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    • 2. 发明授权
    • Silver halide photographic material
    • 卤化银照相材料
    • US4830950A
    • 1989-05-16
    • US3341
    • 1987-01-14
    • Kenichi KuwabaraToshiro TakahashiKeiichi AdachiMasahiro Okada
    • Kenichi KuwabaraToshiro TakahashiKeiichi AdachiMasahiro Okada
    • G03C1/06G03C1/035G03C1/16G03C1/36G03C1/83
    • G03C1/832Y10S430/15
    • A silver halide photographic material comprising a support having thereon at least one silver halide emulsion layer; wherein said emulsion layer comprises a silver chloride emulsion or a silver chlorobromide emulsion containing 90 mol % or more silver chloride, which is prepared in the presence of a water-soluble rhodium salt in an amount of 1.times.10.sup.-7 to 2.times.10.sup.-5 mol per mol of silver halide; and wherein at least one of said emulsion layer and hydrophilic colloidal layers of said material contains a dye compound represented by formula (I) ##STR1## wherein: R.sub.1 represents an alkyl group, an alkoxy group, a hydroxy group, an amino group, a substituted amino group, an alkoxycarbonyl group, a carboxy group, a cyano group, a carbamoyl group, a sulfamoyl group, an ureido group, a thioureido group, an acylamido group, a sulfonamido group or a phenyl group, Q represents a sulfoalkyl group, a sulfoalkoxyalkyl group, or an aryl group having at least one sulfo group; R.sub.2 represents a hydrogen atom, an alkyl group, an alkoxy group, a hydroxy group or a halogen atom, and R.sub.3 and R.sub.4, which may be the same or different, each represents an alkyl group or a substituted alkyl group, or when taken together, R.sub.3 and R.sub.4 may form a 5- to 6-membered ring, provided that R.sub.1, R.sub.3, and R.sub.4 do not represent a methyl group at the same time.
    • 一种卤化银照相材料,包括其上具有至少一个卤化银乳剂层的载体; 其中所述乳剂层包含氯化银乳剂或含有90mol%或更多氯化银的氯化银氯化银乳液,其在水溶性铑盐的存在下制备,其量为1×10 -7至2×10 -5 mol / mol 的卤化银; 并且其中所述材料的所述乳剂层和亲水胶体层中的至少一个含有由式(I)表示的染料化合物其中:R 1表示烷基,烷氧基,羟基,氨基 基团,取代氨基,烷氧基羰基,羧基,氰基,氨基甲酰基,氨磺酰基,脲基,硫脲基,酰氨基,亚磺酰氨基或苯基,Q表示 磺基烷基,磺基烷氧基烷基或具有至少一个磺基的芳基; R 2表示氢原子,烷基,烷氧基,羟基或卤素原子,R 3和R 4可以相同或不同,表示烷基或取代的烷基,或者一起 R 3和R 4可以形成5-至6-元环,条件是R 1,R 3和R 4不同时表示甲基。
    • 4. 发明授权
    • Silver halide photographic materials
    • 卤化银照相材料
    • US4286044A
    • 1981-08-25
    • US176442
    • 1980-08-08
    • Yuji MiharaHaruo TakeiNoriyuki InoueTadashi IkedaKenichi Kuwabara
    • Yuji MiharaHaruo TakeiNoriyuki InoueTadashi IkedaKenichi Kuwabara
    • G03C1/28G03C1/29G03C1/08
    • G03C1/29
    • A lith-type silver halide photographic material having high sensitivity and providing good dot quality images comprising a support having coated thereon a silver halide emulsion containing a sensitizing dye of dimethine merocyanine type represented by formula (I) and a sensitizing dye represented by formula (II): ##STR1## wherein R.sub.1 represents a sulfoalkyl group, a carboxyalkyl group, a sulfoaralkyl group, or a carboxyaralkyl group; the alkyl moiety of each alkyl group contains up to 4 carbon atoms; R.sub.2 represents a substituted or unsubstituted alkyl group or an aryl group; R.sub.3 represents --(CH.sub.2).sub.n.sbsb.1 CONH(CH.sub.2).sub.m.sbsb.1 OH or --(CH.sub.2).sub.n.sbsb.2 O(CH.sub.2).sub.m.sbsb.2 OH (wherein m.sub.1, m.sub.2, n.sub.1, and n.sub.2 each is 1 to 7; m.sub.1 +n.sub.1 and m.sub.2 +n.sub.2 each is 8 or less); W represents a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group, an alkoxy group or a substituted or unsubstituted phenyl group; ##STR2## wherein Z represents a non-metallic atomic group necessary to complete a thiazolidine ring or a 4-thiazoline ring; R.sub.4 and R.sub.5 each represent a substituted or unsubstituted alkyl group, an allyl group, or a substituted or unsubstituted phenyl group; at least one of R.sub.4 and R.sub.5 being a sulfoalkyl group or a carboxyalkyl group; and R.sub.6 represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted phenyl group.
    • 一种具有高灵敏度并且提供良好的点质量图像的锂离子型卤化银照相材料,其包含其上涂覆有包含式(I)表示的二甲亚砜部花青型敏化染料的卤化银乳剂的支持体和由式(II)表示的增感染料 ):其中R1表示磺基烷基,羧基烷基,磺基烷基或羧基烷基的(Ⅰ)化合物。 每个烷基的烷基部分含有至多4个碳原子; R2表示取代或未取代的烷基或芳基; R3表示 - (CH2)n1CONH(CH2)m1OH或 - (CH2)n2O(CH2)m2OH(其中m1,m2,n1和n2各自为1至7; m1 + n1和m2 + n2分别为8或更小) ; W表示氢原子,卤素原子,取代或未取代的烷基,烷氧基或取代或未取代的苯基; (II)其中Z表示完成噻唑烷环所需的非金属原子团或4-噻唑啉环; R4和R5各自表示取代或未取代的烷基,烯丙基或取代或未取代的苯基; R4和R5中的至少一个是磺基烷基或羧基烷基; R6表示氢原子,取代或未取代的烷基或取代或未取代的苯基。
    • 6. 发明授权
    • Dry etching method
    • 干蚀刻法
    • US08143175B2
    • 2012-03-27
    • US12435787
    • 2009-05-05
    • Satoshi UneMasamichi SakaguchiKenichi KuwabaraTomoyoshi Ichimaru
    • Satoshi UneMasamichi SakaguchiKenichi KuwabaraTomoyoshi Ichimaru
    • H01L21/31
    • H01L21/32139H01L21/0338H01L21/28123H01L21/31116H01L21/32137
    • The invention provides a dry etching method for performing a wiring process on a semiconductor substrate using a plasma etching apparatus, wherein the wiring process is performed without causing disconnection or deflection of the wiring. The invention provides a dry etching method for performing a wiring process on a semiconductor substrate using a plasma etching apparatus, wherein during a step for etching a material 12 to be etched using a mask pattern composed of a photoresist 15 and inorganic films 14 and 13 made of SiN, SiON, SiO and the like formed on the material 12 to be etched, a mixed gas formed of a halogen-based gas such as chlorine-containing gas or bromine-containing gas and at least one fluorine-containing gas selected from a group of fluorine-containing gases composed of CF4, CHF3, SF6 and NF3 is used to reduce the mask pattern and the processing dimension of the material to be etched substantially equally during processing of the material 12 to be etched.
    • 本发明提供了一种用于使用等离子体蚀刻装置在半导体衬底上进行布线处理的干蚀刻方法,其中进行布线处理而不引起布线的断开或偏转。 本发明提供一种使用等离子体蚀刻装置对半导体衬底进行布线处理的干式蚀刻方法,其中在使用由光致抗蚀剂15和无机膜14和13构成的掩模图案来蚀刻要蚀刻的材料12的步骤期间, 在被蚀刻材料12上形成的SiN,SiON,SiO等,由含氯气体或含溴气体的卤素系气体形成的混合气体和至少一种选自 使用由CF4,CHF3,SF6和NF3组成的含氟气体组,在待蚀刻材料12的加工期间,基本上相同地减少掩模图案和待蚀刻材料的加工尺寸。
    • 9. 发明授权
    • Vacuum processing apparatus and vacuum processing method
    • 真空加工设备和真空加工方法
    • US07112805B2
    • 2006-09-26
    • US10875231
    • 2004-06-25
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • Yoshitaka KaiKenichi KuwabaraTakeo UchinoYasuhiro NishimoriTakeshi OonoTakeshi Shimada
    • G01F23/00G01K5/08
    • H01L21/67207H01L21/67167
    • The invention provides a semiconductor fabrication apparatus capable of preventing increase of carriage time of samples, deterioration of sample output, increase of footprint and increase of investment costs. The vacuum processing apparatus comprises a plurality of vacuum processing chambers for subjecting a sample to vacuum processing; a vacuum carriage for carrying the sample into and out of the vacuum processing chamber; a switchable chamber capable of being switched between atmosphere and vacuum for carrying the sample into and out of the vacuum processing chamber; a cassette support for supporting a plurality of cassettes and a controller for controlling carrying of the sample from a cassette through the switchable chambers, the vacuum carriage means into and out of the vacuum processing chamber. The vacuum processing chamber is equipped with an etching chamber and a critical dimension measurement chamber for critical dimension inspection of the sample.
    • 本发明提供一种半导体制造装置,其能够防止样品的携带时间增加,样品输出的劣化,占地面积的增加和投资成本的增加。 真空处理装置包括用于对样品进行真空处理的多个真空处理室; 用于将样品进入和离开真空处理室的真空托架; 能够在大气和真空之间切换以将样品进出真空处理室的可切换室; 用于支撑多个盒的盒支撑件和控制器,用于控制样品从盒通过可切换室的携带,真空托架装置进入和离开真空处理室。 真空处理室配有蚀刻室和临界尺寸测量室,用于对样品进行临界尺寸检验。
    • 10. 发明申请
    • DRY ETCHING METHOD
    • 干蚀刻方法
    • US20100285669A1
    • 2010-11-11
    • US12512103
    • 2009-07-30
    • Takeshi SHIMAKenichi KuwabaraTomoyoshi IchimaruKenji Imamoto
    • Takeshi SHIMAKenichi KuwabaraTomoyoshi IchimaruKenji Imamoto
    • H01L21/3065
    • H01L21/32139H01L21/02071H01L21/02115H01L21/02274
    • After etching a polysilicon film, when a protective film made of a carbon polymer is formed on a sidewall of the polysilicon film using plasma containing carbons, a metallic material as a lower film is etched using plasma containing a halogen gas under an etching condition in which volatility is improved due to the rise in a wafer temperature or the low pressure of a processing pressure, thereby preventing a side etching and unevenness of a sidewall of the polysilicon film. Further, by using the protective film made of a carbon polymer, metallic substances scattered at the time of etching the metallic material are not directly attached to the polysilicon film, but can be simply removed along with the protective film made of a carbon polymer in an asking step.
    • 在蚀刻多晶硅膜之后,当使用含有碳的等离子体在多晶硅膜的侧壁上形成由碳聚合物制成的保护膜时,在蚀刻条件下,使用含有卤素气体的等离子体蚀刻作为下部膜的金属材料,其中 由于晶片温度的上升或处理压力的低压,挥发性提高,从而防止多晶硅膜的侧壁蚀刻和不均匀。 此外,通过使用由碳聚合物制成的保护膜,在蚀刻金属材料时分散的金属物质不直接附着在多晶硅膜上,而是可以简单地与由碳聚合物制成的保护膜一起除去 问一步