会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • RC Extraction Methodology for Floating Silicon Substrate with TSV
    • 具有TSV的浮动硅衬底的RC提取方法
    • US20130139121A1
    • 2013-05-30
    • US13366756
    • 2012-02-06
    • Ze-Ming WuChing-Shun YangKe-Ying SuHsiao-Shu Chao
    • Ze-Ming WuChing-Shun YangKe-Ying SuHsiao-Shu Chao
    • G06F17/50
    • G06F17/5036G06F17/5068
    • The present disclosure relates to methods and apparatuses for generating a through-silicon via (TSV) model for RC extraction that accurately models an interposer substrate comprising one or more TSVs. In some embodiments, a method is performed by generating an interposer wafer model having a sub-circuit that models a TSV. The sub-circuit can compensate for limitations in resistive and capacitive extraction of traditional TSV models performed by EDA tools. In some embodiments, the sub-circuit is coupled to a floating common node of the model. The floating common node enables the interposer wafer model to take into consideration capacitive coupling within the interposer. The improved interposer wafer model enables accurate RC extraction of an interposer with one or more TSVs, thereby providing for an interposer wafer model that is consistent between GDS and APR flows.
    • 本公开涉及用于产生用于RC提取的穿硅通孔(TSV)模型的方法和装置,其精确地对包括一个或多个TSV的插入器衬底进行建模。 在一些实施例中,通过产生具有对TSV进行建模的子电路的插入器晶片模型来执行方法。 子电路可以补偿由EDA工具执行的传统TSV模型的电阻和电容提取的限制。 在一些实施例中,子电路耦合到模型的浮动公共节点。 浮动公共节点使得插入器晶片模型能够考虑插入器内的电容耦合。 改进的插入器晶片模型使得能够利用一个或多个TSV对插入件进行精确的RC提取,由此提供在GDS和APR流之间一致的插入器晶片模型。
    • 7. 发明授权
    • Semiconductor device design method, system and computer-readable medium
    • 半导体器件设计方法,系统和计算机可读介质
    • US08707245B2
    • 2014-04-22
    • US13406108
    • 2012-02-27
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50G06F11/22
    • G06F17/5081G03F7/00G06F17/5036G06F2217/82
    • In a semiconductor device design method performed by at least one processor, first and second electrical components are extracted from a layout of a semiconductor device. The semiconductor device has a semiconductor substrate and the first and second electrical components in the semiconductor substrate. Parasitic parameters of a coupling in the semiconductor substrate between the first and second electrical components are extracted using a first tool. Intrinsic parameters of the first and second electrical components are extracted using a second tool different from the first tool. The extracted parasitic parameters and intrinsic parameters are combined into a model of the semiconductor device. The parasitic parameters of the coupling are extracted based on a model of the coupling included in the second tool.
    • 在由至少一个处理器执行的半导体器件设计方法中,从半导体器件的布局中提取第一和第二电子部件。 半导体器件具有半导体衬底和半导体衬底中的第一和第二电子部件。 使用第一工具提取第一和第二电气部件之间的半导体衬底中的耦合的寄生参数。 使用与第一工具不同的第二工具提取第一和第二电气部件的固有参数。 提取的寄生参数和固有参数被组合成半导体器件的模型。 基于包括在第二工具中的耦合模型,提取耦合的寄生参数。
    • 8. 发明授权
    • Discrete device modeling
    • 离散设备建模
    • US08694938B2
    • 2014-04-08
    • US13534526
    • 2012-06-27
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • G06F17/50
    • G06F17/5036
    • Among other things, one or more techniques and/or systems are provided for modeling a discrete device as a macro device. That is, the discrete device can comprise one or more parasitic elements, such as parasitic resistances and/or capacitances. Because values of the parasitic elements are unknown during pre-simulation of the discrete device, the discrete device can be modeled as a macro device, which can be used during pre-simulation to take into account the parasitic elements. For example, specified parameters, such as channel length, can be used to obtain a set of RC values that specify predicted values for the one or more parasitic elements of the discrete device. The discrete device can be modeled as the macro device using the set of RC values. In this way, the macro device can be used during pre-simulation to take into account the parasitic effects of parasitic elements of the discrete device.
    • 除其他之外,提供一个或多个技术和/或系统用于将分立设备建模为宏设备。 也就是说,分立器件可以包括一个或多个寄生元件,例如寄生电阻和/或电容。 由于寄生元件的值在分立器件的预仿真期间是未知的,所以可将分立器件建模为宏器件,可在预仿真期间使用以考虑寄生元件。 例如,可以使用诸如通道长度的指定参数来获得指定离散器件的一个或多个寄生元件的预测值的一组RC值。 可以使用一组RC值将离散器件建模为宏器件。 以这种方式,可以在预仿真期间使用宏器件来考虑分立器件的寄生元件的寄生效应。
    • 9. 发明申请
    • DISCRETE DEVICE MODELING
    • 离散装置建模
    • US20140007028A1
    • 2014-01-02
    • US13534526
    • 2012-06-27
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • G06F17/50
    • G06F17/5036
    • Among other things, one or more techniques and/or systems are provided for modeling a discrete device as a macro device. That is, the discrete device can comprise one or more parasitic elements, such as parasitic resistances and/or capacitances. Because values of the parasitic elements are unknown during pre-simulation of the discrete device, the discrete device can be modeled as a macro device, which can be used during pre-simulation to take into account the parasitic elements. For example, specified parameters, such as channel length, can be used to obtain a set of RC values that specify predicted values for the one or more parasitic elements of the discrete device. The discrete device can be modeled as the macro device using the set of RC values. In this way, the macro device can be used during pre-simulation to take into account the parasitic effects of parasitic elements of the discrete device.
    • 除其他之外,提供一个或多个技术和/或系统用于将分立设备建模为宏设备。 也就是说,分立器件可以包括一个或多个寄生元件,例如寄生电阻和/或电容。 由于寄生元件的值在分立器件的预仿真期间是未知的,所以可将分立器件建模为宏器件,可在预仿真期间使用以考虑寄生元件。 例如,可以使用诸如通道长度的指定参数来获得指定离散器件的一个或多个寄生元件的预测值的一组RC值。 可以使用一组RC值将离散器件建模为宏器件。 以这种方式,可以在预仿真期间使用宏器件来考虑分立器件的寄生元件的寄生效应。
    • 10. 发明授权
    • Antenna element, feed probe; dielectric spacer, antenna and method of communicating with a plurality of devices
    • 天线元件,进料探头; 电介质间隔物,天线以及与多个装置通信的方法
    • US07283101B2
    • 2007-10-16
    • US10703331
    • 2003-11-07
    • Peter John BisiulesChing-Shun Yang
    • Peter John BisiulesChing-Shun Yang
    • H01Q21/00
    • H01Q1/246H01Q9/0414H01Q9/0457H01Q9/0464H01Q21/28
    • A multiband base station antenna for communicating with a plurality of terrestrial mobile devices is described. The antenna including one or modules, each module including a low frequency ring element; and a high frequency dipole element superposed with the low frequency ring element. The element includes a ground plane; and a feed probe directed away from the ground plane and having a coupling part positioned proximate to the ring to enable the feed probe to electromagnetically couple with the ring. A dielectric clip provides a spacer between the feed probe and the ring, and also connects the ring to the ground plane. An antenna element is also described including a ring, and one or more feed probes extending from the ring, wherein the ring and feed probe(s) are formed from a unitary piece.
    • 描述了用于与多个地面移动设备进行通信的多频带基站天线。 所述天线包括一个或多个模块,每个模块包括低频环形元件; 以及与低频环形元件重叠的高频偶极子元件。 元件包括接地平面; 以及馈送探针,其远离接地平面并且具有靠近环定位的耦合部分,以使馈电探针与环电磁耦合。 电介质夹在馈电探针和环之间提供间隔物,并将环连接到接地平面。 还描述了一种天线元件,其包括环和从环延伸的一个或多个馈送探针,其中环和馈送探针由整体构成。