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1. 发明授权

US06655547B2 Chip component take-in apparatus 失效
公开(公告)号：US06655547B2
公开(公告)日：2003-12-02
申请号：US09924844
申请日：2001-08-09
申请人： Koji Saito , Taro Yasuda , Hiroyuki Matsui
发明人： Koji Saito , Taro Yasuda , Hiroyuki Matsui
IPC分类号： B65G4724
CPC分类号： H05K13/028
摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

2. 发明授权

US06290095B1 Chip component take-in apparatus 失效
公开(公告)号：US06290095B1
公开(公告)日：2001-09-18
申请号：US09571264
申请日：2000-05-15
申请人： Koji Saito , Taro Yasuda , Hiroyuki Matsui
发明人： Koji Saito , Taro Yasuda , Hiroyuki Matsui
IPC分类号： B65H500
CPC分类号： H05K13/028
摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

3. 发明授权

US06250455B1 Method and apparatus for supplying electronic components 失效
标题翻译：电子元件供应方法及装置
公开(公告)号：US06250455B1
公开(公告)日：2001-06-26
申请号：US09553178
申请日：2000-04-20
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： B65G4714
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： A chip component supplying apparatus is disclosed. The chip component supplying apparatus includes a storage chamber for storing chip components in random directions. A discharge channel allows the chip components in the storage chamber to move downward in a predetermined direction. A conveying channel conveys the chip components discharged from the discharge channel and wherein the discharge channel has an inclined portion at a lower part thereof and the chip components in the discharge channel are discharged to the conveying channel through the inclined portion.
摘要翻译：公开了一种芯片部件供应装置。芯片部件供给装置包括用于沿随机方向存储芯片部件的存储室。放电通道允许储存室中的芯片部件沿预定方向向下移动。输送通道输送从排出通道排出的芯片部件，并且其中排出通道在其下部具有倾斜部分，并且排出通道中的切屑部件通过倾斜部分排出到输送通道。

4. 发明授权

US06131725A Belt for conveying chip components, and method of manufacturing the same 失效
标题翻译：用于输送芯片部件的带及其制造方法
公开(公告)号：US06131725A
公开(公告)日：2000-10-17
申请号：US47507
申请日：1998-03-25
申请人： Koji Saito , Taro Yasuda
发明人： Koji Saito , Taro Yasuda
IPC分类号： B65G15/30 , B65G15/34 , B65G15/42 , H01L21/677 , H05K13/02 , B65G13/02 , B65G17/46 , B65G25/00 , B65G29/00
CPC分类号： H01L21/67706 , H01L21/67721
摘要： A chip component conveyor belt of the present invention comprises an endless timing belt having a plurality of teeth at predetermined intervals on its back surface. Wherein a height of the teeth is made uniform by polishing or grinding the tip of each tooth. Thus, there arises no variation of surface height of the endless timing belt even when any tooth of the endless timing belt meshes a timing pulley, or even when the endless timing belt is supported by a belt guide member.
摘要翻译：本发明的芯片部件传送带包括在其后表面上以预定间隔具有多个齿的环形同步皮带。其中通过抛光或研磨每个牙齿的尖端使齿的高度均匀。因此，即使当环形同步带的任何齿啮合正时皮带轮时，或甚至当环形同步皮带由皮带引导部件支撑时，也不会产生环形同步带的表面高度的变化。

5. 发明授权

US06443326B1 Electronic component feeding apparatus 失效
标题翻译：电子元件供给装置
公开(公告)号：US06443326B1
公开(公告)日：2002-09-03
申请号：US09927521
申请日：2001-08-13
申请人： Koji Saito , Taro Yasuda
发明人： Koji Saito , Taro Yasuda
IPC分类号： B23Q712
CPC分类号： B65G47/1407 , B23P19/001 , B23P19/004 , H05K13/028
摘要： A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure. A component separating mechanism separates the foremost chip component from the succeeding chip components by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the foremost chip component in the liner passage, or by operating a component separating member through the air actuator by the inhaling pressure or the discharging pressure.
摘要翻译：部件传送机构通过将气囊或气缸的吸入压力或排出压力直接施加在衬套通道中的芯片部件上，或者通过空气致动器操作部件传递部件，通过空气致动器吸入压力或排放压力。组件取入机构通过将气囊或气缸的吸入压力或排气压力直接施加到储存室中的芯片部件，或者通过操作将芯片部件搅拌在储存室中并将其送入进料通道通过吸入压力或排出压力通过空气致动器的部件搅拌构件。部件分离机构通过将气囊或气缸的吸入压力或排出压力直接施加到衬套通道中的最前面的芯片部件上，或者通过操作部件分离部件通过空气致动器由吸入压力或排出压力。

6. 发明授权

US06296104B1 Electronic component feeding apparatus 有权
标题翻译：电子元件供给装置
公开(公告)号：US06296104B1
公开(公告)日：2001-10-02
申请号：US09207578
申请日：1998-12-08
申请人： Tatsuichi Ito , Koji Saito , Taro Yasuda
发明人： Tatsuichi Ito , Koji Saito , Taro Yasuda
IPC分类号： B65G4714
CPC分类号： H05K13/028
摘要： An electronic component feeding apparatus for separating a foremost electronic component conveyed to a predetermined takeout position from a succeeding electronic component, wherein, the separating device includes a first component stopper, a second component stopper projecting from the first component stopper and having a magnetic attractive force at a tip end thereof for separating a foremost electronic component. The second component stopper is movable within the first component stopper between a retracted and a protruding position so that the foremost electronic component engages both the first and second component stoppers during separation from a succeeding electronic component.
摘要翻译：一种电子部件供给装置，用于将输送到预定取出位置的最前面的电子部件与后续的电子部件分离，其中，所述分离装置包括第一部件止动件，从所述第一部件止动件突出并具有磁性吸引力的第二部件止动件在其末端用于分离最前面的电子部件。第二部件止动件可在第一部件止动件之间在缩回位置和突出位置之间移动，使得最前面的电子部件在与后续电子部件分离期间接合第一和第二部件止动件。

7. 发明授权

US06253902B1 Electronic component supplying apparatus 失效
标题翻译：电子元件供给装置
公开(公告)号：US06253902B1
公开(公告)日：2001-07-03
申请号：US09676246
申请日：2000-09-29
申请人： Koji Saito , Taro Yasuda
发明人： Koji Saito , Taro Yasuda
IPC分类号： B65G4744
CPC分类号： H05K13/028
摘要： An electronic component supplying apparatus conveys electronic components in an aligned state to supply the same to a predetermined taking-out position. When a leading chip component abuts on a component stopper and a component conveyance is stopped, a plurality of the chip components including the leading chip component are covered in a non-contacting state by a slider, the leading chip component which has abutted on the component stopper is attracted to the component stopper. In a state where the component conveyance by the conveying path is stopped, the component stopper is displaced in a component conveying direction, the leading chip component is separated from a second leading chip component, and also the slider is displaced in a direction opposite to the component conveying direction, so that the slider covering is uncovered, and the leading chip component is allowed to be taken out.
摘要翻译：电子部件供给装置以对准状态传送电子部件，将其供给到规定的取出位置。当前置芯片部件与部件止动件抵接并且部件输送停止时，包括前置芯片部件的多个芯片部件通过滑块以非接触状态被覆盖，所述前置芯片部件与部件塞子被吸引到部件塞子上。在通过输送路径的部件输送停止的状态下，部件止动件在部件输送方向上移位，前置芯片部件与第二引导芯片部件分离，并且滑块在与部件输送方向，使得滑块盖不被覆盖，并且允许引导芯片部件被取出。

8. 发明授权

US06195876B1 Electronic component placing apparatus 有权
标题翻译：电子元件放置装置
公开(公告)号：US06195876B1
公开(公告)日：2001-03-06
申请号：US09262745
申请日：1999-03-05
申请人： Kazushige Koyama , Kikuji Fukai , Kiyoshi Murase , Masaru Aoki , Taro Yasuda , Koji Saito
发明人： Kazushige Koyama , Kikuji Fukai , Kiyoshi Murase , Masaru Aoki , Taro Yasuda , Koji Saito
IPC分类号： B23P1900
CPC分类号： H05K13/0452 , H05K13/028 , Y10T29/5155 , Y10T29/519 , Y10T29/53178 , Y10T29/53478
摘要： In an electronic component placing apparatus, four magazines are mounted on a head, and yet electronic components are housed in each magazine. In this apparatus, by an operation of selectively inserting a suction nozzle into four insertion openings in the magazines, it is possible to load a desired electronic component on a substrate, and this component loading can be repeatedly performed until the housed components are exhausted.
摘要翻译：在电子部件放置装置中，四个杂志安装在头部上，但是电子部件被容纳在每个盒中。在该装置中，通过将吸嘴选择性地插入到盒中的四个插入口中的操作，可以将所需的电子部件装载在基板上，并且可以重复执行该部件加载，直到被容纳的部件被排出。

9. 发明授权

US5836437A Apparatus for supplying chip parts and a method for same 失效
标题翻译：用于供应芯片部件的装置及其方法
公开(公告)号：US5836437A
公开(公告)日：1998-11-17
申请号：US821939
申请日：1997-03-21
申请人： Koji Saito , Kikuji Fukai , Taro Yasuda
发明人： Koji Saito , Kikuji Fukai , Taro Yasuda
IPC分类号： H05K13/02 , H05K13/04 , B65G47/44
CPC分类号： B65G47/145 , H05K13/022 , H05K13/028 , H05K13/0417
摘要： Electronic chips accumulated at random directions are arranged in an orderly line by a chip part supplier. A chip part feeder transfers the first aligned chip onto a printed circuit board. Chip parts having random directions in a hopper are fed to a discharge channel, organized in a prescribed direction and transferred through the discharge channel before being discharged through the channel bottom end onto a conveying belt before being carried by the belt in a prescribed direction. A clearance forcefully caused between the first chip and next chip separates the two chips completely just before the first chip is picked up. The thus separated first chip part is picked up by a suction head before being transferred to the printed circuit board.
摘要翻译：随机方向积累的电子芯片由芯片部件供应商以有序的方式布置。芯片部件馈送器将第一对准芯片传送到印刷电路板上。在料斗中具有随机方向的芯片部件被输送到排出通道，该排放通道以规定的方向组织并且在通过带子沿预定方向运送之前通过通道底端被排出到输送带之前通过排出通道传送。在第一芯片和下一个芯片之间强制导致的间隙在第一个芯片拾取之前完全分离了两个芯片。这样分离的第一芯片部分在被传送到印刷电路板之前被吸头拾取。

10. 发明授权

US06283325B1 Electronic component moving mechanism 有权
标题翻译：电子元件移动机构
公开(公告)号：US06283325B1
公开(公告)日：2001-09-04
申请号：US09207116
申请日：1998-12-08
申请人： Koji Saito , Taro Yasuda
发明人： Koji Saito , Taro Yasuda
IPC分类号： B65H360
CPC分类号： B65G47/1407 , B23P19/001 , B23P19/004 , H05K13/028
摘要： A component transfer mechanism transfers chip components along a liner passage by applying an inhaling pressure or a discharging pressure of an air bag or an air cylinder directly to the chip components in the liner passage, or by operating a component transfer member through an air actuator by the inhaling pressure or the discharging pressure. A component take-in mechanism stirs chip components in a storage chamber and takes them into a feeding passage by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the chip components in the storage chamber, or by operating a component stirring member through the air actuator by the inhaling pressure or the discharging pressure. A component separating mechanism separates the foremost chip component from the succeeding chip components by applying the inhaling pressure or the discharging pressure of the air bag or the air cylinder directly to the foremost chip component in the liner passage, or by operating a component separating member through the air actuator by the inhaling pressure or the discharging pressure.
摘要翻译：部件传送机构通过将气囊或气缸的吸入压力或排出压力直接施加在衬套通道中的芯片部件上，或者通过空气致动器操作部件传递部件，通过空气致动器吸入压力或排放压力。组件取入机构通过将气囊或气缸的吸入压力或排气压力直接施加到储存室中的芯片部件，或者通过操作将芯片部件搅拌在储存室中并将其送入进料通道通过吸入压力或排出压力通过空气致动器的部件搅拌构件。部件分离机构通过将气囊或气缸的吸入压力或排出压力直接施加到衬套通道中的最前面的芯片部件上，或者通过操作部件分离部件通过空气致动器由吸入压力或排出压力。

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