隙在第一个芯片拾取之前完全分离了两个芯片。这样分离的第一芯片部分在被传送到印刷电路板之前被吸头拾取。

5. 发明授权

US5636725A Apparatus for supplying chip parts and a method for same 失效
标题翻译：用于供应芯片部件的装置及其方法
公开(公告)号：US5636725A
公开(公告)日：1997-06-10
申请号：US444107
申请日：1995-05-18
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： H05K13/02 , H05K13/04 , B65G47/14
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.
摘要翻译：随机方向积累的电子芯片由芯片部件供应商以有序的方式布置。芯片部件馈送器将第一对准芯片传送到印刷电路板上。在料斗中具有随机方向的芯片部件被输送到排出通道，该排放通道以规定的方向组织并且在通过带子沿预定方向运送之前通过通道底端被排出到输送带之前通过排出通道传送。在第一芯片和下一个芯片之间强制导致的间隙在第一个芯片拾取之前完全分离了两个芯片。这样分离的第一芯片部分在被传送到印刷电路板之前被吸头拾取。

6. 发明授权

US06195876B1 Electronic component placing apparatus 有权
标题翻译：电子元件放置装置
公开(公告)号：US06195876B1
公开(公告)日：2001-03-06
申请号：US09262745
申请日：1999-03-05
申请人： Kazushige Koyama , Kikuji Fukai , Kiyoshi Murase , Masaru Aoki , Taro Yasuda , Koji Saito
发明人： Kazushige Koyama , Kikuji Fukai , Kiyoshi Murase , Masaru Aoki , Taro Yasuda , Koji Saito
IPC分类号： B23P1900
CPC分类号： H05K13/0452 , H05K13/028 , Y10T29/5155 , Y10T29/519 , Y10T29/53178 , Y10T29/53478
摘要： In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.
摘要翻译：在电子部件放置装置中，四个杂志安装在头部上，但是电子部件被容纳在每个盒中。在该装置中，通过将吸嘴选择性地插入到盒中的四个插入口中的操作，可以将所需的电子部件装载在基板上，并且可以重复执行该部件加载，直到被容纳的部件被排出。

7. 发明授权

US5836437A Apparatus for supplying chip parts and a method for same 失效
标题翻译：用于供应芯片部件的装置及其方法
公开(公告)号：US5836437A
公开(公告)日：1998-11-17
申请号：US821939
申请日：1997-03-21
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： H05K13/02 , H05K13/04 , B65G47/44
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.
摘要翻译：随机方向积累的电子芯片由芯片部件供应商以有序的方式布置。芯片部件馈送器将第一对准芯片传送到印刷电路板上。在料斗中具有随机方向的芯片部件被输送到排出通道，该排放通道以规定的方向组织并且在通过带子沿预定方向运送之前通过通道底端被排出到输送带之前通过排出通道传送。在第一芯片和下一个芯片之间强制导致的间隙在第一个芯片拾取之前完全分离了两个芯片。这样分离的第一芯片部分在被传送到印刷电路板之前被吸头拾取。

8. 发明授权

US4783006A Mist supplying device for forming thin film 失效
标题翻译：用于形成薄膜的雾化供应装置
公开(公告)号：US4783006A
公开(公告)日：1988-11-08
申请号：US068466
申请日：1987-06-30
申请人： Yutaka Hayashi , Atuo Itoh , Hideyo Iida , Kikuji Fukai
发明人： Yutaka Hayashi , Atuo Itoh , Hideyo Iida , Kikuji Fukai
IPC分类号： B05B17/04 , C23C4/12 , C23C18/12 , B05B1/00 , B05B1/34
CPC分类号： C23C4/12
摘要： A mist supplying device for supplying a film-forming solution to form a thin film on a substrate includes a nozzle having an elongate outlet port, an atomizer coupled to the nozzle for atomizing the film-forming solution, and a disperser movably disposed in the nozzle between the outlet port and the atomizer and having a plurality of substantially uniformly distributed mist passages for passing the atomized film-forming solution in a first flow passage direction therethrough. An air blower is coupled to the atomizer for delivering the atomized film-forming solution into the nozzle. A driver unit is coupled to the disperser for reciprocally moving the mist passages in a second flow passage direction transverse to the first flow passage direction.
摘要翻译：用于供给成膜溶液以在基材上形成薄膜的雾供应装置包括具有细长出口的喷嘴，与喷嘴连接的用于雾化成膜溶液的雾化器和可移动地设置在喷嘴中的分散器在所述出口和所述雾化器之间具有多个基本上均匀分布的雾通道，用于使所述雾化膜形成溶液沿第一流动通道方向通过。鼓风机与雾化器连接，用于将雾化的成膜溶液输送到喷嘴中。驱动器单元联接到分散器，用于在与第一流动通道方向横切的第二流动通道方向上往复移动雾气通道。

9. 发明授权

US4914809A Chip mounting apparatus 失效
标题翻译：芯片安装装置
公开(公告)号：US4914809A
公开(公告)日：1990-04-10
申请号：US307899
申请日：1989-02-07
申请人： Kikuji Fukai , Takahiro Tanaka , Makoto Mineno
发明人： Kikuji Fukai , Takahiro Tanaka , Makoto Mineno
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K13/0482 , Y10T29/53178 , Y10T29/53191 , Y10T29/53261
摘要： An apparatus featuring a suction head assembly for transferring a set of chips from a template assembly to a printed circuit board. In order to make the suction head assembly readily adaptable for mounting the chips in any of numerous different arrangements on circuit boards, a planar head carrier is provided which has a multiplicity of mounting holes formed therein in columns and rows. A set of suction heads can be mounted to the head carrier in any desired arrangement, corresponding to the desired chip arrangement on the circuit board, by having their holders removably engaged in selected ones of the array of mounting holes in the head carrier. The template assembly is likewise made adaptable for a variety of chip arrangements, by having a set of open-top positioning vessels removably engaged in selected ones of an array of mounting holes formed in a template.

10. 发明授权

US4868979A Method of and apparatus for mounting chips 失效
标题翻译：安装芯片的方法和装置
公开(公告)号：US4868979A
公开(公告)日：1989-09-26
申请号：US294759
申请日：1989-01-06
申请人： Hiroshi Fukushima , Kikuji Fukai
发明人： Hiroshi Fukushima , Kikuji Fukai
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/0482 , Y10T29/49144 , Y10T29/53178
摘要： A method of mounting chips on a circuit board having a plurality of divided regions provided thereon comprising the steps of: forcibly delivering chips housed bulky in a housing container composed of a plurality of containers by delivering means to housing recesses provided on a template in positions corresponding to positions where the chips are mounted on the circuit board; moving a chip transfer means over the circuit board, the transferring means provided for transferring the chips housed in the housing recesses to the circuit board while the chips are held in same positions as they are delivered by the guide means; loading the circuit board on a base; and shifting the circuit board successively along multiple divided regions provided on the circuit board to the position of the housing recesses by means of a chip shifting means so that the chips can be mounted on the multiple divided regions. The apparatus for carrying out the method is disclosed.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式